MSC C6C-RYZ2

AMD Ryzen™ Embedded
R2000 Series

The MSC C6C-RYZ2 module is the embedded platform for the AMD RyzenTM Embedded R2000 processor family. This versatile system-on-chip (SoC) technology combines processing, graphics and I/O functionality on a single die, allowing for outstanding compute performance in environments with constrained real-estate, power and cooling. Customers can choose from a variety of quad and dual-core processors to scale performance and capabilities according to application requirements.

The board provides up to four independent display support with up to 4k x 2k resolution, highest level graphics acceleration and hardware based video en-/decoding. Fast DDR4 memory and multiple USB 3.2/2.0 interfaces complete the compact and power saving module.

The MSC C6C-RYZ2 offers hardware based security compliant to the requirements of TCG (Trusted Computing Group) and features TPM 2.0 capability.

The Type 6 pin-out allows direct access to the latest digital display interfaces like DisplayPort, HDMI 2.0b and DVI as well as up to four USB 3.2 interfaces.

Highlights

AMD RyzenTM Embedded R2544, quad-core Processor (3.35/3.7GHz, 8 GPU CU, 35-54W TDP)
AMD RyzenTM Embedded R2514, quad-core Processor (2.1/3.7GHz, 8 GPU CU, 12-35W TDP)
AMD RyzenTM Embedded R2314, quad-core Processor (2.1/3.5GHz, 6 GPU CU, 12-35W TDP)
AMD RyzenTM Embedded R2312, dual-core Processor (2.7/3.5GHz, 3 GPU CU, 12-25W TDP)
Up to 32 GB DDR4-3200 SDRAM, dual-channel, optional ECC
Two SATA 6Gb/s mass storage interfaces
Three DisplayPort/HDMI/DVI interfaces

Embedded DisplayPort / LVDS (24 Bit, dual channel) interface
Up to four independent displays supported
OpenGL 4.6, OpenCL
Resolution up to 4096 x 2160
Up to four USB 3.2/2.0 and four USB 2.0 interfaces
Up to eight PCI Express™ x1 lanes
PEG configurable up to 1×8 or 2×4
Trusted Platform Module TPM 2.0
UEFI Firmware

