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MSC C6C-RYZ

AMD Ryzen™ Embedded Series

The MSC C6C-RYZ module is the embedded platform for the AMD RyzenTM Embedded V1000 and R1000 processor family. This versatile system-on-chip (SoC) technology combines processing, graphics and I/O functionality on a single die, allowing for outstanding compute performance in environments with constrained real-estate, power and cooling. Customers can choose from a variety of quad and dual-core processors to scale performance and capabilities according to application requirements. The board provides up to four independent display support with up to 4k x 2k resolution, highest level graphics acceleration and hardware based video en-/decoding. Fast DDR4 memory and multiple USB 3.1/2.0 interfaces complete the compact and power saving module. The MSC C6C-RYZ offers hardware based security compliant to the requirements of TCG (Trusted Computing Group) and features TPM 2.0 capability. The Type 6 pin-out allows direct access to the latest digital display interfaces like DisplayPort, HDMI 2.0b and DVI as well as up to four USB 3.1 interfaces supporting the fastest peripherals currently available.

Highlights

  • AMD RyzenTM Embedded V1807B, quad-core Processor (3.35/3.8GHz, 11 GPU CU, 35-54W TDP)
  • AMD RyzenTM Embedded V1756B, quad-core Processor (3.25/3.6GHz, 8 GPU CU, 35-54W TDP)
  • AMD RyzenTM Embedded V1605B, quad-core Processor (2.0/3.6GHz, 8 GPU CU, 12-25W TDP)
  • AMD RyzenTM Embedded V1404B, quad-core Processor (2.0/3.6GHz, 8 GPU CU, 12-25W TDP), industrial temperature range
  • AMD RyzenTM Embedded V1202B, dual-core Processor (2.3/3.2GHz, 3 GPU CU, 12-25W TDP)
  • AMD RyzenTM Embedded R1606G, dual-core Processor (2.6/3.5GHz, 3 GPU CU, 12-25W TDP)
  • AMD RyzenTM Embedded R1505G, dual-core Processor (2.4/3.3GHz, 3 GPU CU, 12-25W TDP)
  • Up to 32 GB DDR4-3200 SDRAM, dual-channel, optional ECC
  • Two SATA 6Gb/s mass storage interfaces
  • Three DisplayPort/HDMI/DVI interfaces
  • Embedded DisplayPort / LVDS (24 Bit, dual channel) interface
  • Up to four independent displays supported
  • DirectX 12, OpenGL 4.6, OpenCL 2.1
  • Resolution up to 4096 x 2160
  • Up to four USB 3.1/2.0 and four USB 2.0 interfaces
  • Up to eight PCI Express™ x1 lanes
  • PEG configurable up to 1×8 or 2×4
  • Trusted Platform Module TPM 2.0
  • UEFI Firmware

