The MSC C6C-RYZ module is the embedded platform for the AMD RyzenTM Embedded V1000 and R1000 processor family. This versatile system-on-chip (SoC) technology combines processing, graphics and I/O functionality on a single die, allowing for outstanding compute performance in environments with constrained real-estate, power and cooling. Customers can choose from a variety of quad and dual-core processors to scale performance and capabilities according to application requirements. The board provides up to four independent display support with up to 4k x 2k resolution, highest level graphics acceleration and hardware based video en-/decoding. Fast DDR4 memory and multiple USB 3.1/2.0 interfaces complete the compact and power saving module. The MSC C6C-RYZ offers hardware based security compliant to the requirements of TCG (Trusted Computing Group) and features TPM 2.0 capability. The Type 6 pin-out allows direct access to the latest digital display interfaces like DisplayPort, HDMI 2.0b and DVI as well as up to four USB 3.1 interfaces supporting the fastest peripherals currently available.
Highlights
- AMD RyzenTM Embedded V1807B, quad-core Processor (3.35/3.8GHz, 11 GPU CU, 35-54W TDP)
- AMD RyzenTM Embedded V1756B, quad-core Processor (3.25/3.6GHz, 8 GPU CU, 35-54W TDP)
- AMD RyzenTM Embedded V1605B, quad-core Processor (2.0/3.6GHz, 8 GPU CU, 12-25W TDP)
- AMD RyzenTM Embedded V1404I, quad-core
Processor (2.0/3.6GHz, 8 GPU CU, 12-25W TDP),
industrial temperature range - AMD RyzenTM Embedded V1202B, dual-core Processor (2.3/3.2GHz, 3 GPU CU, 12-25W TDP)
- AMD RyzenTM Embedded R1606G, dual-core Processor (2.6/3.5GHz, 3 GPU CU, 12-25W TDP)
- AMD RyzenTM Embedded R1505G, dual-core Processor (2.4/3.3GHz, 3 GPU CU, 12-25W TDP)
- Up to 32 GB DDR4-3200 SDRAM, dual-channel, optional ECC
- Two SATA 6Gb/s mass storage interfaces
- Three DisplayPort/HDMI/DVI interfaces
- Embedded DisplayPort / LVDS (24 Bit, dual channel) interface
- Up to four independent displays supported
- DirectX 12, OpenGL 4.6, OpenCL 2.1
- Resolution up to 4096 x 2160
- Up to four USB 3.1/2.0 and four USB 2.0 interfaces
- Up to eight PCI Express™ x1 lanes
- PEG configurable up to 1×8 or 2×4
- Trusted Platform Module TPM 2.0
- UEFI Firmware
Specs
Technology | x86 |
Formfactor | COM Express Compact |
CPU | AMD RyzenTM Embedded V1807B, quad-core Processor, 3.35/3.8GHz, 2MB L2 / 4MB L3, 11 GPU CU, 45W (35-54W) TDP, max. DDR4-3200; AMD RyzenTM Embedded V1756B, quad-core Processor, 3.25/3.6GHz, 2MB L2 / 4MB L3, 8 GPU CU, 45W (35-54W) TDP, max. DDR4-3200; AMD RyzenTM Embedded V1605B, quad-core Processor, 2.0/3.6GHz, 2MB L2 / 4MB L3, 8 GPU CU, 15W (12-25W) TDP, max. DDR4-2400; AMD RyzenTM Embedded V1404B, quad-core Processor, 2.0/3.6GHz, 2MB L2 / 4MB L3, 8 GPU CU, 15W (12-25W) TDP, max. DDR4-2400, industrial temperature range; AMD RyzenTM Embedded V1202B, dual-core Processor, 2.3/3.2GHz, 1MB L2 / 4MB L3, 3 GPU CU, 15W (12-25W) TDP, max. DDR4-2400; AMD RyzenTM Embedded R1606G, dual-core Processor, 2.6/3.5GHz, 1MB L2 / 4MB L3, 3 GPU CU, 15W (12-25W) TDP, max. DDR4-2400; AMD RyzenTM Embedded R1505G, dual-core Processor, 2.4/3.3GHz, 1MB L2 / 4MB L3, 3 GPU CU, 15W (12-25W) TDP, max. DDR4-2400; |
Chipset | Integrated in System-on-Chip |
RAM | 2x 260-pin SO-DIMM socket for up to 2x 16 GB DDR4 SDRAM (DDR4-3200 max); ECC option; dual channel operation |
Storage Interfaces | 2x SATA 6Gb/s |
USB | Up to 4x USB 3.1/2.0, 4x USB 2.0 |
Serial Interfaces | 2x serial ports |
Bus Interfaces | PEG port max x8 (depending on processor variant) Up to four PCI Express x1 Gen3, up to four x1 Gen 2 (depending on processor and assembly variant) LPC bus (Low Pin Count bus) |
Display Controller | GPU Vega core, up to 11 CUs Up to four independent displays supported (depending on processor variant) |
