MSC C6C-RYZ

AMD Ryzen™ Embedded Series

The MSC C6C-RYZ module is the embedded platform for the AMD Ryzen^TM Embedded V1000 and R1000 processor family. This versatile system-on-chip (SoC) technology combines processing, graphics and I/O functionality on a single die, allowing for outstanding compute performance in environments with constrained real-estate, power and cooling. Customers can choose from a variety of quad and dual-core processors to scale performance and capabilities according to application requirements. The board provides up to four independent display support with up to 4k x 2k resolution, highest level graphics acceleration and hardware based video en-/decoding. Fast DDR4 memory and multiple USB 3.1/2.0 interfaces complete the compact and power saving module. The MSC C6C-RYZ offers hardware based security compliant to the requirements of TCG (Trusted Computing Group) and features TPM 2.0 capability. The Type 6 pin-out allows direct access to the latest digital display interfaces like DisplayPort, HDMI 2.0b and DVI as well as up to four USB 3.1 interfaces supporting the fastest peripherals currently available.

Highlights

AMD Ryzen^TM Embedded V1807B, quad-core Processor (3.35/3.8GHz, 11 GPU CU, 35-54W TDP)
AMD Ryzen^TM Embedded V1756B, quad-core Processor (3.25/3.6GHz, 8 GPU CU, 35-54W TDP)
AMD Ryzen^TM Embedded V1605B, quad-core Processor (2.0/3.6GHz, 8 GPU CU, 12-25W TDP)
AMD RyzenTM Embedded V1404I, quad-core
Processor (2.0/3.6GHz, 8 GPU CU, 12-25W TDP),
industrial temperature range
AMD Ryzen^TM Embedded V1202B, dual-core Processor (2.3/3.2GHz, 3 GPU CU, 12-25W TDP)
AMD Ryzen^TM Embedded R1606G, dual-core Processor (2.6/3.5GHz, 3 GPU CU, 12-25W TDP)
AMD Ryzen^TM Embedded R1505G, dual-core Processor (2.4/3.3GHz, 3 GPU CU, 12-25W TDP)

Up to 32 GB DDR4-3200 SDRAM, dual-channel, optional ECC
Two SATA 6Gb/s mass storage interfaces
Three DisplayPort/HDMI/DVI interfaces
Embedded DisplayPort / LVDS (24 Bit, dual channel) interface
Up to four independent displays supported
DirectX 12, OpenGL 4.6, OpenCL 2.1
Resolution up to 4096 x 2160
Up to four USB 3.1/2.0 and four USB 2.0 interfaces
Up to eight PCI Express™ x1 lanes
PEG configurable up to 1×8 or 2×4
Trusted Platform Module TPM 2.0
UEFI Firmware

