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TRIA HMM-QCSX

Qualcomm Snapdragon® X Elite

The TRIA HMM-QCSX COM-HPC Mini module is based on the Qualcomm Snapdragon® X Elite processor. This highly energy-efficient processor offers best-in-class performance per watt, making it the ideal platform for applications that require outstanding performance with low power consumption and minimal cooling measures. It combines the Qualcomm Oryon™ CPU with up to twelve cores, the Adreno™ GPU driving excellent graphics throughput, and the Hexagon™ NPU accelerating AI applications with up to 45 TOPS.

With its small formfactor and rich IO interfaces, the module is best suited for automation, robotics, autonomous vehicles, medical devices and other system installations that require the highest performance in the smallest space. Up to sixty-four GB main memory based on fast LPDDR5X technology, sixteen PCI Express lanes, multiple graphics outputs, USB ports and two network interfaces give system architects a lot of design flexibility.

System investments are well protected through long-term availability of the module, designed and manufactured by Tria Technologies. In addition, the COM-HPC Mini standard enables performance scaling and migrating applications to future technology upgrades when they become available.

Highlights

  • Qualcomm Snapdragon® X Elite processor
  • Scalable CPU performance, up to twelve cores
  • Powerful Qualcomm® Adreno™ GPU
  • Qualcomm® Hexagon™ NPU with 45 TOPS of AI performance
  • LPDDR5X main memory, memory-down, up to 64GB
  • Embedded DisplayPort interface
  • Up to two DisplayPort interfaces (DDI or USB4)
  • PCI Express® Gen 4, up to 1×8 + 1×4/2×2
  • PCI Express® Gen 3, 2×1 + 1×2/1×1
  • Up to two USB4, four USB 3.2 Gen1/2 and eight USB 2.0 ports
  • Two UARTs
  • Up to 1TB on-board UFS Flash
  • Two 1 / 2.5 Gb Ethernet port, TSN support
  • Trusted Platform Module TPM 2.0
  • Space saving COM-HPC Mini
  • Long-term product availability

Specs

Technology Arm
Formfactor / Interface COM-HPC Mini
CPU Qualcomm Snapdragon® X Elite
X1E-84-100, 12C, 4.2GHz
X1E-80-100, 12C, 4.0GHz
X1E-78-100, 12C, 3.4GHz
Qualcomm Snapdragon® X Plus
X1P-66-100, 10C, 4.0GHz
X1P-64-100, 10C, 3.4GHz
X1P-46-100, 8C, 4.0GHz
X1P-42-100, 8C, 3.4GHz
Qualcomm Snapdragon® X
X1-26-100, 8C, 2.7GHz
Chipset Integrated into SoC
RAM LPDDR5X memory, memory-down
Capacity options: 8GB, 16GB, 32GB, 64GBB
Flash Up to 1TB UFS, soldered (optional)
Storage Interfaces UFS (onboard)
NVME at PCI Express (carrier design dependent)
USB Up to two USB4 on COM-HPC SS Lane 2, 3 (mutually exclusive with DD1) and Lane 4, 5 (mutually
exclusive with USB3 #2, #3)
Two USB 3.2 Gen 2x1 on COM-HPC SS Lane 6, 7 (USB3 #0, #1)
Up to two USB 3.2 Gen 2x1 on COM-HPC SS Lane 4, 5 (mutually exclusive with USB4 #1
8x USB 2.0 on COM-HPC USB[0:7]
Note: supported interfaces depending on COM-HPC carrier design. Config 3 on request
Serial Interfaces 2x UART
Bus Interfaces PCI Express® Gen 4, up to 1x8/(1x4) ¹ + 1x4/2x2
PCI Express® Gen 3, 2x1 + 1x2/1x1
¹ SKU dependent
Display Controller Adreno™ GPU, up to 1.5GHz
Display Interfaces Supports COM-HPC Mini Config 1, 2
Up to two DisplayPort interfaces (DDI), DP 1.4b, Config 1
Up to two USB4/USB-C ports (DP tunneling), 1x USB4 with Config 2
1x Embedded DisplayPort 1.4b
Note: supported interfaces depending on COM-HPC carrier design. Config 3 on request
Network Interface 2x 10/100/1000Base-TX, 2.5G² based on Qualcomm QPS615, with TSN support
² Available bandwidths depending on carrier design
Audio Interface SoundWire
Security Device TPM 2.0
Miscellaneous Watchdog Timer:
Initiates system reset, programmable
Fan Supply:
4-pin header for CPU fan, PWM speed controlled
and PWM speed control for system fan supported
RTC battery:
external
System Monitoring:
voltage, temperature, CPU fan, system fan
Firmware UEFI boot
OS Support Windows 11 IoT
Yocto Linux
Ubuntu Linux (on request)
Android (on request)
Power Requirement Voltage:
+8.5V to +18V, +5V Stby optional
Power Consumption:
tbd
Environment Ambient Temperature:
0° … 60°C (operating)
-25° … 85°C (storage)
Humidity:
5 … 95% (operating, non-condensing),
5 … 95% (storage, non-condensing)
Dimensions 95mm x 70mm
Certificates UL / CE

Order Info

Order No. Description Reference Status
tbd Contact Tria for ordering information MSC HMM-QCSX- xxxxx OR

PV = Preferred variant; OR = on Request (in OEM quantities only)

Accessories

Carrier Options

Order No. Description Reference
tbd COM-HPC Mini Carrier Board MSC HM-MB-EV BRDFTX

Cooling Options

Order No. Description Reference
tbd Contact Tria for ordering information MSC HMM-QCSX-Hxxxx

Support

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