Display Interfaces | Display Port and HDMI/DVI: Up to 3x Digital Display Interface, usable as DisplayPort 1.4 (up to 3840 x 2160 @ 120Hz, HBR3)1, also usable as HDMI 2.0b (4096 x 2160 @ 60Hz)2 or DVI (up to 1920 x 1200 @ 60Hz) 1 Re-timer required for HBR3 support 2 Re-timer required for operation above 3Gb/s 1x Embedded DisplayPort 1.3 (on variants without LVDS only); 3840 x 2160 @ 60Hz LCD: LVDS 24bit, dual-channel (not on all variants); 1920 x 1200 @ 60Hz VGA: VGA product option |
Network Interface | 10/100/1000Base-TX (Intel i210) |
Audio Interface | High Definition Audio |
Security Device | TPM 2.0 (optional) |
Miscellaneous | Watchdog Timer: Initiates system reset, programmable Fan Supply: 4-pin header for CPU fan, PWM speed controlled and PWM speed control for system fan supported RTC battery: external System Monitoring: voltage, temperature, CPU fan, system fan |
Feature Highlights | FEATURE HIGHLIGHTS DATA HERE! |
Firmware | UEFI Firmware: AMI Aptio® V Security: TPM 2.0 support, TCG compliant Power Management: ACPI Active fan control USB: USB legacy support (keyboard, mouse, storage) Monitoring: System Monitoring Health Monitoring MSC Adv. Boot Device Selection: Boot device priority setting based on physical interfaces |
OS Support | Windows 10 IOT Enterprise (64-bit) Windows 10 Linux, Yocto |
Power Requirement | Voltage: +12V primary power supply input, +5V Stby optional Power Consumption: 28 W to 64 W (typ., variant dependent) |
Environment | Ambient Temperature; 0° … 60°C (operating), -25° … 85°C (storage) Extended temp. variants: -40 ... +85°C (operating) Humidity: 5 … 95% (operating, non-condensing), 5 … 95% (storage, non-condensing) |
Dimensions | 95mm x 95mm |
Certificates | UL / CE |
Cooling | Passive heat sink Active heat sink with fan Heat spreader with threaded or non-threaded standoffs |
Carrier | Small carrier board (Mini-ITX) as part of a starter kit Evaluation board in ATX form factor |
Order Info
Order No. | Description | Reference | Status |
---|---|---|---|
83343 | COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen V1807B, four-core, 3.35/3.8GHz, 35-54W TDP, 11 CU ; 2x DP/HDMI/DVI, LVDS (24 Bit, dual channel); VGA; 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; 4x PCIe x1 Gen 3, 4x PCIe Gen 2, PEG x8 Gen 3; TPM 2.0; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-3200; 0° … 60°C | MSC C6C-RYZ-V1807B-NN621C PCBFTX | PV |
83345 | COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen V1756B, four-core, 3.25/3.6GHz, 35-54W TDP, 8 CU ; 3x DP/HDMI/DVI, LVDS (24 Bit, dual channel); 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; 4x PCIe x1 Gen 3, 4x PCIe Gen 2, PEG x8 Gen 3; TPM 2.0; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-3200; 0° … 60°C | MSC C6C-RYZ-V1756B-NN221C PCBFTX | OR |
83347 | COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen V1605B, four-core, 2.0/3.6GHz, 12-25W TDP, 8 CU ; 3x DP/HDMI/DVI, LVDS (24 Bit, dual channel); 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; 4x PCIe x1 Gen 3, 4x PCIe Gen 2, PEG x8 Gen 3; TPM 2.0; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-2400; 0° … 60°C | MSC C6C-RYZ-V1605B-NN221C PCBFTX | PV |
83351 | COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen V1404I, four-core, 2.0/3.6GHz, 12-25W TDP, 8 CU ; 3x DP/HDMI/DVI, LVDS (24 Bit, dual channel); 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; 4x PCIe x1 Gen 3, 4x PCIe Gen 2, PEG x8 Gen 3; TPM 2.0; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-2400; -40° … 85°C | MSC C6C-RYZ-V1404I-NN221I PCBFTX | PV |
83349 | COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen V1202B, two-core, 2.3/3.2GHz, 12-25W TDP, 3 CU ; 3x DP/HDMI/DVI, Embedded DisplayPort (eDP); 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; 4x PCIe x1 Gen 3, 4x PCIe Gen 2, PEG x8 Gen 3; TPM 2.0; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-2400; 0° … 60°C | MSC C6C-RYZ-V1202B-NN120C PCBFTX | OR |
