For COM-HPC®, new mezzanine connectors are employed which warrant superior signal transmission characteristics for ultra-high-speed interfaces such as PCIe Gen 5, USB 3.2 and 100GbE.
Two types of COM-HPC® interface schemes are specified to serve different classes of applications. COM-HPC® Server enables an extended bulk of PCIe lanes and Ethernet ports and is well suited for server and communications applications requiring very high system throughput and extensive I/O connectivity. COM-HPC® Client focuses on graphics oriented tasks such as in gaming, medical or surveillance applications, and comes with a variety of graphics interface options, while still providing decent I/O connectivity on PCIe and network. To span a wide range of applications and meet different performance classes a variety of module form factors are available.
Three formats are primarily intended for COM-HPC® Client computer modules:
Size A: 95 x 120 mm
Size B: 120 x 120 mm
Size C: 160 x 120 mm
For COM-HPC® Server modules, two form factors have been defined:
Size D: 160 x 160 mm
Size E: 200 x 160 mm
The larger base width as well as length of COM-HPC® Server module formats reflects the floor space requirements of powerful server and communication systems for CPU size and cooling requirements, number of memory module slots and potential need for H/W accelerators (FPGAs, GPUs). The smaller form factors with narrow base are intended for leaner systems e.g. such as featuring cost effective system-on-chip.
Depending or application needs, carrier solutions can be designed either to the Server or Client interface specification and will support either the larger or narrow module sizes.