MSC Q7-EL

Intel® Atom™ x6000E / Pentium® / Celeron® N and J Series SOC

The new MSC Q7-EL module features Intel’s next-generation low-power, multi-core system-on-chip (SOC) Atom generation (codenamed “Elkhart Lake”). Built on 10nm process technology the SoC integrates the next generation Intel Atom processor core architecture and graphics accelerators, memory controller and rich I/O functionality into a single package. The module is designed for extended temperature range and 24/7 operation making it an ideal platform for mission critical tasks that require a reliable and performant compute base. It provides significant performance gains over previous Atom generations allowing for technology upgrades within existing power and cooling requirements defined by the system design.

The new MSC Q7-EL offers triple independent display support with a maximum of 4k resolution, DirectX 12, fast LPDDR4x memory with up to 16GB and optional IBECC capabilities, eMMC 5.1, USB 3.1 and PCIe Gen3 on a power saving and cost-efficient Q7 module.

Different SOCs with dual- and quad-core processors are supported by this design. In addition to an extensive set of interfaces and features, the MSC Q7-EL offers 1 Gigabit Ethernet with Time-Sensitive Networking (TSN) and 1 CAN-FD interface.

For evaluation and design-in of the MSC Q7-EL module, MSC provides a suitable Q7 2.1 development platform. A complete, ready-to-run Starterkit is also available.

Highlights

Intel Atom x6xxxRE, Real-time Embedded SKU´s, dual/quad-core (6W-12W)
Intel Atom x6xxxE, Embeddded SKU´s, dual/quad-core (6W-12W)
Intel Pentium/Celeron J64xx, PC Client SKU´s, quad-core (6W-12W)
Intel Pentium/Celeron N6xxx, PC Client SKU´s, dual/quad-core (6.5W-12W)
Integrated Intel UHD Graphics (Gen11)
Up to 16GB LPDDR4x SDRAM with IBECC (only Atom SKU´s)
Up to 256GB eMMC 5.1 Flash (optional)
2x SATA-III interface (6Gbps)
1x DP++
2x eDP 1.3 (1x DP) / MIPI-DSI 1.2 / 1 x dual channel LVDS
Triple Independent Display support

DirectX, OpenGL 4.5, OpenCL 1.2, Vulkan v1.1
Up to 4x PCI Express x1/x2/x4 Gen. 3
2x USB 3.1 Host interfaces
8x USB 2.0 Host interfaces
1x USB 3.0/2.0 Dual Role Port (Host/Device)
1x Gigabit Ethernet with TSN/TCC
1x SGMII Interface on SATA-Port1 (optional)
UART, LPC, SPI, I2C, SMBus
1x CAN-FD
HD Audio, SD Card interface
Trusted Platform Module (optional)
Qseven Rev. 2.1 compliant
UEFI Firmware