Specs

Technology x86
Formfactor COM Express Compact
CPU AMD RyzenTM Embedded V1807B, quad-core Processor, 3.35/3.8GHz, 2MB L2 / 4MB L3, 11 GPU CU, 45W (35-54W) TDP, max. DDR4-3200;
AMD RyzenTM Embedded V1756B, quad-core Processor, 3.25/3.6GHz, 2MB L2 / 4MB L3, 8 GPU CU, 45W (35-54W) TDP, max. DDR4-3200;
AMD RyzenTM Embedded V1605B, quad-core Processor, 2.0/3.6GHz, 2MB L2 / 4MB L3, 8 GPU CU, 15W (12-25W) TDP, max. DDR4-2400;
AMD RyzenTM Embedded V1404B, quad-core Processor, 2.0/3.6GHz, 2MB L2 / 4MB L3, 8 GPU CU, 15W (12-25W) TDP, max. DDR4-2400, industrial temperature range;
AMD RyzenTM Embedded V1202B, dual-core Processor, 2.3/3.2GHz, 1MB L2 / 4MB L3, 3 GPU CU, 15W (12-25W) TDP, max. DDR4-2400;
AMD RyzenTM Embedded R1606G, dual-core Processor, 2.6/3.5GHz, 1MB L2 / 4MB L3, 3 GPU CU, 15W (12-25W) TDP, max. DDR4-2400;
AMD RyzenTM Embedded R1505G, dual-core Processor, 2.4/3.3GHz, 1MB L2 / 4MB L3, 3 GPU CU, 15W (12-25W) TDP, max. DDR4-2400;
Chipset Integrated in System-on-Chip
RAM 2x 260-pin SO-DIMM socket for up to 2x 16 GB DDR4 SDRAM (DDR4-3200 max); ECC option; dual channel operation
Storage Interfaces 2x SATA 6Gb/s
USB Up to 4x USB 3.1/2.0,
4x USB 2.0
Serial Interfaces 2x serial ports
Bus Interfaces PEG port max x8 (depending on processor variant)
Up to four PCI Express x1 Gen3, up to four x1 Gen 2 (depending on processor and assembly variant)
LPC bus (Low Pin Count bus)
Display Controller GPU Vega core, up to 11 CUs
Up to four independent displays supported (depending on processor variant)
Display Interfaces Display Port and HDMI/DVI:
Up to 3x Digital Display Interface, usable as DisplayPort 1.4 (up to 3840 x 2160 @ 120Hz, HBR3)1, also usable as HDMI 2.0b (4096 x 2160 @ 60Hz)2 or DVI (up to 1920 x 1200 @ 60Hz)
1 Re-timer required for HBR3 support
2 Re-timer required for operation above 3Gb/s
1x Embedded DisplayPort 1.3 (on variants without LVDS only); 3840 x 2160 @ 60Hz
LCD:
LVDS 24bit, dual-channel (not on all variants); 1920 x 1200 @ 60Hz
VGA:
VGA product option
Network Interface 10/100/1000Base-TX (Intel i210)
Audio Interface High Definition Audio
Security Device TPM 2.0 (optional)
Miscellaneous Watchdog Timer:
Initiates system reset, programmable
Fan Supply:
4-pin header for CPU fan, PWM speed controlled
and PWM speed control for system fan supported
RTC battery:
external
System Monitoring:
voltage, temperature, CPU fan, system fan
Feature Highlights FEATURE HIGHLIGHTS DATA HERE!
Firmware UEFI Firmware:
AMI Aptio® V
Security:
TPM 2.0 support, TCG compliant
Power Management:
ACPI
Active fan control
USB:
USB legacy support (keyboard, mouse, storage)
Monitoring:
System Monitoring
Health Monitoring
MSC Adv. Boot Device Selection:
Boot device priority setting based on physical interfaces
OS Support Windows 10 IOT Enterprise (64-bit)
Windows 10
Linux, Yocto
Power Requirement Voltage:
+12V primary power supply input, +5V Stby optional

Power Consumption:
28 W to 64 W (typ., variant dependent)
Environment Ambient Temperature;
0° … 60°C (operating),
-25° … 85°C (storage)
Extended temp. variants: -40 ... +85°C (operating)
Humidity:
5 … 95% (operating, non-condensing),
5 … 95% (storage, non-condensing)
Dimensions 95mm x 95mm
Certificates UL / CE
Cooling Passive heat sink
Active heat sink with fan
Heat spreader with threaded or non-threaded standoffs
Carrier Small carrier board (Mini-ITX) as part of a starter kit
Evaluation board in ATX form factor