Specs

Technology	x86
Formfactor	COM Express Compact
CPU	AMD RyzenTM Embedded R2544, quad-core Processor, 3.35/3.7GHz, 2MB L2 / 4MB L3, 8 GPU CU, 45W (35-54W) TDP, max. DDR4-3200; AMD RyzenTM Embedded R2514, quad-core Processor, 2.1/3.7GHz, 2MB L2 / 4MB L3, 8 GPU CU, 15W (35-12W) TDP, max. DDR4-2667; AMD RyzenTM Embedded R2314, quad-core Processor, 2.1/3.5GHz, 2MB L2 / 4MB L3, 6 GPU CU, 15W (12-35W) TDP, max. DDR4-2667; AMD RyzenTM Embedded R2312, dual-core Processor, 2.7/3.5GHz, 1MB L2 / 4MB L3, 3 GPU CU, 15W (12-25W) TDP, max. DDR4-2400;
Chipset	Integrated in System-on-Chip
RAM	2x 260-pin SO-DIMM socket for up to 2x 16 GB DDR4 SDRAM (DDR4-3200 max); ECC option; dual channel operation Note: maximum DDR4 bandwidth depending on processor variant and assembled memory module type
Storage Interfaces	2x SATA 6Gb/s
USB	Up to 4x USB 3.2 Gen 1 / USB 2.0 4x USB 2.0 Note: Supported number of ports depending on board assembly
Serial Interfaces	2x serial ports
Bus Interfaces	PEG port max x8 (depending on processor variant) Up to four PCI Express x1 Gen3, up to four x1 Gen 2 (depending on processor and assembly variant) LPC bus (Low Pin Count bus)
Display Controller	AMD Radeon Graphics, up to 8 CUs Up to four independent displays supported (depending on processor variant)
Display Interfaces	Display Port and HDMI/DVI: Up to 3x Digital Display Interface, usable as DisplayPort 1.4 (up to 3840 x 2160 @ 60Hz)¹, also usable as HDMI 2.0b (4096 x 2160 @ 60Hz)¹ or DVI (up to 1920 x 1200 @ 60Hz) ¹ Re-timer required for operation above 3Gb/s 1x Embedded DisplayPort 1.3 (on variants without LVDS only); 3840 x 2160 @ 60Hz LCD: LVDS 24bit, dual-channel (not on all variants); 1920 x 1200 @ 60Hz
Network Interface	10/100/1000Base-TX (Intel i210)
Audio Interface	High Definition Audio
Security Device	TPM 2.0 (optional)
Miscellaneous	Watchdog Timer: Initiates system reset, programmable Fan Supply: 4-pin header for CPU fan, PWM speed controlled and PWM speed control for system fan supported RTC battery: external System Monitoring: voltage, temperature, CPU fan, system fan
Feature Highlights	Type 6 pin-out
Firmware	UEFI Firmware: AMI Aptio® V Security: TPM 2.0 support, TCG compliant Power Management: ACPI Active fan control USB: USB legacy support (keyboard, mouse, storage) Monitoring: System Monitoring Health Monitoring MSC Adv. Boot Device Selection: Boot device priority setting based on physical interfaces
OS Support	Windows 10 21H2 LTSC Windows 11 21H2 GAC Linux, Yocto
Power Requirement	Voltage: +12V primary power supply input, +5V Stby optional Power Consumption: 28 W to 64 W (typ., variant dependent)
Environment	Ambient Temperature; 0° … 60°C (operating), -25° … 85°C (storage) Humidity: 5 … 95% (operating, non-condensing), 5 … 95% (storage, non-condensing)
Dimensions	95mm x 95mm
Certificates	UL / CE
Cooling	Passive heat sink Active heat sink with fan Heat spreader with threaded or non-threaded standoffs
Carrier	Small carrier board (Mini-ITX) as part of a starter kit Evaluation board in ATX form factor

Order Info

Order No.	Description	Reference	Status
113799	COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen R2544, four-core, 3.35/3.7GHz, 35-54W TDP, 8 CU ; 3x DP/HDMI/DVI, LVDS (24 Bit, dual channel); 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; 4x PCIe Gen 3, 4x PCIe Gen 2, PEG x8 Gen 3; TPM 2.0; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-3200; 0° … 60°C	MSC C6C-RYZ2-R2544-NN221C PCBFTX	PV
113797	COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen R2514, four-core, 2.1/3.7GHz, 12-35W TDP, 8 CU ; 3x DP/HDMI/DVI, LVDS (24 Bit, dual channel); 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; 4x PCIe Gen 3, 4x PCIe Gen 2, PEG x8 Gen 3; TPM 2.0; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-2667; 0° … 60°C	MSC C6C-RYZ2-R2514-NN221C PCBFTX	PV
113795	COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen R2314, four-core, 2.1/3.5GHz, 12-35W TDP, 6 CU ; 3x DP/HDMI/DVI, LVDS (24 Bit, dual channel); 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; 4x PCIe Gen 3, 4x PCIe Gen 2, PEG x8 Gen 3; TPM 2.0; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-2667; 0° … 60°C	MSC C6C-RYZ2-R2314-NN221C PCBFTX	PV
113793	COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen R2312, two-core, 2.7/3.5GHz, 12-25W TDP, 3 CU ; 2x DP/HDMI/DVI, Embedded DisplayPort (eDP); 1x 1GbE; 2x SATA; 2x USB3, 8x USB2; 2x PCIe Gen 3, PEG x4 Gen 3; TPM 2.0; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-2400; 0° … 60°C	MSC C6C-RYZ2-R2312-NN101C PCBFTX	PV

PV = Preferred variant; OR = on Request (in OEM quantities only)