Specs

Technology	x86
Formfactor	COM Express Compact
CPU	AMD RyzenTM Embedded V1807B, quad-core Processor, 3.35/3.8GHz, 2MB L2 / 4MB L3, 11 GPU CU, 45W (35-54W) TDP, max. DDR4-3200; AMD RyzenTM Embedded V1756B, quad-core Processor, 3.25/3.6GHz, 2MB L2 / 4MB L3, 8 GPU CU, 45W (35-54W) TDP, max. DDR4-3200; AMD RyzenTM Embedded V1605B, quad-core Processor, 2.0/3.6GHz, 2MB L2 / 4MB L3, 8 GPU CU, 15W (12-25W) TDP, max. DDR4-2400; AMD RyzenTM Embedded V1404B, quad-core Processor, 2.0/3.6GHz, 2MB L2 / 4MB L3, 8 GPU CU, 15W (12-25W) TDP, max. DDR4-2400, industrial temperature range; AMD RyzenTM Embedded V1202B, dual-core Processor, 2.3/3.2GHz, 1MB L2 / 4MB L3, 3 GPU CU, 15W (12-25W) TDP, max. DDR4-2400; AMD RyzenTM Embedded R1606G, dual-core Processor, 2.6/3.5GHz, 1MB L2 / 4MB L3, 3 GPU CU, 15W (12-25W) TDP, max. DDR4-2400; AMD RyzenTM Embedded R1505G, dual-core Processor, 2.4/3.3GHz, 1MB L2 / 4MB L3, 3 GPU CU, 15W (12-25W) TDP, max. DDR4-2400;
Chipset	Integrated in System-on-Chip
RAM	2x 260-pin SO-DIMM socket for up to 2x 16 GB DDR4 SDRAM (DDR4-3200 max); ECC option; dual channel operation
Storage Interfaces	2x SATA 6Gb/s
USB	Up to 4x USB 3.1/2.0, 4x USB 2.0
Serial Interfaces	2x serial ports
Bus Interfaces	PEG port max x8 (depending on processor variant) Up to four PCI Express x1 Gen3, up to four x1 Gen 2 (depending on processor and assembly variant) LPC bus (Low Pin Count bus)
Display Controller	GPU Vega core, up to 11 CUs Up to four independent displays supported (depending on processor variant)
Display Interfaces	Display Port and HDMI/DVI: Up to 3x Digital Display Interface, usable as DisplayPort 1.4 (up to 3840 x 2160 @ 120Hz, HBR3)1, also usable as HDMI 2.0b (4096 x 2160 @ 60Hz)2 or DVI (up to 1920 x 1200 @ 60Hz) 1 Re-timer required for HBR3 support 2 Re-timer required for operation above 3Gb/s 1x Embedded DisplayPort 1.3 (on variants without LVDS only); 3840 x 2160 @ 60Hz LCD: LVDS 24bit, dual-channel (not on all variants); 1920 x 1200 @ 60Hz VGA: VGA product option
Network Interface	10/100/1000Base-TX (Intel i210)
Audio Interface	High Definition Audio
Security Device	TPM 2.0 (optional)
Miscellaneous	Watchdog Timer: Initiates system reset, programmable Fan Supply: 4-pin header for CPU fan, PWM speed controlled and PWM speed control for system fan supported RTC battery: external System Monitoring: voltage, temperature, CPU fan, system fan
Feature Highlights	FEATURE HIGHLIGHTS DATA HERE!
Firmware	UEFI Firmware: AMI Aptio® V Security: TPM 2.0 support, TCG compliant Power Management: ACPI Active fan control USB: USB legacy support (keyboard, mouse, storage) Monitoring: System Monitoring Health Monitoring MSC Adv. Boot Device Selection: Boot device priority setting based on physical interfaces
OS Support	Windows 10 IOT Enterprise (64-bit) Windows 10 Linux, Yocto
Power Requirement	Voltage: +12V primary power supply input, +5V Stby optional Power Consumption: 28 W to 64 W (typ., variant dependent)
Environment	Ambient Temperature; 0° … 60°C (operating), -25° … 85°C (storage) Extended temp. variants: -40 ... +85°C (operating) Humidity: 5 … 95% (operating, non-condensing), 5 … 95% (storage, non-condensing)
Dimensions	95mm x 95mm
Certificates	UL / CE
Cooling	Passive heat sink Active heat sink with fan Heat spreader with threaded or non-threaded standoffs
Carrier	Small carrier board (Mini-ITX) as part of a starter kit Evaluation board in ATX form factor

