MSC HSD-ILDL

Intel® Xeon® D-1700 Processor

The MSC HSD-ILDL COM-HPC Server module hosts the Intel® Xeon® D-1700 processor and delivers server class performance on embedded form factor. The processor is a fully integrated System on Chip (SoC) combining up to ten Xeon cores, memory controller, high bandwidth network and multiple PCIe root complexes on a single socket.

The on-chip network controller facilitates up to eight Ethernet ports with different configuration options ranging from 1G to 25G per port and an aggregated throughput of up to 100G. An additional Ethernet port based on Intel® i225 provides 1GbE/2.5GbE bandwidth and TSN capability for real-time applications. An extensive set of PCI Express lanes with Gen 4 and Gen 3 support allow for connecting external HW accelerators, FPGAs, storage and IO devices.

The user can scale memory capacity from 8GB to 256GB based on registered DIMMs (RDIMM) or unbuffered DIMMs (UDIMM). Machine robustness can be extended by enabling error correction code (ECC) and utilizing RDIMM or ECC UDIMM. Selected variants of the MSC HSD-ILDL can be operated at extended temperature range with true 24/7 utilization. This supports system designs exposed to harsh environmental conditions that require a reliable compute engine.

System investments are well protected through long-term availability of the module. In addition, the COM-HPC standard enables performance scaling and migrating applications to future technology upgrades when they become available.

Highlights

  • COM-HPC Server module
  • Ideal for IoT, AI/deep learning, edge
    computing, HPC, workload consolidation
  • Intel® Xeon® D-1700 processor
  • Server class multi-core system on chip (SoC)
  • Up to 10 cores
  • Up to 256GB DDR4 memory, RDIMM/UDIMM
  • Optional ECC memory protection
  • Extensive I/O including PCI Express® and
    multiple Ethernet connections
  • Sixteen PCIe Gen 4 and sixteen PCIe Gen 3 lanes
  • Up to eight integrated Ethernet ports, max. 25G
  • Maximum 100G aggregated Ethernet throughput
  • Dedicated 1G / 2.5G Gb Ethernet port with TSN
    capability (Intel® i225)
  • Two SATA 6Gb/s mass storage interfaces
  • 2x USB 3.2 Gen 2, 2x USB 3.2 Gen 1, 4x USB 2.0
  • 12x GPIO, 2x serial UART ports
  • Trusted Platform Module TPM 2.0
  • On-board mass storage (optional eMMC)
  • Industrial temperature range and 24/7 operation
  • Long-term product availability

Specs

Technology x86
Formfactor COM HPC Size D
CPU Intel Xeon D-1746TER, ten-core, 2.0GHz, 67W TDP, 8 Eth ports, 100G,
DDR4-2667, I-temp
Intel Xeon D-1735TR, eight-core, 2.2GHz, 59W TDP, 8 Eth ports, 50G, DDR4-2933,
C-temp
Intel Xeon D-1732TE, eight-core, 1.9GHz, 52W TDP, 8 Eth ports, 50G, DDR4-2667,
I-temp
Intel Xeon D-1715TER, four-core, 2.4GHz, 50W TDP, 8 Eth ports, 50G, DDR4-2667,
I-temp
Intel Xeon D-1712TR, four-core, 2.0GHz, 40W TDP, 8 Eth ports, 50G, DDR4-2400,
C-temp

Note: 100/50G is the recommended network throughput a device should not exceed. See the product manual for details.
Chipset SoC
RAM Up to 256GB DDR4, 4x 288pin DIMM, 2 channels, 2 DIMMs per channel
RDIMM population, 1DPC/2DPC, max. DDR4-2933, ECC, max. 64GB per DIMM
UDIMM population, 1DPC, max. DDR4-2933, optional ECC, max. 32GB per DIMM
UDIMM population, 2DPC, max. DDR4-2666, optional ECC, max. 32GB per DIMM

