The MSC C6C-RYZ module is the embedded platform for the AMD RyzenTM Embedded V1000 and R1000 processor family. This versatile system-on-chip (SoC) technology combines processing, graphics and I/O functionality on a single die, allowing for outstanding compute performance in environments with constrained real-estate, power and cooling. Customers can choose from a variety of quad and dual-core processors to scale performance and capabilities according to application requirements. The board provides up to four independent display support with up to 4k x 2k resolution, highest level graphics acceleration and hardware based video en-/decoding. Fast DDR4 memory and multiple USB 3.1/2.0 interfaces complete the compact and power saving module. The MSC C6C-RYZ offers hardware based security compliant to the requirements of TCG (Trusted Computing Group) and features TPM 2.0 capability. The Type 6 pin-out allows direct access to the latest digital display interfaces like DisplayPort, HDMI 2.0b and DVI as well as up to four USB 3.1 interfaces supporting the fastest peripherals currently available.
Highlights
- AMD RyzenTM Embedded V1807B, quad-core Processor (3.35/3.8GHz, 11 GPU CU, 35-54W TDP)
- AMD RyzenTM Embedded V1756B, quad-core Processor (3.25/3.6GHz, 8 GPU CU, 35-54W TDP)
- AMD RyzenTM Embedded V1605B, quad-core Processor (2.0/3.6GHz, 8 GPU CU, 12-25W TDP)
- AMD RyzenTM Embedded V1404I, quad-core
Processor (2.0/3.6GHz, 8 GPU CU, 12-25W TDP),
industrial temperature range - AMD RyzenTM Embedded V1202B, dual-core Processor (2.3/3.2GHz, 3 GPU CU, 12-25W TDP)
- AMD RyzenTM Embedded R1606G, dual-core Processor (2.6/3.5GHz, 3 GPU CU, 12-25W TDP)
- AMD RyzenTM Embedded R1505G, dual-core Processor (2.4/3.3GHz, 3 GPU CU, 12-25W TDP)
- Up to 32 GB DDR4-3200 SDRAM, dual-channel, optional ECC
- Two SATA 6Gb/s mass storage interfaces
- Three DisplayPort/HDMI/DVI interfaces
- Embedded DisplayPort / LVDS (24 Bit, dual channel) interface
- Up to four independent displays supported
- DirectX 12, OpenGL 4.6, OpenCL 2.1
- Resolution up to 4096 x 2160
- Up to four USB 3.1/2.0 and four USB 2.0 interfaces
- Up to eight PCI Express™ x1 lanes
- PEG configurable up to 1×8 or 2×4
- Trusted Platform Module TPM 2.0
- UEFI Firmware
Specs
Technology | x86 |
Formfactor | COM Express Compact |
CPU | AMD RyzenTM Embedded V1807B, quad-core Processor, 3.35/3.8GHz, 2MB L2 / 4MB L3, 11 GPU CU, 45W (35-54W) TDP, max. DDR4-3200; AMD RyzenTM Embedded V1756B, quad-core Processor, 3.25/3.6GHz, 2MB L2 / 4MB L3, 8 GPU CU, 45W (35-54W) TDP, max. DDR4-3200; AMD RyzenTM Embedded V1605B, quad-core Processor, 2.0/3.6GHz, 2MB L2 / 4MB L3, 8 GPU CU, 15W (12-25W) TDP, max. DDR4-2400; AMD RyzenTM Embedded V1404I, quad-core Processor, 2.0/3.6GHz, 2MB L2 / 4MB L3, 8 GPU CU, 15W (12-25W) TDP, max. DDR4-2400, industrial temperature range; AMD RyzenTM Embedded V1202B, dual-core Processor, 2.3/3.2GHz, 1MB L2 / 4MB L3, 3 GPU CU, 15W (12-25W) TDP, max. DDR4-2400; AMD RyzenTM Embedded R1606G, dual-core Processor, 2.6/3.5GHz, 1MB L2 / 4MB L3, 3 GPU CU, 15W (12-25W) TDP, max. DDR4-2400; AMD RyzenTM Embedded R1505G, dual-core Processor, 2.4/3.3GHz, 1MB L2 / 4MB L3, 3 GPU CU, 15W (12-25W) TDP, max. DDR4-2400; |
