MSC OSM-LF-IQ615

Qualcomm IQ6 Series IQ615 ARM® Cortex™-A76/A55

The MSC OSM-LF-IQ615 is based on the new OSM 1.2 standard (Size-L) “Large” and is powered by the Dragonwing IQ-615 Processor from Qualcomm. It is a low-cost embedded computer modules completely machine processible during soldering, assembly and testing.

The processors integrates 8 ARM Cores (2x A76 + 6xA55 Arm Cortex cores) and a powerfull Adreno 612 GPU, bringing performance and energy efficiency to Linux-based edge applications. The Hexagon™ V66 DSP with Dual hexagon Vector, enabling developers to create more capable, cost-effective and energy-efficient machine learning (ML) applications. The IQ-615 processors deliver advanced security with Secure boot, secure debug, TrustZone, Qualcomm® Trusted Execution Environment and hardware supported KeyStore.

MSC OSM-LF-IQ615 provides fast and low power LPDDR4 memory technology, combined with up to 256GB eMMC Flash memory. Various interfaces for embedded applications such as Gigabit Ethernet (RGMII), USB 2.0/3.1, DP v1.4, MIPI-DSI and MIPI CSI-2 (4-lane) for connecting a camera are available.

The module is compliant with the new OSM 1.2 standard (OSM-SL). For evaluation and design-in of the new MSC OSM-LF-IQ615 module, Tria Technologies provides a development platform and a starter kit. A Yocto based Linux Board Support Package is available.

Highlights

Octal Core CPU powered by the Dragonwing IQ-615 Processor from Qualcomm
- Dual core Arm Cortex-A76 up to 1.9GHz
- And hexa core Arm Cortex-A55 up to 1.6GHz
Adreno 612 GPU
Hexagon™ V66 DSP with Dual hexagon Vector (1.1 TOPs)
Spectra™ 230 image processing engine (ISP)
Adreno 443 VPU Video Decode/Encode 4k60(D)/1k60/(E)
Up to 8GB LPDDR4x SDRAM 3110MT/s
Up to 256GB eMMC Flash
1x UFS 2.1, 1x SDIO

1x USB 2.0, 1x USB 3.1
1x PCIe Gen2
MIPI-DSI, 1x DP v.1.4 (up to 4 Displays)
2x MIPI-CSI (4lane up to 4 cameras)
1x Ethernet (RGMII) up to 1 Gbps
4x UART, 2x SPI, 1x QSPI, 6x I2C, 2x I2S Audio
Yocto Linux, Ubuntu (on request)
Optimized design for low cost and low power applications
OSM Size-L – “Large”: 45 mm x 45 mm / with 662 contacts

