MSC Q7-EL

Intel® Atom™ x6000E / Pentium® / Celeron® N and J Series SOC

The new MSC Q7-EL module features Intel’s next-generation low-power, multi-core system-on-chip (SOC) Atom generation (codenamed “Elkhart Lake”). Built on 10nm process technology the SoC integrates the next generation Intel Atom processor core architecture and graphics accelerators, memory controller and rich I/O functionality into a single package. The module is designed for extended temperature range and 24/7 operation making it an ideal platform for mission critical tasks that require a reliable and performant compute base. It provides significant performance gains over previous Atom generations allowing for technology upgrades within existing power and cooling requirements defined by the system design.

The new MSC Q7-EL offers triple independent display support with a maximum of 4k resolution, DirectX 12, fast LPDDR4x memory with up to 16GB and optional IBECC capabilities, eMMC 5.1, USB 3.1 and PCIe Gen3 on a power saving and cost-efficient Q7 module.

Different SOCs with dual- and quad-core processors are supported by this design. In addition to an extensive set of interfaces and features, the MSC Q7-EL offers 1 Gigabit Ethernet with Time-Sensitive Networking (TSN) and 1 CAN-FD interface.

For evaluation and design-in of the MSC Q7-EL module, MSC provides a suitable Q7 2.1 development platform. A complete, ready-to-run Starterkit is also available.

Highlights

  • Intel Atom x6xxxRE, Real-time Embedded SKU´s, dual/quad-core (6W-12W)
  • Intel Atom x6xxxE, Embeddded SKU´s, dual/quad-core (6W-12W)
  • Intel Pentium/Celeron J64xx, PC Client SKU´s, quad-core (6W-12W)
  • Intel Pentium/Celeron N6xxx, PC Client SKU´s, dual/quad-core (6.5W-12W)
  • Integrated Intel UHD Graphics (Gen11)
  • Up to 16GB LPDDR4x SDRAM with IBECC (only Atom SKU´s)
  • Up to 256GB eMMC 5.1 Flash (optional)
  • 2x SATA-III interface (6Gbps)
  • 1x DP++
  • 2x eDP 1.3 (1x DP) / MIPI-DSI 1.2 / 1 x dual channel LVDS
  • Triple Independent Display support
  • DirectX, OpenGL 4.5, OpenCL 1.2, Vulkan v1.1
  • Up to 4x PCI Express x1/x2/x4 Gen. 3
  • 2x USB 3.1 Host interfaces
  • 8x USB 2.0 Host interfaces
  • 1x USB 3.0/2.0 Dual Role Port (Host/Device)
  • 1x Gigabit Ethernet with TSN/TCC
  • 1x SGMII Interface on SATA-Port1 (optional)
  • UART, LPC, SPI, I2C, SMBus
  • 1x CAN-FD
  • HD Audio, SD Card interface
  • Trusted Platform Module (optional)
  • Qseven Rev. 2.1 compliant
  • UEFI Firmware

Specs

Technology x86
Formfactor Qseven
CPU Intel Atom x6425RE Processor, quad-core 1.9GHz, 32EU, TCC, IBECC, 12W, IUC
Intel Atom x6414RE Processor, quad-core 1.5GHz, 16EU, TCC, IBECC, 9W, IUC
Intel Atom x6212RE Processor, dual-core 1.2GHz, 16EU, TCC, IBECC, 6W, IUC
Intel Atom x6425E Processor, quad-core 2.0/3.0GHz, 32EU, IBECC, 12W, EUC
Intel Atom x6413E Processor, quad-core 1.5/3.0GHz, 16EU, IBECC, 9W, EUC
Intel Atom x6211E Processor, dual-core 1.3/3.0GHz, 16EU, IBECC, 6W, EUC
Intel Pentium J6426 Processor, quad-core 2.0/3.0GHz, 32EU, 10W, PUC
Intel Pentium N6415 Processor, quad-core 1.2/3.0GHz, 16EU, 6.5W, PUC
Intel Celeron J6413 Processor, quad-core 1.8/3.0GHz, 16EU, 10W, PUC
Intel Celeron N6211 Processor, quad-core 1.2/3.0GHz, 16EU, 6.5W, PUC
Intel® Technologies:
Enhanced Intel® SpeedStep® Technology
Intel® Virtualization Technology (VTx-2, VT-d)
Intel® Trusted Execution Engine (TXE)
Intel® Time Coordinated Computing (TCC)
Precision Time Measurement (PTM)
Precision Time Measurement (PTP)

IUC - Intel Industrial Use Conditions
EUC - Intel Embedded Use Conditions
PUC - Intel PC Client Use Conditions
Chipset Integrated in SOC
RAM Up to 16GB LPDDR4x SDRAM, up to 4267MT/s, IBECC (only Atom SKU´s), soldered
Flash Up to 256GB eMMC 5.1 Flash (optional)
Storage Interfaces 2x SATA-III 6Gbps
1x SD 3.01/SDIO 3.0
USB 2x USB 3.1, 6x USB 2.0, 1x Dual Role Port (Host/Device)* or
1x USB 3.1, 8x USB 2.0, 1x Dual Role Port (Host/Device)*
*One USB 3.1 port according to Qseven Rev. 2.1 (only SS signals)
Serial Interfaces 1x UART (no handshake)
Bus Interfaces Up to 4x PCI-Express x1 Gen. 3 lanes
1x LPC Bus
1x I2C Bus
1x SPI Bus
1x SMBus
1x CAN-FD (Flexible Data-Rate)
Display Controller Integrated Intel UHD Graphics (Gen11)
Up to 32 execution units (EU)
3D Acceleration: DirectX, OpenGL 4.5, OpenCL 1.2, Vulkan 1.0
Video Decode: MPEG-2, H.265/HEVC (L5.1), H.264, (L5.2), VC-1, WMV9, VP8, VP9, MVC, JPEG/MJPEG
Display Interfaces Three independent displays supported

