| Technology |
x86 |
| Formfactor |
COM HPC Size D
|
| CPU |
Intel Xeon D-1746TER, ten-core, 2.0GHz, 67W TDP, 8 Eth ports, 100G,
DDR4-2667, I-temp
Intel Xeon D-1735TR, eight-core, 2.2GHz, 59W TDP, 8 Eth ports, 50G, DDR4-2933,
C-temp
Intel Xeon D-1732TE, eight-core, 1.9GHz, 52W TDP, 8 Eth ports, 50G, DDR4-2667,
I-temp
Intel Xeon D-1715TER, four-core, 2.4GHz, 50W TDP, 8 Eth ports, 50G, DDR4-2667,
I-temp
Intel Xeon D-1712TR, four-core, 2.0GHz, 40W TDP, 8 Eth ports, 50G, DDR4-2400,
C-temp
Note: 100/50G is the recommended network throughput a device should not exceed.
See the product manual for details. |
| Chipset |
SoC |
| RAM |
Up to 256GB DDR4, 4x 288pin DIMM, 2 channels, 2 DIMMs per channel
RDIMM population, 1DPC/2DPC, max. DDR4-2933, ECC, max. 64GB per DIMM
UDIMM population, 1DPC, max. DDR4-2933, optional ECC, max. 32GB per DIMM
UDIMM population, 2DPC, max. DDR4-2666, optional ECC, max. 32GB per DIMM
Note: maximum supported speed grades also depending on selected processor variant |
| Flash |
optional eMMC, max. 265GB |
| Storage Interfaces |
2x SATA 6Gb/s |
| USB |
4x USB 3.2 Gen 1 (5Gbps), connected with COM-HPC USB[0:3]_SSTX/RX
4x USB 2.0 connected with USB[0:3] |
| Serial Interfaces |
2x UART |
| Bus Interfaces |
16x PCI Express Gen 4, bifurcation x16, x8, x4, max. 4 root ports, NTB x16, x8,
connected with COM-HPC PCIe[16:31]
16x PCI Express Gen 3, bifurcation x8, x4, x2, max. 8 root ports, connected with
COM-HPC PCIe[0:15]
1x PCI Express Gen3 for optional BMC on carrier, connected with PCIe_BMC |
| Network Interface |
1x 1000BASE-T / 2.5GBASE-T, TSN, connected with COM-HPC NBASET0
I-Temp variants: Intel® i225-IT
C-Temp variants: Intel® i225-LM
8x configurable Ethernet ports (SoC), connected with COM-HPC ETH[0:7]
Configuration options (mutually exclusive):
4x 25G
2x 25G
8x 10G
4x 10G
4x 10G & 4x 2.5G
Highest possible bandwidths shown, lower speeds are supported.
25G-> 10G/2.5G/1G/100M
10G-> 2.5G/1G/100M
Supported configurations, maximum throughput and number of Ethernet interfaces
depending on processor variant. The COM-HPC carrier design determines capabilities of
the physical interfaces. |
| Security Device |
Infineon Trusted Platform Module 2.0 |
| Miscellaneous |
Watchdog Timer:
Initiates system reset, programmable
Fan Supply:
4-pin header for CPU fan, PWM speed controlled
and PWM speed control for system fan supported
RTC battery: external
System Monitoring:
voltage, temperature, CPU fan, system fan
|
| Feature Highlights |
PICMG COM-HPC Server interface |
| Firmware |
UEFI Firmware:
AMI Aptio® V
Security:
TPM 2.0 support, TCG compliant
Power Management:
ACPI
Active fan control
USB:
USB legacy support (keyboard, mouse, storage)
Monitoring:
System Monitoring
Health Monitoring
MSC Adv. Boot Device Selection:
Boot device priority setting based on physical interfaces |
| OS Support |
Microsoft Windows 10 IoT Enterprise
BSP for Linux (Yocto)
EAPI (HW Programming Interface) |
| Power Requirement |
Voltage:
+12V +/-5%
+5V Stby +/-5% (optional)
Power Consumption:
40W to 89W (typ.) |
| Environment |
Ambient Temperature;
0° … 60°C (operating)
-25° … 85°C (storage)
Extended temp. variants: -40 ... +85°C°C* (operating)
*Maximum operating temperatures may be lower depending on product variants, cooling
design, operational and environmental conditions. See the product documentation for
detailed specification of maximum operating temperatures and conditions.
Humidity:
5 … 95% (operating, non-condensing),
5 … 95% (storage, non-condensing)
|
| Dimensions |
160mm x 160mm (Height depending on cooling solution) |
| Certificates |
UL / CE |
| Cooling |
Heat sink and heat spreader options |