Specs

Technology	ARM
Formfactor	OSM-LF, 662 Pin, RM 1,25 mm
CPU	Octal Core CPU powered by the Dragonwing IQ-615 Processor from Qualcomm • Dual core Arm Cortex-A76 up to 1.9GHz • And hexa core Arm Cortex-A55 up to 1.6GHz Hexagon™ V66 DSP with Dual hexagon Vector (1.1 TOPs)
Chipset	SOC
RAM	Up to 8GB LPDDR4x SDRAM 3110MT/s
Flash	Up to 256GB eMMC Flash
Storage Interfaces	1x UFS 2.1, 1x SDIO
USB	1x USB 2.0, 1x USB 3.1
Serial Interfaces (TBD)	1x UART Console with Rx, Tx only 1x UART with 2-wire hand shake 2x UART w/o hand shake
Bus Interfaces (TBD)	6x I2C up to 400 Kbit/s 2x SPI (with two chip selects) 1x QSPI 1x UFS 2.1 1x SDIO 1x PCIe Gen2
Display Controller	Adreno 612 GPU Spectra™ 230 image processing engine (ISP) Adreno 443 VPU Video Decode/Encode 4k60(D)/1k60/(E)
Display Interfaces (TBD)	MIPI-DSI (4 lanes), 1x DP v.1.4 (up to 4 Displays) Up to a maximum of 5 MP, e.g.: 2x 1920x1080 @ 60fps (FHD) + 1x 1280x720 @ 60fps
Network Interface	1x Ethernet, (RGMII) with up to 1Gbps
Audio Interface (TBD)	2x I2S Audio
Security Device	Secure boot, secure debug, TrustZone, Qualcomm® Trusted Execution Environment, hardware supported KeyStore, HDCP v1.4 and 2.2 for DisplayPort, secure I²C and secure SPI, AVB2.0 Crypto engines: Crypto engine v5 (CE5), DRBG/PRNG (FIPS-compliant), inline crypto engine (FIPS-compliant), ICE (In-line-crypto-engine) based disk encryption, PRNG with TRNG seed TrustZone services: Secure file system, secure display, and eFuse read/write, RPMB, Crypto lib
Miscellaneous (TBD)	Watchdog Timer for system reset (programmable, 1s … 600s) RTC 13x GPIO, configurable as input or output, interrupt capable 1x PWM Up to 4 cameras over 2 x 4-lane MIPI CSI-2 v1.3 (D-PHY 1.2, C-PHY 1.0)
Feature Highlights	OSM, Size-L compatible
Firmware (TBD)	uboot
OS Support	Yocto Linux Board Support Package Ubuntu Linux (on request)
Power Requirement	Power Supply +5V +/-5% Power Consumption 4W-5W typ.
Environment	Temperature Range: Commercial: 0° … 70°C (operating) -20° … 85°C (storage) Extended: -25° … 85°C (operating) -40° … 85°C (storage) Industrial: -40° … 85°C (operating) -40° … 85°C (storage) Humidity: 5 … 95% (operating, non condensing) 5 … 95% (storage, non-condensing)
Dimensions	45 x 45 mm
Certificates	UL / CE
Carrier (TBD)	MSC SM2F-OSM-AD-001

Order Info

Order No.	Description	Reference	Status
TBD1	OSM 1.2 size L module with Qualcomm IQ-615 2x A76 @1.9GHz + 6x A55 @1,6GHz, 3W CPU TDP, Graphics: Adreno 612 GPU, DSP: 1.1 TOPs, 2GB LPDDR4 SDRAM 3110MT/s, Ethernet: 1x 1Gbit RGMII , 8GB eMMC memory, PCIe: 1x PCIe Gen2 x1, TPM 2.0, Industrial Temperature -40°... +85°C(Engineering Sample - get in touch with your sales)	MSC OSM-LF- IQ-615-13N0501I-TN ES1 PCBES	PV
TBD2	OSM 1.2 size L module with Qualcomm IQ-615 2x A76 @1.9GHz + 6x A55 @1,6GHz, 3W CPU TDP, Graphics: Adreno 612 GPU, DSP: 1.1 TOPs, 4GB LPDDR4 SDRAM 3110MT/s, Ethernet: 1x 1Gbit RGMII , 16GB eMMC memory, PCIe: 1x PCIe Gen2 x1, TPM 2.0, Industrial Temperature -40°... +85°C(Engineering Sample - get in touch with your sales)	MSC OSM-LF- IQ-615-24N0501I-TN ES1 PCBES	PV
TBD3	OSM 1.2 size L module with Qualcomm IQ-615 2x A76 @1.9GHz + 6x A55 @1,6GHz, 3W CPU TDP, Graphics: Adreno 612 GPU, DSP: 1.1 TOPs, 8GB LPDDR4 SDRAM 3110MT/s, Ethernet: 1x 1Gbit RGMII , 32GB eMMC memory, PCIe: 1x PCIe Gen2 x1, TPM 2.0, Industrial Temperature -40°... +85°C(Engineering Sample - get in touch with your sales)	MSC OSM-LF- IQ-615-35N0501I-TN ES1 PCBES	PV