Chipset | Integrated in System-on-Chip |
RAM | 2x 260-pin SO-DIMM socket for up to 2x 16 GB DDR4 SDRAM (DDR4-3200 max); ECC option; dual channel operation |
Storage Interfaces | 2x SATA 6Gb/s |
USB | Up to 4x USB 3.1/2.0, 4x USB 2.0 |
Serial Interfaces | 2x serial ports |
Bus Interfaces | PEG port max x8 (depending on processor variant) Up to four PCI Express x1 Gen3, up to four x1 Gen 2 (depending on processor and assembly variant) LPC bus (Low Pin Count bus) |
Display Controller | GPU Vega core, up to 11 CUs Up to four independent displays supported (depending on processor variant) |
Display Interfaces | Display Port and HDMI/DVI: Up to 3x Digital Display Interface, usable as DisplayPort 1.4 (up to 3840 x 2160 @ 120Hz, HBR3)1, also usable as HDMI 2.0b (4096 x 2160 @ 60Hz)2 or DVI (up to 1920 x 1200 @ 60Hz) 1 Re-timer required for HBR3 support 2 Re-timer required for operation above 3Gb/s 1x Embedded DisplayPort 1.3 (on variants without LVDS only); 3840 x 2160 @ 60Hz LCD: LVDS 24bit, dual-channel (not on all variants); 1920 x 1200 @ 60Hz |
Network Interface | 10/100/1000Base-TX (Intel i210) |
Audio Interface | High Definition Audio |
Security Device | TPM 2.0 (optional) |
Miscellaneous | Watchdog Timer: Initiates system reset, programmable Fan Supply: 4-pin header for CPU fan, PWM speed controlled and PWM speed control for system fan supported RTC battery: external System Monitoring: voltage, temperature, CPU fan, system fan |
Feature Highlights | Type 6 pin-out |
Firmware | UEFI Firmware: AMI Aptio® V Security: TPM 2.0 support, TCG compliant Power Management: ACPI Active fan control USB: USB legacy support (keyboard, mouse, storage) Monitoring: System Monitoring Health Monitoring MSC Adv. Boot Device Selection: Boot device priority setting based on physical interfaces |
OS Support | Windows 10 IOT Enterprise (64-bit) Windows 10 Linux, Yocto |
Power Requirement | Voltage: +12V primary power supply input, +5V Stby optional Power Consumption: 28 W to 64 W (typ., variant dependent) |
Environment | Ambient Temperature; 0° … 60°C (operating), -25° … 85°C (storage) Extended temp. variants: -40 ... +85°C (operating) Humidity: 5 … 95% (operating, non-condensing), 5 … 95% (storage, non-condensing) |
Dimensions | 95mm x 95mm |
Certificates | UL / CE |
Cooling | Passive heat sink Active heat sink with fan Heat spreader with threaded or non-threaded standoffs |
Carrier | Small carrier board (Mini-ITX) as part of a starter kit Evaluation board in ATX form factor |
Order Info
Order No. | Description | Reference | Status |
---|---|---|---|
83345 | COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen V1756B, four-core, 3.25/3.6GHz, 35-54W TDP, 8 CU ; 3x DP/HDMI/DVI, LVDS (24 Bit, dual channel); 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; 4x PCIe x1 Gen 3, 4x PCIe Gen 2, PEG x8 Gen 3; TPM 2.0; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-3200; 0° … 60°C | MSC C6C-RYZ-V1756B-NN221C PCBFTX | OR |