Specs

Technology	x86
Formfactor	Qseven
CPU	Intel Atom x6425RE Processor, quad-core 1.9GHz, 32EU, TCC, IBECC, 12W, IUC Intel Atom x6416RE Processor, quad-core 1.7GHz, 16EU, TCC, IBECC, 9W, IUC Intel Atom x6414RE Processor, quad-core 1.5GHz, 16EU, TCC, IBECC, 9W, IUC Intel Atom x6214RE Processor, dual-core 1.4GHz, 16EU, TCC, IBECC, 6W, IUC Intel Atom x6212RE Processor, dual-core 1.2GHz, 16EU, TCC, IBECC, 6W, IUC Intel Atom x6425E Processor, quad-core 2.0/3.0GHz, 32EU, IBECC, 12W, EUC Intel Atom x6413E Processor, quad-core 1.5/3.0GHz, 16EU, IBECC, 9W, EUC Intel Atom x6211E Processor, dual-core 1.3/3.0GHz, 16EU, IBECC, 6W, EUC Intel Pentium J6426 Processor, quad-core 2.0/3.0GHz, 32EU, 10W, PUC Intel Pentium N6415 Processor, quad-core 1.2/3.0GHz, 16EU, 6.5W, PUC Intel Celeron J6413 Processor, quad-core 1.8/3.0GHz, 16EU, 10W, PUC Intel Celeron N6211 Processor, quad-core 1.2/3.0GHz, 16EU, 6.5W, PUC Intel® Technologies: Enhanced Intel® SpeedStep® Technology Intel® Virtualization Technology (VTx-2, VT-d) Intel® Trusted Execution Engine (TXE) Intel® Time Coordinated Computing (TCC) Precision Time Measurement (PTM) Precision Time Measurement (PTP) IUC - Intel Industrial Use Conditions EUC - Intel Embedded Use Conditions PUC - Intel PC Client Use Conditions
Chipset	Integrated in SOC
RAM	Up to 16GB LPDDR4x SDRAM, up to 4267MT/s, IBECC (only Atom SKU´s), soldered
Flash	Up to 256GB eMMC 5.1 Flash (optional)
Storage Interfaces	2x SATA-III 6Gbps 1x SD 3.01/SDIO 3.0
USB	2x USB 3.1, 6x USB 2.0, 1x Dual Role Port (Host/Device)* or 1x USB 3.1, 8x USB 2.0, 1x Dual Role Port (Host/Device)* *One USB 3.1 port according to Qseven Rev. 2.1 (only SS signals)
Serial Interfaces	1x UART (no handshake)
Bus Interfaces	Up to 4x PCI-Express x1 Gen. 3 lanes 1x LPC Bus 1x I2C Bus 1x SPI Bus 1x SMBus 1x CAN-FD (Flexible Data-Rate)
Display Controller	Integrated Intel UHD Graphics (Gen11) Up to 32 execution units (EU) 3D Acceleration: DirectX, OpenGL 4.5, OpenCL 1.2, Vulkan 1.0 Video Decode: MPEG-2, H.265/HEVC (L5.1), H.264, (L5.2), VC-1, WMV9, VP8, VP9, MVC, JPEG/MJPEG
Display Interfaces	Three independent displays supported 1x DP++ 2x eDP 1.3 (1x DP)/ MIPI-DSI 1.2 / 1x dual channel LVDS Dual-Channel LVDS 24/18 bit up to 1920 x 1200 @ 60Hz or Embedded DisplayPort 1.3 up to 4096 x 2160 @ 60Hz and MIPI-DSI x4 Interface up to 2560 x 1600 @ 60Hz (optional)
Network Interface	10/100/1000Base-T 1x SGMII Interface on SATA-Port1 (optional)
Audio Interface	High Definition Audio
Security Device	Infineon Trusted Platform Module 2.0 (optional)
Miscellaneous	Watchdog Timer: Initiates system reset, (programmable, 1s … 255h) Fan Supply: PWM Speed Control for system fan on carrier board RTC battery: external System Monitoring: Voltage, Temperature, CPU Fan, System Fan
Feature Highlights	Qseven Rev.2.1 compliant
Firmware	AMI Aptio UEFI
OS Support	Windows 10 IoT Enterprise RS5 (64bit) Windows 10 IoT Core RS5 (64bit) Linux (Yocto Project)
Power Requirement	+5V +/-5% +5V Standby
Environment	Temperature Range: 0° … 60°C (operating) -25° … 85°C (storage) -40° … 85°C (operating industrial) Humidity: 5 … 95% (operating, non-condensing) 5 … 95% (storage, non-condensing)
Dimensions	70 x 70 mm
Certificates	UL / CE
Cooling	Heatspreader Heatsink
Carrier	MSC Q7-MB-EP5 MSC Q7-MB-EP6