Order Info

Order No.	Description	Reference	Status
83343	COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen V1807B, four-core, 3.35/3.8GHz, 35-54W TDP, 11 CU ; 2x DP/HDMI/DVI, LVDS (24 Bit, dual channel); VGA; 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; 4x PCIe x1 Gen 3, 4x PCIe Gen 2, PEG x8 Gen 3; TPM 2.0; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-3200; 0° … 60°C	MSC C6C-RYZ-V1807B-NN621C PCBFTX	PV
83345	COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen V1756B, four-core, 3.25/3.6GHz, 35-54W TDP, 8 CU ; 3x DP/HDMI/DVI, LVDS (24 Bit, dual channel); 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; 4x PCIe x1 Gen 3, 4x PCIe Gen 2, PEG x8 Gen 3; TPM 2.0; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-3200; 0° … 60°C	MSC C6C-RYZ-V1756B-NN221C PCBFTX	OR
83347	COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen V1605B, four-core, 2.0/3.6GHz, 12-25W TDP, 8 CU ; 3x DP/HDMI/DVI, LVDS (24 Bit, dual channel); 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; 4x PCIe x1 Gen 3, 4x PCIe Gen 2, PEG x8 Gen 3; TPM 2.0; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-2400; 0° … 60°C	MSC C6C-RYZ-V1605B-NN221C PCBFTX	PV
83351	COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen V1404I, four-core, 2.0/3.6GHz, 12-25W TDP, 8 CU ; 3x DP/HDMI/DVI, LVDS (24 Bit, dual channel); 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; 4x PCIe x1 Gen 3, 4x PCIe Gen 2, PEG x8 Gen 3; TPM 2.0; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-2400; -40° … 85°C	MSC C6C-RYZ-V1404I-NN221I PCBFTX	PV
83349	COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen V1202B, two-core, 2.3/3.2GHz, 12-25W TDP, 3 CU ; 3x DP/HDMI/DVI, Embedded DisplayPort (eDP); 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; 4x PCIe x1 Gen 3, 4x PCIe Gen 2, PEG x8 Gen 3; TPM 2.0; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-2400; 0° … 60°C	MSC C6C-RYZ-V1202B-NN120C PCBFTX	OR
83353	COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen R1606G, two-core, 2.6/3.5GHz, 12-25W TDP, 3 CU ; 2x DP/HDMI/DVI, LVDS (24 Bit, dual channel); 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; 2x PCIe x1 Gen 3, 4x PCIe Gen 2, PEG x4 Gen 3; TPM 2.0; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-2400; 0° … 60°C	MSC C6C-RYZ-R1606G-NN221C PCBFTX	PV
83355	COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen R1505G, two-core, 2.4/3.3GHz, 12-25W TDP, 3 CU ; 2x DP/HDMI/DVI, Embedded DisplayPort (eDP); 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; 2x PCIe x1 Gen 3, PEG x4 Gen 3; TPM 2.0; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-2400; 0° … 60°C	MSC C6C-RYZ-R1505G-NN100C PCBFTX	OR
76062	COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen R1505G, two-core, 2.4/3.3GHz, 12-25W TDP, 3 CU ; 2x DP/HDMI/DVI, LVDS (24 Bit, dual channel); 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; 2x PCIe x1 Gen 3, 4x PCIe Gen 2, PEG x4 Gen 3; TPM 2.0; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-2400; 0° … 60°C	MSC C6C-RYZ-R1505G-NN221C PCBFTX	OR
83983	COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen R1505G, two-core, 2.4/3.3GHz, 12-25W TDP, 3 CU ; 1x DP/HDMI/DVI, Embedded DisplayPort (eDP), VGA; 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; TPM 2.0; 2x PCIe x1 Gen 3, PEG x4 Gen 3; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-2400; 0° … 60°C	MSC C6C-RYZ-R1505G-NN500C PCBFTX	PV

PV = Preferred variant; OR = on Request (in OEM quantities only)

Accessories

Carrier Options

Order No.	Description	Reference
67295	COM Express Type 6 Evaluation Carrier Board with PCI Express x4/x16 slot, USB 3.0/2.0, GbE, SATA, DisplayPort, eDP/LVDS, VGA and HD audio interfaces; Mini PCI Express socket, SD card slot, ATX power connector and single 12V power jack. Dimensions: 170mm x 170mm (Mini-ITX form factor)	MSC C6-MB-EV-001 PCBFTX
41857	COM Express Type 6 Evaluation Carrier Board with various PCI Express x1, x4 and x16 slots, USB 3.0/2.0, GbE, SATA, DisplayPort, HDMI, LVDS, eDP, VGA, HD audio interfaces; mSATA and Mini PCI Express sockets, POST code display, ATX power connector. Dimensions: 305 x 244 mm (ATX form factor)	MSC C6-MB-EVA PCBFTX