83347 | COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen V1605B, four-core, 2.0/3.6GHz, 12-25W TDP, 8 CU ; 3x DP/HDMI/DVI, LVDS (24 Bit, dual channel); 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; 4x PCIe x1 Gen 3, 4x PCIe Gen 2, PEG x8 Gen 3; TPM 2.0; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-2400; 0° … 60°C | MSC C6C-RYZ-V1605B-NN221C PCBFTX | PV |
83351 | COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen V1404I, four-core, 2.0/3.6GHz, 12-25W TDP, 8 CU ; 3x DP/HDMI/DVI, LVDS (24 Bit, dual channel); 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; 4x PCIe x1 Gen 3, 4x PCIe Gen 2, PEG x8 Gen 3; TPM 2.0; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-2400; -40° … 85°C | MSC C6C-RYZ-V1404I-NN221I PCBFTX | PV |
83349 | COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen V1202B, two-core, 2.3/3.2GHz, 12-25W TDP, 3 CU ; 3x DP/HDMI/DVI, Embedded DisplayPort (eDP); 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; 4x PCIe x1 Gen 3, 4x PCIe Gen 2, PEG x8 Gen 3; TPM 2.0; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-2400; 0° … 60°C | MSC C6C-RYZ-V1202B-NN120C PCBFTX | OR |
83353 | COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen R1606G, two-core, 2.6/3.5GHz, 12-25W TDP, 3 CU ; 2x DP/HDMI/DVI, LVDS (24 Bit, dual channel); 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; 2x PCIe x1 Gen 3, 4x PCIe Gen 2, PEG x4 Gen 3; TPM 2.0; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-2400; 0° … 60°C | MSC C6C-RYZ-R1606G-NN221C PCBFTX | PV |
83355 | COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen R1505G, two-core, 2.4/3.3GHz, 12-25W TDP, 3 CU ; 2x DP/HDMI/DVI, Embedded DisplayPort (eDP); 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; 2x PCIe x1 Gen 3, PEG x4 Gen 3; TPM 2.0; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-2400; 0° … 60°C | MSC C6C-RYZ-R1505G-NN100C PCBFTX | OR |
76062 | COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen R1505G, two-core, 2.4/3.3GHz, 12-25W TDP, 3 CU ; 2x DP/HDMI/DVI, LVDS (24 Bit, dual channel); 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; 2x PCIe x1 Gen 3, 4x PCIe Gen 2, PEG x4 Gen 3; TPM 2.0; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-2400; 0° … 60°C | MSC C6C-RYZ-R1505G-NN221C PCBFTX | OR |
PV = Preferred variant; OR = on Request (in OEM quantities only)
Accessories
Cooling Options
Order No. | Description | Reference |
---|---|---|
79809 | Fan kit for Heatsink MSC HCA-ALP/RLP-0x HSI-xxx, MSC C6B-ALP/ RLP-0x HSI-xxx, MSC C6B-TLH-0x HSI-xxx, MSC C6C-ALP/RLP-0x HSI-xxx, MSC C6C-TLU-0x HSI-xxx, MSC C6C-WLU-0x HSI-xxx, MSC C6C-ALN-0x HSI-xxx, MSC C6C-EL-0x HSI-xxx, MSC C6C-RYZ-0x HSI-xxx, PWM fan 80x80x15mm. | MSC C6C-FANKIT-01-HSF-001 |
84613 | Heatsink for C6C-RYZ, C6C-RYZ2. Single-piece aluminum profile, standoffs without thread (2.7mm inner diameter), screws and thermopad for the thermal contact to SOC. | MSC C6C-RYZ-01 HSI-001 |
79792 | Heatsink / heat pipe for C6C-RYZ, C6C-RYZ2. Single-piece aluminum profile with embedded heat pipe, standoffs without thread (2.7mm inner diameter), screws and thermopad for the thermal contact to SOC. | MSC C6C-RYZ-01 HSI-HP-001 |