Order Info

Order No.	Description	Reference	Status
76106	Qseven 2.1 module with Intel Atom x6425RE, Quad-Core (1.9GHz), 12W, 16GB LPDDR4x (3200 MT/s), IBECC, 32EU, TCC, 64GB eMMC, 1x GbE LAN, 2x USB 3.1, 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, IUC (Industrial use conditions), industrial temperature -40...+85°C	MSC Q7-EL-x6425RE-46N0211I PCBFTX	PV
76102	Qseven 2.1 module with Intel Atom x6414RE, Quad-Core (1.5GHz), 9W, 4GB LPDDR4x (3733 MT/s) IBECC, 16EU, TCC, 32GB eMMC, 1x GbE LAN, 2x USB 3.1, 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, IUC (Industrial use conditions), industrial temperature -40...+85°C	MSC Q7-EL-x6414RE-25N0211I PCBFTX	PV
76098	Qseven 2.1 module with Intel Atom x6212RE, Dual-Core (1.2GHz), 6W, 4GB LPDDR4x (3733 MT/s) IBECC, 16EU, TCC, 16GB eMMC, 1x GbE LAN, 2x USB 3.1, 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, IUC (Industrial use conditions), industrial temperature -40...+85°C	MSC Q7-EL-x6212RE-24N0211I PCBFTX	PV
76104	Qseven 2.1 module with Intel Atom x6425E, Quad-Core (2.0GHz/3.0GHz), 12W, 16GB LPDDR4x (3200 MT/s), IBECC, 32EU, 64GB eMMC, 1x GbE LAN, 2x USB 3.1, 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, EUC (Embedded use conditions), extended temperature -25°C...+85°C	MSC Q7-EL-x6425E-46N0211E PCBFTX	PV
76100	Qseven 2.1 module with Intel Atom x6413E, Quad-Core (1.5GHz/3.0GHz), 9W, 8GB LPDDR4x (3733 MT/s), IBECC, 16EU, 32GB eMMC, 1x GbE LAN, 2x USB 3.1, 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, EUC (Embedded use conditions), extended temperature -25°C...+85°C	MSC Q7-EL-x6413E-35N0211E PCBFTX	PV
76096	Qseven 2.1 module with Intel Atom x6211E, Dual-Core (1.3GHz/3.0GHz), 6W, 4GB LPDDR4x (3733 MT/s), IBECC, 16EU, 16GB eMMC, 1x GbE LAN, 2x USB 3.1, 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, EUC (Embedded use conditions), extended temperature -25°C...+85°C	MSC Q7-EL-x6211E-24N0211E PCBFTX	PV
98119	Qseven 2.1 module with Intel Atom x6425E, Quad-Core (2.0GHz/3.0GHz), 12W, 16GB LPDDR4x (3200 MT/s), IBECC, 32EU, no eMMC, 1x GbE LAN, 2x USB 3.1, 6x USB 2.0 (1x Host/Device), TPM 2.0, eDP, IUC (Industrial use conditions), industrial temperature -40...+85°C	MSC Q7-EL-x6425E-4NN0111I PCBFTX	OR
93069	Qseven 2.1 module with Intel Atom x6425E, Quad-Core (2.0GHz/3.0GHz), 12W, 8GB LPDDR4x (3733 MT/s), IBECC, 32EU, no eMMC, 1x GbE LAN, 2x USB 3.1, 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, EUC (Embedded use conditions), extended temperature -25°C...+85°C	MSC Q7-EL-x6425E-3NN0211E PCBFTX	OR
95692	Qseven 2.1 module with Intel Atom x6425RE, Quad-Core (1.9GHz), 12W, 16GB LPDDR4x (3200 MT/s), IBECC, 32EU, TCC, no eMMC, 1x GbE LAN, 2x USB 3.1, 6x USB 2.0 (1x Host/Device), TPM 2.0, eDP, IUC (Industrial use conditions), industrial temperature -40...+85°C	MSC Q7-EL-x6425RE-4NN0111I PCBFTX	OR
76094	Qseven 2.1 module with Intel Pentium J6426, Quad-Core (2.0GHz/3.0GHz), 10W, 16GB LPDDR4x (3200 MT/s), 32EU, 64GB eMMC, 1x GbE LAN, 2x USB 3.1, 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, PUC (PC Client use conditions), standard temperature 0...+60°C	MSC Q7-EL-J6426-46N0211C PCBFTX	OR
76108	Qseven 2.1 module with Intel Celeron J6413, Quad-Core (1.8GHz/3.0GHz), 10W, 8GB LPDDR4x (3733 MT/s), 16EU, 16GB eMMC, 1x GbE LAN, 2x USB 3.1, 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, PUC (PC Client use conditions), standard temperature 0...+60°C	MSC Q7-EL-J6413-34N0211C PCBFTX	OR

PV = Preferred variant; OR = on Request (in OEM quantities only)

Accessories

Carrier Options

Order No.	Description	Reference
67690	Qseven Rev. 2.0 compatible embedded platform (148 x 102mm), 10-28V input voltage, 1x RS232 on DB9 connector, 1x RS485 on pin header, 1x RS232 no handshake on pin header, dual RJ45 LAN connector with LED, 1x SATA, 1x mSATA slot, SD card holder, 1x USB 3.0 connector, 2x USB 2.0 connector, 1x USB 2.0 on pin row, 1x microUSB 2.0 OTG, CAN, I2C, LPC/ GPIO on pin header, I2C/SMBus, SPI, DisplayPort connector, LVDS/eDP on JILI30 connector, regulated backlight supply, mini PCI Express slot, HD Audio, CMOS battery. Commercial temperature range 0..+70°C	MSC Q7-MB-EP6-601 PCBFTX