Note: maximum supported speed grades also depending on selected processor variant
Flash optional eMMC, max. 265GB
Storage Interfaces 2x SATA 6Gb/s
USB 2x USB 3.2 Gen 2 (10Gbps), connected with COM-HPC USB[0:1]_SST/RX[0:1]
2x USB 3.2 Gen 1 (5Gbps), connected with COM-HPC USB[2:3]_SST/RX
4x USB 2.0 connected with USB[0:3]
Serial Interfaces 2x UART
Bus Interfaces 16x PCI Express Gen 4, bifurcation x16, x8, x4, max. 4 root ports, NTB x16, x8,
connected with COM-HPC PCIe[16:31]

16x PCI Express Gen 3, bifurcation x8, x4, x2, max. 8 root ports, connected with
COM-HPC PCIe[0:15]

1x PCI Express Gen3 for optional BMC on carrier, connected with PCIe_BMC
Network Interface 1x 1000BASE-T / 2.5GBASE-T, TSN, connected with COM-HPC NBASET0
I-Temp variants: Intel® i225-IT
C-Temp variants: Intel® i225-LM

8x configurable Ethernet ports (SoC), connected with COM-HPC ETH[0:7]
Configuration options (mutually exclusive):
4x 25G
2x 25G
8x 10G
4x 10G
4x 10G & 4x 2.5G

Highest possible bandwidths shown, lower speeds are supported.
25G-> 10G/2.5G/1G/100M
10G-> 2.5G/1G/100M

Supported configurations, maximum throughput and number of Ethernet interfaces
depending on processor variant. The COM-HPC carrier design determines capabilities of
the physical interfaces.
Security Device Infineon Trusted Platform Module 2.0
Miscellaneous Watchdog Timer:
Initiates system reset, programmable
Fan Supply:
4-pin header for CPU fan, PWM speed controlled
and PWM speed control for system fan supported
RTC battery: external
System Monitoring:
voltage, temperature, CPU fan, system fan
Feature Highlights PICMG COM-HPC Server interface
Firmware UEFI Firmware:
AMI Aptio® V
Security:
TPM 2.0 support, TCG compliant
Power Management:
ACPI
Active fan control
USB:
USB legacy support (keyboard, mouse, storage)
Monitoring:
System Monitoring
Health Monitoring
MSC Adv. Boot Device Selection:
Boot device priority setting based on physical interfaces
OS Support Microsoft Windows 10 IoT Enterprise
BSP for Linux (Yocto)
EAPI (HW Programming Interface)
Power Requirement Voltage:
+12V, Stby optional
Power Consumption:
tbd
Environment Ambient Temperature;
0° … 60°C (operating)
-25° … 85°C (storage)
Extended temp. variants: -40 ... +85°C (operating)
Humidity:
5 … 95% (operating, non-condensing),
5 … 95% (storage, non-condensing)
Dimensions 160mm x 160mm (Height depending on cooling solution)
Certificates UL / CE
Cooling Heat sink and heat spreader options

