Intel® Core™ 12th Generation

The MSC HCA-ALP COM-HPC Client module features the 12th Gen Intel® Core™ processor, giving application designers a great variety of choices of power efficient and performance-focused compute solutions. Offering a great scalability of performance the module is ideal for compute intense applications in instrumentation, high-end medical equipment, transportation, video surveillance and gaming. The new Intel® performance hybrid architecture combines Performance-cores and Efficient-cores with the Intel® Thread Director providing intelligent workload optimization. The architecture scales up to fourteen cores and twenty threads at 45/35W thermal design power (TDP). Applications requiring lower power dissipation can be operated with selected processor variants at 12W TDP.

For highest data throughput the module enables fast DDR5-4800 memory technology. Up to two SO-DIMMs can be installed for a total memory capacity from eight to sixty-four GB. I/O located on COM-HPC carrier designs can be connected to the module via up to eight PCIe Gen 3 lanes, up to eight PCIe Gen 4 lanes and an optional eight lane PEG port capable of PCIe Gen 4. The two Ethernet interfaces provide up to 2.5GbE bandwidth each based on the Intel i225/226 network controller. Further high-speed I/O can utilize USB ports featuring USB4 and USB 3.2.

System investments are well protected through long-term availability of the module, designed, and manufactured by Avnet Embedded. In addition, the COM-HPC standard enables performance scaling and migrating applications to future technology upgrades when they become available.


  • COM-HPC Client module, Size A
  • 12th Gen Intel® Core™ processors
  • Scalable CPU performance
  • Up to fourteen cores, twenty threads
  • Up to 64GB DDR5-4800 SDRAM, dual channel
  • Intel® Iris® Xe architecture Graphics, up to 96 EUs
  • Three DisplayPort/HDMI interfaces
  • Embedded DisplayPort interface
  • Up to four independent displays
  • PCI Express® Gen 3, up to 8×1 lanes, PCI Express® Gen 4, up to 2×4
  • PEG 1×8, PCIe Gen 4 (optional)
  • Two USB4, two USB 3.2 Gen2, eight USB 2.0 ports
  • Two UARTs
  • Optional on-board NVMe SSD, up to 1TB
  • Optional two SATA 6Gb/s mass storage interfaces
  • Two 1 / 2.5 Gb Ethernet ports (Intel® i225/226)
  • Trusted Platform Module TPM 2.0
  • Long-term product availability


Technology x86
Formfactor COM-HPC Size A
CPU 12th Gen Intel® Core™ processors
codename Alder Lake H-series
Intel® Core™ i7-12800HE 14C/20T, 2.4GHz, 96 EUs, 24MB L3, 45/35W cTDP
Intel® Core™ i5-12600HE 12C/16T, 2.5GHz, 80 EUs, 18MB L3, 45/35W cTDP
Intel® Core™ i3-12300HE 8C/12T, 1.9GHz, 48 EUs, 12MB L3, 45/35W cTDP
codename Alder Lake P-series
Intel® Core™ i7-1270PE 14C/20T, 1.8GHz, 96 EUs, 24MB L3, 28/20W cTDP
Intel® Core™ i5-1250PE 12C/16T, 1.7GHz, 80 EUs, 12MB L3, 28/20W cTDP
Intel® Core™ i3-1220PE 8C/12T, 1.5GHz, 48 EUs, 12MB L3, 28/20W cTDP
codename Alder Lake U-series
Intel® Core™ i7-1265UE 10C/12T, 2.6GHz, 96 EUs, 12MB L3, 28/15/12W cTDP
Intel® Core™ i5-1245UE 10C/12T, 2.5GHz, 80 EUs, 12MB L3, 28/15/12W cTDP
Intel® Core™ i3-1215UE 6C/8T, 2.5GHz, 64 EUs, 10MB L3, 28/15/12W cTDP
Intel® Celeron® 7305E 5C/6T, 1.0GHz, 48 EUs, 8MB L3, 15/12W cTDP

Note: base frequency at highest TDP shown, other clock frequencies supported
Chipset Integrated into SoC
RAM 2x 262-pin SO-DIMM socket for up to 2x 32GB DDR5 SDRAM (DDR5-4800); dual channel operation; minimum capacity 1x 8GB single channel operation
Storage Interfaces 2x SATA channels (up to 6Gb/s), optional optional on-board NVMe, 64GB to 1TB
2x USB 3.2 (Gen 1 & 2)
8x USB 2.0
Serial Interfaces 2x high-speed serial ports
Bus Interfaces PCI Express® Graphics (PEG) 1x8, PCIe Gen 4¹
PCI Express® Gen 4, up to 2x4
PCI Express® Gen 3, up to 8x1, flexible bifurcation options
¹ Available on Alder Lake H-series
Display Controller Intel® Iris® Xe architecture Graphics, Up to 96 execution units (EU) H.264/AVC, H.265/HEVC, AV1, MJPEG encode/decode/transcode.
Display Interfaces Four independent displays supported
3x Digital Display Interface (DP 1.4a, HDMI 2.0b)
1x Embedded DisplayPort 1.4b
Network Interface Two 10/100/1000Base-TX, 2.5G² based on Intel i225/226
² Available bandwidths depending on carrier design
Audio Interface High Definition Audio
Security Device TPM 2.0
Miscellaneous Watchdog Timer:
Initiates system reset, programmable

Fan Supply:
4-pin header for CPU fan, PWM speed controlled
and PWM speed control for system fan supported

RTC battery:

System Monitoring:
voltage, temperature, CPU fan, system fan
Feature Highlights COM-HPC Client, Size A
Firmware UEFI Firmware:
AMI Aptio® V

TPM 2.0 support, TCG compliant

Power Management:
Active fan control

USB legacy support (keyboard, mouse, storage)

System Monitoring
Health Monitoring

MSC Adv. Boot Device Selection:
Boot device priority setting based on physical interfaces
OS Support Windows 10 IoT Enterprise 2021 LTSC
BSP for Linux (Yocto)
Power Requirement Voltage:
+8V to +20V, +5V Stby optional, +3V RTC voltage

Power Consumption:
tbd W to tbd W (typ.)
Environment Ambient Temperature:
0° … 60°C (operating)
-25° … 85°C (storage)

5 … 95% (operating, non-condensing),
5 … 95% (storage, non-condensing)
Dimensions 120 x 95
Certificates UL / CE

Order Info

Order No. Description Reference Status

PV = Preferred variant; OR = on Request (in OEM quantities only)


Copyright ©2021 Avnet, Inc. All rights reserved.