83859 | Heatspreader for C6C-RYZ, C6C-RYZ2. Single-piece aluminum profile, standoffs without thread (2.7mm inner diameter), screws and thermopad for the thermal contact to SOC. | MSC C6C-RYZ-01 HSP-001 |
79793 | Heatspreader / heat pipe for C6C-RYZ, C6C-RYZ2. Single-piece aluminum profile with embedded heat pipe, standoffs without thread (2.7mm inner diameter), screws and thermopad for the thermal contact to SOC. | MSC C6C-RYZ-01 HSP-HP-001 |
83881 | Heatspreader for C6C-RYZ, C6C-RYZ2. Single-piece aluminum profile, threaded standoffs (M2.5), screws and thermopad for the thermal contact to SOC. | MSC C6C-RYZ-02 HSP-001 |
83860 | Heatspreader / heat pipe for C6C-RYZ, C6C-RYZ2. Single-piece aluminum profile with embedded heat pipe, threaded standoffs (M2.5), screws and thermopad for the thermal contact to SOC. | MSC C6C-RYZ-02 HSP-HP-001 |
Memory Options
Order No. | Description | Reference |
---|---|---|
89532 | 16GB DDR4 2666 SO-DIMM, Sorting Wide Temp. | MOD SODIMM DDR4 16GB PC4-21300 CL19 2B |
95549 | 16GB DDR4-2666 SO-DIMM, ECC | MOD SODIMM DDR4 16GB PC4-21300 CL19 2B |
89646 | 4GB DDR4 2400 SO-DIMM, Wide Temp. | MOD SODIMM DDR4 4GB PC4-19200 CL17 1B |
83003 | 4GB DDR4-2400 SoDimm, 1.2V, ECC | MOD SODIMM DDR4 4GB PC4-19200 CL17 1B |
78199 | 4GB DDR4 2666 SO-DIMM | MOD SODIMM DDR4 4GB PC4-21300 CL19 1B |
83004 | 4GB DDR4-2666 SO-DIMM, ECC | MOD SODIMM DDR4 4GB PC4-21300 CL19 1B |
89531 | 8GB DDR4-3200 SO-DIMM, Sorting Wide Temp. | MOD SODIMM DDR4 8GB PC4-25600 CL22 1B |
Support
Manual
MSC_C6C-RYZ_User-Manual
MSC_C6C-SLU_KLU_WLU_RYZ_EL_Heatsink_Montage_V05
MSC_C6C-SLU_KLU_WLU_RYZ_EL_Heatspreader_Montage_V05
Application Notes
App_Note_002_EDID_File_generation
App_Note_013_COMe_T6_Carrier-Board_Recommendations
App_Note_017_OS_Boot_support_for_different_media
App_Note_019_Activate_screen_after_WoL_from_sleep
App_Note_021_Install_Win7_on_Recent_Intel_Architectures
App_Note_022_MSC_BIOS_Configurator_Tool
App_Note_028_MSC_AutoFLASH
App_Note_030_Building_from_MSC_Git_V2_1
App_Note_030_Addendum_Building_from_MSC_Git_2024-10-29
App_Note_032_Secure_Boot
App_Note_043_Converting_eMMC_from_MLC_to_pSLC.pdf
Compliance documents
China-ROHS-Statement_MSC_COM_Express_2023-10
REACH-ROHS-Statement_MSC_COM_Express_2023-10
Mechanical data
MSC_Mechanical_3D_information-AVE
MSC_C6C-RYZ_RYZ2_3D
MSC_C6C-RYZ_3D-with-memory
MSC_C6C-FANKIT-01_HSF-001_3D
MSC_C6C-RYZ-01_HSI-001_3D
MSC_C6C-RYZ-01_HSI-HP-001_3D
MSC_C6C-RYZ-01_HSP-001_3D
MSC_C6C-RYZ-01_HSP-HP-001_3D
MSC_C6C-RYZ-02_HSP-001_3D
MSC_C6C-RYZ-02_HSP-HP-001_3D
BIOS
MSC_BIOS-Configurator-Tool
App_Note_028_MSC_AutoFLASH
BIOS_PostCodes_AMI-UEFI_Aptio_5.x_PUB
BIOS_Update_C6C-RYZ_BIOS_V110_01
BIOS_Update_C6C-RYZ_BIOS_V100_01
Drivers
Win 10-64bit
19.50.23.01.200220a-352391C-AES
AMD_Software_2.16.12.341
20.45.01.05.201016a-360315C
Demo images
msc-image-lxqt-v1000_dunfell-ryzen_20072023
PCN_-_EOL_-_Product_Information (Login to see this section)
MSC EAPI NG for modules with AMI BIOS
MSC EAPI WinXP Win7 Win10 x86 x64
MSC EAPI v321_02
MSC EAPI Linux