Accessories

Cooling Options

Order No.	Description	Reference
79809	Fan kit for Heatsink MSC HCA-ALP/RLP-0x HSI-xxx, MSC C6B-ALP/ RLP-0x HSI-xxx, MSC C6B-TLH-0x HSI-xxx, MSC C6C-ALP/RLP-0x HSI-xxx, MSC C6C-TLU-0x HSI-xxx, MSC C6C-WLU-0x HSI-xxx, MSC C6C-ALN/ASL-0x HSI-xxx, MSC C6C-EL-0x HSI-xxx, MSC C6C-RYZx-0x HSI-xxx, PWM fan 80x80x15mm.	MSC C6C-FANKIT-01-HSF-001
84613	Heatsink for C6C-RYZ, C6C-RYZ2. Single-piece aluminum profile, standoffs without thread (2.7mm inner diameter), screws and thermopad for the thermal contact to SOC.	MSC C6C-RYZ-01 HSI-001
79792	Heatsink / heat pipe for C6C-RYZ, C6C-RYZ2. Single-piece aluminum profile with embedded heat pipe, standoffs without thread (2.7mm inner diameter), screws and thermopad for the thermal contact to SOC.	MSC C6C-RYZ-01 HSI-HP-001
83859	Heatspreader for C6C-RYZ, C6C-RYZ2. Single-piece aluminum profile, standoffs without thread (2.7mm inner diameter), screws and thermopad for the thermal contact to SOC.	MSC C6C-RYZ-01 HSP-001
79793	Heatspreader / heat pipe for C6C-RYZ, C6C-RYZ2. Single-piece aluminum profile with embedded heat pipe, standoffs without thread (2.7mm inner diameter), screws and thermopad for the thermal contact to SOC.	MSC C6C-RYZ-01 HSP-HP-001
83881	Heatspreader for C6C-RYZ, C6C-RYZ2. Single-piece aluminum profile, threaded standoffs (M2.5), screws and thermopad for the thermal contact to SOC.	MSC C6C-RYZ-02 HSP-001
83860	Heatspreader / heat pipe for C6C-RYZ, C6C-RYZ2. Single-piece aluminum profile with embedded heat pipe, threaded standoffs (M2.5), screws and thermopad for the thermal contact to SOC.	MSC C6C-RYZ-02 HSP-HP-001

Memory Options

Order No.	Description	Reference
95549	16GB DDR4-2666 SO-DIMM, ECC	MOD SODIMM DDR4 16GB PC4-21300 CL19 2B
83003	4GB DDR4-2400 SoDimm, 1.2V, ECC	MOD SODIMM DDR4 4GB PC4-19200 CL17 1B
78199	4GB DDR4 2666 SO-DIMM	MOD SODIMM DDR4 4GB PC4-21300 CL19 1B
83004	4GB DDR4-2666 SO-DIMM, ECC	MOD SODIMM DDR4 4GB PC4-21300 CL19 1B