1x DP++
2x eDP 1.3 (1x DP)/ MIPI-DSI 1.2 / 1x dual channel LVDS
Dual-Channel LVDS 24/18 bit up to 1920 x 1200 @ 60Hz or
Embedded DisplayPort 1.3 up to 4096 x 2160 @ 60Hz and
MIPI-DSI x4 Interface up to 2560 x 1600 @ 60Hz (optional)
Network Interface 10/100/1000Base-T
1x SGMII Interface on SATA-Port1 (optional)
Audio Interface High Definition Audio
Security Device Infineon Trusted Platform Module 2.0 (optional)
Miscellaneous Watchdog Timer:
Initiates system reset, (programmable, 1s … 255h)
Fan Supply:
PWM Speed Control for system fan on carrier board
RTC battery:
external
System Monitoring:
Voltage, Temperature, CPU Fan, System Fan
Feature Highlights Qseven Rev.2.1 compliant
Firmware AMI Aptio UEFI
OS Support Windows 10 IoT Enterprise RS5 (64bit)
Windows 10 IoT Core RS5 (64bit)
Linux (Yocto Project)
Power Requirement +5V +/-5%
+5V Standby
Environment Temperature Range:
0° … 60°C (operating)
-25° … 85°C (storage)
-40° … 85°C (operating industrial)
Humidity:
5 … 95% (operating, non-condensing)
5 … 95% (storage, non-condensing)
Dimensions 70 x 70 mm
Certificates UL / CE
Cooling Heatspreader
Heatsink
Carrier MSC Q7-MB-EP5
MSC Q7-MB-EP6

Order Info

Order No. Description Reference Status
76106 Qseven 2.1 module with Intel Atom x6425RE, Quad-Core (1.9GHz), 12W, 16GB LPDDR4x (3200 MT/s), IBECC, 32EU, TCC, 64GB eMMC, 1x GbE LAN, 2x USB 3.1, 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, IUC (Industrial use conditions), industrial temperature -40...+85°C MSC Q7-EL-x6425RE-46N0211I PCBFTX PV
76102 Qseven 2.1 module with Intel Atom x6414RE, Quad-Core (1.5GHz), 9W, 4GB LPDDR4x (3733 MT/s) IBECC, 16EU, TCC, 32GB eMMC, 1x GbE LAN, 2x USB 3.1, 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, IUC (Industrial use conditions), industrial temperature -40...+85°C MSC Q7-EL-x6414RE-25N0211I PCBFTX PV
76098 Qseven 2.1 module with Intel Atom x6212RE, Dual-Core (1.2GHz), 6W, 4GB LPDDR4x (3733 MT/s) IBECC, 16EU, TCC, 16GB eMMC, 1x GbE LAN, 2x USB 3.1, 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, IUC (Industrial use conditions), industrial temperature -40...+85°C MSC Q7-EL-x6212RE-24N0211I PCBFTX PV
76104 Qseven 2.1 module with Intel Atom x6425E, Quad-Core (2.0GHz/3.0GHz), 12W, 16GB LPDDR4x (3200 MT/s), IBECC, 32EU, 64GB eMMC, 1x GbE LAN, 2x USB 3.1, 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, EUC (Embedded use conditions), extended temperature -25°C...+85°C MSC Q7-EL-x6425E-46N0211E PCBFTX PV
76100 Qseven 2.1 module with Intel Atom x6413E, Quad-Core (1.5GHz/3.0GHz), 9W, 8GB LPDDR4x (3733 MT/s), IBECC, 16EU, 32GB eMMC, 1x GbE LAN, 2x USB 3.1, 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, EUC (Embedded use conditions), extended temperature -25°C...+85°C MSC Q7-EL-x6413E-35N0211E PCBFTX PV
76096 Qseven 2.1 module with Intel Atom x6211E, Dual-Core (1.3GHz/3.0GHz), 6W, 4GB LPDDR4x (3733 MT/s), IBECC, 16EU, 16GB eMMC, 1x GbE LAN, 2x USB 3.1, 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, EUC (Embedded use conditions), extended temperature -25°C...+85°C MSC Q7-EL-x6211E-24N0211E PCBFTX PV
76094 Qseven 2.1 module with Intel Pentium J6426, Quad-Core (2.0GHz/3.0GHz), 10W, 16GB LPDDR4x (3200 MT/s), 32EU, 64GB eMMC, 1x GbE LAN, 2x USB 3.1, 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, PUC (PC Client use conditions), standard temperature 0...+60°C MSC Q7-EL-J6426-46N0211C PCBFTX OR
76108 Qseven 2.1 module with Intel Celeron J6413, Quad-Core (1.8GHz/3.0GHz), 10W, 8GB LPDDR4x (3733 MT/s), 16EU, 16GB eMMC, 1x GbE LAN, 2x USB 3.1, 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, PUC (PC Client use conditions), standard temperature 0...+60°C MSC Q7-EL-J6413-34N0211C PCBFTX OR

PV = Preferred variant; OR = on Request (in OEM quantities only)

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