83353 | COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen R1606G, two-core, 2.6/3.5GHz, 12-25W TDP, 3 CU ; 2x DP/HDMI/DVI, LVDS (24 Bit, dual channel); 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; 2x PCIe x1 Gen 3, 4x PCIe Gen 2, PEG x4 Gen 3; TPM 2.0; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-2400; 0° … 60°C | MSC C6C-RYZ-R1606G-NN221C PCBFTX | PV |
83355 | COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen R1505G, two-core, 2.4/3.3GHz, 12-25W TDP, 3 CU ; 2x DP/HDMI/DVI, Embedded DisplayPort (eDP); 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; 2x PCIe x1 Gen 3, PEG x4 Gen 3; TPM 2.0; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-2400; 0° … 60°C | MSC C6C-RYZ-R1505G-NN100C PCBFTX | OR |
76062 | COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen R1505G, two-core, 2.4/3.3GHz, 12-25W TDP, 3 CU ; 2x DP/HDMI/DVI, LVDS (24 Bit, dual channel); 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; 2x PCIe x1 Gen 3, 4x PCIe Gen 2, PEG x4 Gen 3; TPM 2.0; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-2400; 0° … 60°C | MSC C6C-RYZ-R1505G-NN221C PCBFTX | OR |
83983 | COM Express Type 6 Compact module (95mm x 95mm); CPU: AMD Ryzen R1505G, two-core, 2.4/3.3GHz, 12-25W TDP, 3 CU ; 1x DP/HDMI/DVI, Embedded DisplayPort (eDP), VGA; 1x 1GbE; 2x SATA; 3x USB3, 8x USB2; TPM 2.0; 2x PCIe x1 Gen 3, PEG x4 Gen 3; 2x socket for DDR4 or DDR4ECC SO-DIMM; DDR4-2400; 0° … 60°C | MSC C6C-RYZ-R1505G-NN500C PCBFTX | PV |
PV = Preferred variant; OR = on Request (in OEM quantities only)
Accessories
Carrier Options
Order No. | Description | Reference |
---|---|---|
67295 | COM Express Type 6 Evaluation Carrier Board with PCI Express x4/x16 slot, USB 3.0/2.0, GbE, SATA, DisplayPort, eDP/LVDS, VGA and HD audio interfaces; Mini PCI Express socket, SD card slot, ATX power connector and single 12V power jack. Dimensions: 170mm x 170mm (Mini-ITX form factor) | MSC C6-MB-EV-001 PCBFTX |
41857 | COM Express Type 6 Evaluation Carrier Board with various PCI Express x1, x4 and x16 slots, USB 3.0/2.0, GbE, SATA, DisplayPort, HDMI, LVDS, eDP, VGA, HD audio interfaces; mSATA and Mini PCI Express sockets, POST code display, ATX power connector. Dimensions: 305 x 244 mm (ATX form factor) | MSC C6-MB-EVA PCBFTX |
Cooling Options
Order No. | Description | Reference |
---|---|---|
79809 | Fan kit for Heatsink MSC C6C-EL-0x HSI-xxx, MSC C6C-TLU-0x HSI-xxx, MSC C6C-WLU-0x HSI-xxx, MSC C6C-RYZ-0x HSI-xxx, PWM fan 80x80x15mm. | MSC C6C-FANKIT-01-HSF-001 |
84613 | Heatsink for C6C-RYZ. Single-piece aluminum profile, pressed in standoffs without thread (2.7mm inner diameter), screws and thermopad for the thermal contact to SOC. | MSC C6C-RYZ-01 HSI-001 |
83859 | Heatspreader for C6C-RYZ. Single-piece aluminum profile, pressed in standoffs without thread (2.7mm inner diameter), screws and thermopad for the thermal contact to SOC. | MSC C6C-RYZ-01 HSP-001 |
83881 | Heatspreader for C6C-RYZ. Single-piece aluminum profile, pressed in threaded standoffs (M2.5), screws and thermopad for the thermal contact to SOC. | MSC C6C-RYZ-02 HSP-001 |
Memory Options
Order No. | Description | Reference |
---|---|---|
83003 | 4GB DDR4-2400 SoDimm, 1.2V, ECC | M4DI-4GSSPCSJ-F |
89532 | 16GB DDR4 2666 SO-DIMM, sorting wide temp | M4DI-AGS1Q50K-C |
1147003 | 16GB DDR4-2666 SO-DIMM, ECC | M4DI-AGS1QC0K-C |
89531 | 8GB DDR4 3200 SO-DIMM, sorting wide temp | M4SE-8GS1N50M-C |
78199 | 4GB DDR4 2666 SO-DIMM | M4SI-4GSSNC0K-F M4SI-4GSXZC0K-C |
89646 | 4GB DDR4 2400 SO-DIMM, wide temp | M4SI-4GSSNISJ-F |
Support
Manual
MSC_C6C-SLU_KLU_WLU_RYZ_EL_Heatspreader_Montage_V05
Mechanical data
BIOS
Drivers
Win 10-64bit
MSC EAPI NG for modules with AMI BIOS
MSC EAPI WinXP Win7 Win10 x86 x64
MSC EAPI Linux