Support

Manual

MSC_C6C-RYZ2_User-Manual

Last update: 24/06/2024 2.36 MB

MSC_C6C-SLU_KLU_WLU_RYZ_EL_Heatsink_Montage_V05

Last update: 29/12/2022 966 KB

MSC_C6C-SLU_KLU_WLU_RYZ_EL_Heatspreader_Montage_V05

Last update: 29/12/2022 818 KB

Application Notes

App_Note_002_EDID_File_generation

Last update: 29/12/2022 292.49 KB

App_Note_013_COMe_T6_Carrier-Board_Recommendations

Last update: 29/12/2022 429.78 KB

App_Note_017_OS_Boot_support_for_different_media

Last update: 29/12/2022 147.99 KB

App_Note_019_Activate_screen_after_WoL_from_sleep

Last update: 29/12/2022 243.99 KB

App_Note_021_Install_Win7_on_Recent_Intel_Architectures

Last update: 29/12/2022 635.75 KB

App_Note_022_MSC_BIOS_Configurator_Tool

Last update: 29/12/2022 513.83 KB

App_Note_028_MSC_AutoFLASH

Last update: 22/03/2023 357 KB

App_Note_030_Building_from_MSC_Git_V2_1

Last update: 27/08/2024 509.53 KB

App_Note_030_Addendum_Building_from_MSC_Git_2024-10-29

Last update: 29/10/2024 403.22 KB

App_Note_032_Secure_Boot

Last update: 29/12/2022 332.92 KB

App_Note_043_Converting_eMMC_from_MLC_to_pSLC.pdf

Last update: 03/01/2023 266.21 KB

Compliance documents

China-ROHS-Statement_MSC_COM_Express_2023-10

Last update: 16/10/2023 140.36 KB

REACH-ROHS-Statement_MSC_COM_Express_2023-10

Last update: 16/10/2023 119.48 KB

Mechanical data

MSC_Mechanical_3D_information-AVE

Last update: 11/12/2023 213 KB

MSC_C6C-RYZ_RYZ2_3D

Last update: 25/10/2024 25.57 MB

MSC_C6C-FANKIT-01_HSF-001_3D

Last update: 29/12/2022 20.33 MB

MSC_C6C-RYZ-01_HSI-001_3D

Last update: 29/12/2022 19.27 MB

MSC_C6C-RYZ-01_HSI-HP-001_3D

Last update: 29/12/2022 19.45 MB

MSC_C6C-RYZ-01_HSP-001_3D

Last update: 29/12/2022 19.20 MB

MSC_C6C-RYZ-01_HSP-HP-001_3D

Last update: 29/12/2022 19.31 MB

MSC_C6C-RYZ-02_HSP-001_3D

Last update: 29/12/2022 19.23 MB

MSC_C6C-RYZ-02_HSP-HP-001_3D

Last update: 29/12/2022 19.36 MB

BIOS

BIOS_Update_C6C-RYZ2_BIOS_V100_01

Last update: 26/07/2024 6.62 MB

Drivers

Win 10-64bit

22.40.70-RC43-230620a-393426C

Last update: 26/08/2024 1,047.75 MB

AMD_Software_5.05.09.1103

Last update: 26/08/2024 64.40 MB

Demo images

msc-image-lxqt-v1000_dunfell-ryzen_20072023

Last update: 31/07/2023 1,760.48 MB

MSC EAPI NG for modules with AMI BIOS

MSC EAPI WinXP Win7 Win10 x86 x64

MSC EAPI v321_02

Last update: 22/03/2023 17 MB

MSC EAPI Linux

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MSC C6C-RYZ2

Highlights

Specs

Order Info

Accessories

Cooling Options

Memory Options

Support

MSC_C6C-RYZ2_User-Manual

MSC_C6C-SLU_KLU_WLU_RYZ_EL_Heatsink_Montage_V05

MSC_C6C-SLU_KLU_WLU_RYZ_EL_Heatspreader_Montage_V05

App_Note_002_EDID_File_generation

App_Note_013_COMe_T6_Carrier-Board_Recommendations

App_Note_017_OS_Boot_support_for_different_media

App_Note_019_Activate_screen_after_WoL_from_sleep

App_Note_021_Install_Win7_on_Recent_Intel_Architectures

App_Note_022_MSC_BIOS_Configurator_Tool

App_Note_028_MSC_AutoFLASH

App_Note_030_Building_from_MSC_Git_V2_1

App_Note_030_Addendum_Building_from_MSC_Git_2024-10-29

App_Note_032_Secure_Boot

App_Note_043_Converting_eMMC_from_MLC_to_pSLC.pdf

China-ROHS-Statement_MSC_COM_Express_2023-10

REACH-ROHS-Statement_MSC_COM_Express_2023-10

MSC_Mechanical_3D_information-AVE

MSC_C6C-RYZ_RYZ2_3D

MSC_C6C-FANKIT-01_HSF-001_3D

MSC_C6C-RYZ-01_HSI-001_3D

MSC_C6C-RYZ-01_HSI-HP-001_3D

MSC_C6C-RYZ-01_HSP-001_3D

MSC_C6C-RYZ-01_HSP-HP-001_3D

MSC_C6C-RYZ-02_HSP-001_3D

MSC_C6C-RYZ-02_HSP-HP-001_3D

BIOS_Update_C6C-RYZ2_BIOS_V100_01

22.40.70-RC43-230620a-393426C

AMD_Software_5.05.09.1103

msc-image-lxqt-v1000_dunfell-ryzen_20072023

MSC EAPI v321_02

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MSC C6C-ALN

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