Cooling Options

Order No.	Description	Reference
79809	Fan kit for Heatsink MSC C6C-EL-0x HSI-xxx, MSC C6C-TLU-0x HSI-xxx, MSC C6C-WLU-0x HSI-xxx, MSC C6C-RYZ-0x HSI-xxx, PWM fan 80x80x15mm.	MSC C6C-FANKIT-01-HSF-001
84613	Heatsink for C6C-RYZ. Single-piece aluminum profile, pressed in standoffs without thread (2.7mm inner diameter), screws and thermopad for the thermal contact to SOC.	MSC C6C-RYZ-01 HSI-001
83859	Heatspreader for C6C-RYZ. Single-piece aluminum profile, pressed in standoffs without thread (2.7mm inner diameter), screws and thermopad for the thermal contact to SOC.	MSC C6C-RYZ-01 HSP-001
83881	Heatspreader for C6C-RYZ. Single-piece aluminum profile, pressed in threaded standoffs (M2.5), screws and thermopad for the thermal contact to SOC.	MSC C6C-RYZ-02 HSP-001

Memory Options

Order No.	Description	Reference
83003	4GB DDR4-2400 SoDimm, 1.2V, ECC	M4DI-4GSSPCSJ-F
89532	16GB DDR4 2666 SO-DIMM, sorting wide temp	M4DI-AGS1Q50K-C
1147003	16GB DDR4-2666 SO-DIMM, ECC	M4DI-AGS1QC0K-C
89531	8GB DDR4 3200 SO-DIMM, sorting wide temp	M4SE-8GS1N50M-C
78199	4GB DDR4 2666 SO-DIMM	M4SI-4GSSNC0K-F M4SI-4GSXZC0K-C
89646	4GB DDR4 2400 SO-DIMM, wide temp	M4SI-4GSSNISJ-F

Support

Manual

MSC_C6C-RYZ_User-Manual_V011

Last update: 27/01/2022 2 MB

MSC_C6C-SLU_KLU_WLU_RYZ_EL_Heatsink_Montage_V05

Last update: 18/05/2022 966 KB

MSC_C6C-SLU_KLU_WLU_RYZ_EL_Heatspreader_Montage_V05

Last update: 18/05/2022 818 KB

Mechanical data

Download

MSC_Mechanical_3D_information-AVE

Last update: 26/01/2022 213 KB

MSC_C6C-FANKIT-01_HSF-001_3D

Last update: 02/02/2022 20.33 MB

MSC_C6C-RYZ-01_HSI-001_3D

Last update: 27/01/2022 19.27 MB

MSC_C6C-RYZ-01_HSI-HP-001_3D

Last update: 27/01/2022 19.45 MB

MSC_C6C-RYZ-01_HSP-001_3D

Last update: 27/01/2022 19.20 MB

MSC_C6C-RYZ-01_HSP-HP-001_3D

Last update: 27/01/2022 19.31 MB

MSC_C6C-RYZ-02_HSP-001_3D

Last update: 27/01/2022 19.23 MB

MSC_C6C-RYZ-02_HSP-HP-001_3D

Last update: 27/01/2022 19.36 MB

BIOS

Download

MSC_BIOS-Configurator-Tool

Last update: 11/05/2022 205.83 KB

App_Note_028_MSC_AutoFLASH

Last update: 28/01/2022 357 KB

BIOS_PostCodes_AMI-UEFI_Aptio_5.x_PUB

Last update: 28/01/2022 280 KB

BIOS_Update_C6C-RYZ_BIOS_V100_01

Last update: 27/01/2022 5.37 MB

Drivers

Win 10-64bit

20.50.23.01.210406a-366255c

Last update: 01/02/2022 791 MB

amd_software_2.16.12.341

Last update: 01/02/2022 52.03 MB

MSC EAPI NG for modules with AMI BIOS

MSC EAPI WinXP Win7 Win10 x86 x64

MSC EAPI v321_02

Last update: 11/05/2022 17 MB

MSC EAPI Linux

App_Note_023_Building_EAPI_and_MscIo_from_GIT_(32bit_and_64bit)_281117

Last update: 11/05/2022 11 KB

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