Order Info

Order No. Description Reference Status
tbd COM-HPC Server D module (160mm x 160mm); CPU: Xeon D-1746TER, ten-core, 2.0GHz, 67W TDP; Ethernet: 1x 1G/2.5G, 8 Ports, 100G BW; 2x SATA, 4x USB3.0, 4x USB2.0; 16x PCIe Gen 4, 16x PCIe Gen 3; 4x socket for DDR4-2667 RDIMM/UDIMM; TPM 2.0; -40...+85°C MSC HSD-ILDL-1746TER-NN101I PCBFTX OR
tbd COM-HPC Server D module (160mm x 160mm); CPU: Xeon D-1746TER, ten-core, 2.0GHz, 67W TDP; Ethernet: 1x 1G/2.5G, 8 Ports, 100G BW; eMMC 64GB; 2x SATA, 4x USB3.0, 4x USB2.0; 16x PCIe Gen 4, 16x PCIe Gen 3; 4x socket for DDR4-2667 RDIMM/UDIMM; TPM 2.0; -40...+85°C MSC HSD-ILDL-1746TER-N6101I PCBFTX OR
tbd COM-HPC Server D module (160mm x 160mm); CPU: Xeon D-1735TR, eight-core, 2.2GHz, 59W TDP; Ethernet: 1x 1G/2.5G, 8 Ports, 50G BW; 2x SATA, 4x USB3.0, 4x USB2.0; 16x PCIe Gen 4, 16x PCIe Gen 3; 4x socket for DDR4-2933 RDIMM/UDIMM; TPM 2.0; MSC HSD-ILDL-1735TR-NN101C PCBFTX OR
tbd COM-HPC Server D module (160mm x 160mm); CPU: Xeon D-1735TR, eight-core, 2.2GHz, 59W TDP; Ethernet: 1x 1G/2.5G, 8 Ports, 50G BW; eMMC 64GB; 2x SATA, 4x USB3.0, 4x USB2.0; 16x PCIe Gen 4, 16x PCIe Gen 3; 4x socket for DDR4-2933 RDIMM/UDIMM; TPM 2.0; MSC HSD-ILDL-1735TR-N6101C PCBFTX OR
tbd COM-HPC Server D module (160mm x 160mm); CPU: Xeon D-1732TE, eight-core, 1.9GHz, 52W TDP; Ethernet: 1x 1G/2.5G, 8 Ports, 50G BW; 2x SATA, 4x USB3.0, 4x USB2.0; 16x PCIe Gen 4, 16x PCIe Gen 3; 4x socket for DDR4-2667 RDIMM/UDIMM; TPM 2.0; -40...+85°C MSC HSD-ILDL-1732TE-NN101I PCBFTX OR
tbd COM-HPC Server D module (160mm x 160mm); CPU: Xeon D-1715TER, four-core, 2.4GHz, 50W TDP; Ethernet: 1x 1G/2.5G, 8 Ports, 50G BW; 2x SATA, 4x USB3.0, 4x USB2.0; 16x PCIe Gen 4, 16x PCIe Gen 3; 4x socket for DDR4-2667 RDIMM/UDIMM; TPM 2.0; -40...+85°C MSC HSD-ILDL-1715TER-NN101I PCBFTX OR
tbd COM-HPC Server D module (160mm x 160mm); CPU: Xeon D-1712TR, four-core, 2.0GHz, 40W TDP; Ethernet: 1x 1G/2.5G, 8 Ports, 50G BW; 2x SATA, 4x USB3.0, 4x USB2.0; 16x PCIe Gen 4, 16x PCIe Gen 3; 4x socket for DDR4-2400 RDIMM/UDIMM; TPM 2.0; MSC HSD-ILDL-1712TR-NN101C PCBFTX OR

PV = Preferred variant; OR = on Request (in OEM quantities only)

Accessories

Cable Options

Order No. Description Reference
91792 25 Gbit Ethernet SPF28 direct attach copper cable, SFP to SFP, 1m length CAB ETHERNET SFP-M SFP-M 1m BK SPF28
91793 25 Gbit Ethernet SPF28 direct attach copper cable, SFP to SFP, 2m length CAB ETHERNET SFP-M SFP-M 2m BK SPF28
91794 25 Gbit Ethernet SPF28 direct attach copper cable, SFP to SFP, 3m length CAB ETHERNET SFP-M SFP-M 3m BK SPF28

Carrier Options

Order No. Description Reference
tbd COM-HPC Server Evaluation Carrier Board PCI Express 2x x4, 2x x8 and 1x x16 slots; 2x M.2 PCIe x4, USB 3.2/3.1, 2x SATA; 4x 25/10G ETH, 2x 10G ETH, 1x 1/2.5G ETH; POST code display, ATX power connector; Dimensions: 305 x 244 mm (ATX form factor) MSC HS-MB-EV-001 PCBFTX
tbd Starter kit for COM-HPC Server modules with Intel Xeon D-1700 processor. Consists of the MSC HS-MB-EV ATX platform board, heat sink with fan, two 4GB memory modules and power supply with cable kit. MSC HS-SK-ILDL-EV-KIT001

Memory Options

Order No. Description Reference
92389 32GB RDIMM, DDR4-2933, 2Gx8 based, sorting wide Temp MOD RDIMM DDR4 32GB PC4-23466 CL21 2B
92390 64GB RDIMM, DDR4-2933, 4Gx8 based MOD RDIMM DDR4 64GB PC4-23466 CL21 2B
92604 8GB RDIMM, DDR4-2933, 512x8 based, sorting wide Temp MOD RDIMM DDR4 8GB PC4-23466 CL21 4B
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