Order Info

Order No. Description Reference Status
83343 COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen V1807B, four-core, 3.35/3.8GHz, 35-54W TDP, 11 CU ; 2x DP/HDMI/DVI, LVDS (24 Bit, dual channel); VGA; 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; 4x PCIe x1 Gen 3, 4x PCIe Gen 2, PEG x8 Gen 3; TPM 2.0; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-3200; 0° … 60°C MSC C6C-RYZ-V1807B-NN621C PCBFTX PV
83345 COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen V1756B, four-core, 3.25/3.6GHz, 35-54W TDP, 8 CU ; 3x DP/HDMI/DVI, LVDS (24 Bit, dual channel); 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; 4x PCIe x1 Gen 3, 4x PCIe Gen 2, PEG x8 Gen 3; TPM 2.0; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-3200; 0° … 60°C MSC C6C-RYZ-V1756B-NN221C PCBFTX OR
83347 COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen V1605B, four-core, 2.0/3.6GHz, 12-25W TDP, 8 CU ; 3x DP/HDMI/DVI, LVDS (24 Bit, dual channel); 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; 4x PCIe x1 Gen 3, 4x PCIe Gen 2, PEG x8 Gen 3; TPM 2.0; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-2400; 0° … 60°C MSC C6C-RYZ-V1605B-NN221C PCBFTX PV
83351 COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen V1404I, four-core, 2.0/3.6GHz, 12-25W TDP, 8 CU ; 3x DP/HDMI/DVI, LVDS (24 Bit, dual channel); 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; 4x PCIe x1 Gen 3, 4x PCIe Gen 2, PEG x8 Gen 3; TPM 2.0; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-2400; -40° … 85°C MSC C6C-RYZ-V1404I-NN221I PCBFTX PV
83349 COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen V1202B, two-core, 2.3/3.2GHz, 12-25W TDP, 3 CU ; 3x DP/HDMI/DVI, Embedded DisplayPort (eDP); 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; 4x PCIe x1 Gen 3, 4x PCIe Gen 2, PEG x8 Gen 3; TPM 2.0; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-2400; 0° … 60°C MSC C6C-RYZ-V1202B-NN120C PCBFTX OR
83353 COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen R1606G, two-core, 2.6/3.5GHz, 12-25W TDP, 3 CU ; 2x DP/HDMI/DVI, LVDS (24 Bit, dual channel); 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; 2x PCIe x1 Gen 3, 4x PCIe Gen 2, PEG x4 Gen 3; TPM 2.0; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-2400; 0° … 60°C MSC C6C-RYZ-R1606G-NN221C PCBFTX PV
83355 COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen R1505G, two-core, 2.4/3.3GHz, 12-25W TDP, 3 CU ; 2x DP/HDMI/DVI, Embedded DisplayPort (eDP); 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; 2x PCIe x1 Gen 3, PEG x4 Gen 3; TPM 2.0; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-2400; 0° … 60°C MSC C6C-RYZ-R1505G-NN100C PCBFTX OR
83983 COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen R1505G, two-core, 2.4/3.3GHz, 12-25W TDP, 3 CU ; 1x DP/HDMI/DVI, Embedded DisplayPort (eDP), VGA; 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; TPM 2.0; 2x PCIe x1 Gen 3, PEG x4 Gen 3; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-2400; 0° … 60°C MSC C6C-RYZ-R1505G-NN500C PCBFTX PV

Accessories

Carrier Options

Order No. Description Reference
67295 COM Express Type 6 Evaluation Carrier Board with PCI Express x4/x16 slot, USB 3.0/2.0, GbE, SATA, DisplayPort, eDP/LVDS, VGA and HD audio interfaces; Mini PCI Express socket, SD card slot, ATX power connector and single 12V power jack. Dimensions: 170mm x 170mm (Mini-ITX form factor) MSC C6-MB-EV-001 PCBFTX
41857 COM Express Type 6 Evaluation Carrier Board with various PCI Express x1, x4 and x16 slots, USB 3.0/2.0, GbE, SATA, DisplayPort, HDMI, LVDS, eDP, VGA, HD audio interfaces; mSATA and Mini PCI Express sockets, POST code display, ATX power connector. Dimensions: 305 x 244 mm (ATX form factor) MSC C6-MB-EVA PCBFTX

Cooling Options

Order No. Description Reference
79809 Fan kit for Heatsink MSC C6C-EL-0x HSI-xxx, MSC C6C-TLU-0x HSI-xxx, MSC C6C-WLU-0x HSI-xxx, MSC C6C-RYZ-0x HSI-xxx, PWM fan 80x80x15mm. MSC C6C-FANKIT-01-HSF-001
84613 Heatsink for C6C-RYZ. Single-piece aluminum profile, pressed in standoffs without thread (2.7mm inner diameter), screws and thermopad for the thermal contact to SOC. MSC C6C-RYZ-01 HSI-001
83859 Heatspreader for C6C-RYZ. Single-piece aluminum profile, pressed in standoffs without thread (2.7mm inner diameter), screws and thermopad for the thermal contact to SOC. MSC C6C-RYZ-01 HSP-001
83881 Heatspreader for C6C-RYZ. Single-piece aluminum profile, pressed in threaded standoffs (M2.5), screws and thermopad for the thermal contact to SOC. MSC C6C-RYZ-02 HSP-001

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