Cooling Options

Order No.	Description	Reference
82416	Passive Heatsink for Q7-EL (only variants with Atom) with through-hole distance bolts, consisting of a single-piece aluminium profile with fins and thermo pad for the thermal contact to the CPU, M3 mounting holes for an optional fan	MSC Q7-EL-01 HSI-001
84847	Heatspreader for Q7-EL (only variants with Atom) with throughhole distance bolts, only offers a 70x65mm aluminium plane to mount a heatsink or thermally connect to a cooler	MSC Q7-EL-01 HSP-001
84848	Passive Heatsink for Q7-EL (only variants with Pentium/Celeron) with through-hole distance bolts, consisting of a single-piece aluminium profile with fins and thermo pad for the thermal contact to the CPU, M3 mounting holes for an optional fan	MSC Q7-EL-02 HSI-001
84849	Heatspreader for Q7-EL (only variants with Pentium/Celeron) with through-hole distance bolts, only offers a 70x65mm aluminium plane to mount a heatsink or thermally connect to a cooler	MSC Q7-EL-02 HSP-001
97724	Heatspreader for Q7-EL (only variants with Atom) with through-hole distance bolts and 4 through-holes in the heatrail part, all holes for countersunk screws, only offers a 70x65mm aluminium plane to mount a heatsink or thermally connect to a cooler	MSC Q7-EL-03-HSP-001
1053769	Heat rail for Q7 baseboards. Recommended for conductive heat transfer from the Q7 module to the Q7 baseboard. Already assembled on all MSC baseboards.	MSC Q7-XXX-01 HTR-001

Support

Manuals

MSC_Q7-EL_User-Manual

Last update: 06/05/2024 2.14 MB

Application Notes

App_Note_002_EDID_File_generation

Last update: 29/12/2022 292.49 KB

App_Note_012_QSeven_Baseboard_Design_Recommendations

Last update: 29/12/2022 223.44 KB

App_Note_015_MXM-II_Qseven_Connectors_Overview

Last update: 29/12/2022 715.61 KB

App_Note_016_Comparison_of_Thermal_characteristics_of_Q7_assemblies_in_housings

Last update: 29/12/2022 1.25 MB

App_Note_017_OS_Boot_support_for_different_media

Last update: 29/12/2022 147.99 KB

App_Note_018_Q7-MB-EPx_selection_guide

Last update: 29/12/2022 215.59 KB

App_Note_019_Activate_screen_after_WoL_from_sleep

Last update: 29/12/2022 243.99 KB

App_Note_021_Install_Win7_on_Recent_Intel_Architectures

Last update: 29/12/2022 635.75 KB

App_Note_022_MSC_BIOS_Configurator_Tool

Last update: 29/12/2022 513.83 KB

App_Note_028_MSC_AutoFLASH

Last update: 22/03/2023 357 KB

App_Note_030_Building_from_MSC_Git_V2_1

Last update: 27/08/2024 509.53 KB

App_Note_030_Addendum_Building_from_MSC_Git_2024-12-20

Last update: 20/12/2024 420.14 KB

App_Note_032_Secure_Boot

Last update: 29/12/2022 332.92 KB

App_Note_043_Converting_eMMC_from_MLC_to_pSLC.pdf

Last update: 03/01/2023 266.21 KB

Compliance documents

CHINA-ROHS_TRIA_Qseven_2024-12-16

Last update: 18/12/2024 133.27 KB

REACH-ROHS_TRIA_Qseven_2024-12-16

Last update: 18/12/2024 111.10 KB

Mechanical data

MSC_Mechanical_3D_information-AVE

Last update: 11/12/2023 213 KB

MSC_Q7-EL_3D

Last update: 22/03/2023 20 MB

MSC Q7-EL-01 HSI-001 3D

Last update: 04/08/2022 18.86 MB

MSC Q7-EL-01 HSP-001 3D

Last update: 04/08/2022 18.77 MB

MSC Q7-EL-02 HSI-001 3D

Last update: 04/08/2022 18.89 MB

MSC Q7-EL-02 HSP-001 3D

Last update: 14/04/2023 18.79 MB

MSC Q7-EL-03 HSP-001 3D

Last update: 14/04/2023 18.70 MB

BIOS

Download

MSC_BIOS-Configurator-Tool

Last update: 23/10/2024 205.83 KB

BIOS_Update_Q7-EL_V200_01

Last update: 15/07/2024 29.58 MB

BIOS_Update_Q7-EL_V121_01

Last update: 21/04/2023 28.68 MB

Drivers

Win 10-64bit

IntelGbE_231020_MR7

Last update: 28/03/2024 1.09 MB

Intel_Chipset_Device_Software_Production_MR7

Last update: 28/03/2024 5.19 MB

Intel_CSME_SW_2306.4.10.0_Consumer_MR7

Last update: 28/03/2024 900.96 MB

Intel_Graphics_Driver_MR7

Last update: 28/03/2024 492.07 MB

Intel_PSE_Win_Driver_MR7

Last update: 28/03/2024 556.41 KB

Intel_Serial_IO_5.123.1.1025_MR7

Last update: 28/03/2024 798.13 KB

Demo Images