MSC SM2S-ALN

Intel Atom® processors x7000E
Intel® Core ™i3 processor
Intel® Processors N Series

The new MSC SM2S-ALN module features the Intel Atom® processors x7000E Series, Intel® Core ™i3 processor and Intel® Processors N Series (codenamed “Alderlake N”). The CPU architecture is based on the same Efficient-cores and Intel® UHD graphics driven by Xe architecture as the 12th Gen Intel® Core™ processors, thus easing up application migration across Intel® CPU performance and power ranges. With support for up to eight processor cores, the module fits to a wide range of applications including point-of-sales terminals, digital signage controllers, HMI solutions and medical equipment.

The new MSC SM2S-ALN offers triple independent display support with a maximum of 4k resolution, fast LPDDR5 memory with up to 16GB and optional IBECC capabilities, eMMC 5.1, USB 3.1 and PCIe Gen3 on a power saving and cost-efficient SMARC 2.1.1 module.

Different SOCs with dual-, quad- and eight-core processors are supported by this design. In addition to an extensive set of interfaces and features, the MSC SM2S-ALN offers 2 Gigabit Ethernet based on Intel® i226 and supports up to 2.5GbE bandwidth.

For evaluation and design-in of the MSC SM2S-ALN module, Avnet Embedded provides a suitable SMARC 2.1.1 development platform. A complete, ready-to-run Starterkit is also available.

Highlights

  • Up to eight processing cores
  • Power efficient processors, TDP 6 to 15W
  • Integrated Intel UHD Gen.12 graphics, max. 32 executing units .
  • Up to 16GB LPDDR5 SDRAM (IBECC for Atom SKU´s)
  • Up to 256GB eMMC 5.1 Flash (optional)
  • SATA-III interface (6Gbps)
  • 2x DP++
  • LVDS / Embedded DisplayPort and MIPI-DSI
  • Triple Independent Display support
  • 2x MIPI-CSI Camera Interface
  • Up to 4x PCI Express x1/x2/x4 Gen. 3
  • 2x USB 3.1 Host interfaces
  • 6x USB 2.0 Host interfaces
  • 2x Gigabit Ethernet (Intel® i226)
  • 1x SGMII Interface on PCIE-D (opt. only Atom SKU´s)
  • UART, SPI, I2C, SMBus
  • HD/I2S Audio
  • Trusted Platform Module
  • SMARC 2.1.1 compliant
  • UEFI Firmware

Specs

Technology x86
Formfactor SMARC™ 2.1.1 Short Size
CPU Intel® Core™ i3-N305, eight-core, 1.0GHz/1.8GHz, 32EU, 9/15W, PUC
Intel Atom® x7425E, four-core, 1.5GHz, 24EU, TCC, 12W, EUC
Intel Atom® x7213E, two-core, 1.7GHz, 16EU, TCC, 10W, EUC
Intel Atom® x7211E, two-core, 1.0GHz, 16EU, TCC, 6W, EUC
Intel® Processor N200, quad-core, 1.0GHz, 32EU, 6W, PUC
Intel® Processor N97, quad-core, 2.0GHz, 24EU, 12W, PUC
Intel® Processor N50, dual-core, 1.0GHZ, 16EU, 6W, PUC

EUC - Intel Embedded Use Conditions
PUC - Intel PC Client Use Conditions
Chipset Integrated in SOC
RAM Up to 16GB LPDDR5 SDRAM, up to 4800MT/s, IBECC (only Atom SKU´s), soldered
Flash Up to 256GB eMMC V5.1 Flash, soldered (optional)
Storage Interfaces 1x SATA-III 6Gbps
USB 2x USB 3.1 Host interfaces
6x USB 2.0 Host interfaces
Serial Interfaces 4x UART (two with handshake)
Bus Interfaces Up to 4x PCI-Express x1 Gen. 3 lanes
1x I2C Bus
1x SPI Bus (Boot)
1x SPI Bus (general purpose)/ eSPI (optional)
1x SMBus
Display Controller Integrated Intel UHD Graphics (Gen12)
Up to 32 execution units (EU)
Display Interfaces Three independent displays supported
2x DP++
Dual-Channel LVDS 24/18 bit up to 1920 x 1200 @ 60Hz or
Embedded DisplayPort 1.4b up to 4096 x 2304 @ 60Hz and
MIPI-DSI x4 Interface up to 1920 x 1080 @ 60Hz (optional)
Network Interface 2x 10/100/1000Base-T, up to 2.5G based on Intel i226
1x SGMII Interface on PCIE-D (opt. only Atom SKU´s)
Audio Interface High Definition Audio and I2S Audio
or 2x I2S Audio
Security Device Infineon Trusted Platform Module 2.0
Miscellaneous MIPI CSI-2 camera interface (CSI0, 2 lane)
MIPI CSI-2 camera interface (CSI1, 4 lane)
Watchdog Timer:
Initiates system reset, (programmable, 1s … 255h)
Fan Supply:
PWM Speed Control for system fan on carrier board
RTC battery:
external
System Monitoring:
Voltage, Temperature, CPU Fan, System Fan
Feature Highlights SMARC™ 2.1.1 compliant
Firmware AMI Aptio UEFI
OS Support Windows 10 IoT Enterprise 2021 LTSC
Yocto Project (LTS kernel 2021)
Power Requirement +5V +/-5%
+5V Standby
Environment Temperature Range:
Commercial: 0° … 60°C (operating) -20° … 85°C (storage)

Humidity:
5 … 95% (operating, non-condensing)
5 … 95% (storage, non-condensing)
Dimensions 82 x 50 mm
Certificates UL / CE
Cooling Heatspreader
Heatsink
Carrier MSC SM2-MB-EP1

Order Info

Order No. Description Reference Status
tbd SMARC 2.1.1 module with Intel® Core™ i3-N305, Eight-Core (1.0GHz/ 1.8GHz), 9/15W, 16GB LPDDR5 (4800 MT/s), 32EU, 32GB eMMC, 2x GbE LAN, 2x USB 3.1, 6x USB 2.0, TPM 2.0, LVDS, PUC (PC Client use conditions), commercial temperature 0°C...+60°C MSC SM2S-ALN-i3N305-1 ES1 PCBES OR
tbd SMARC 2.1.1 module with Intel® Processor N97, Quad-Core (2.0 GHz), 12W, 8GB LPDDR5 (4800 MT/s), 24EU, 32GB eMMC, 2x GbE LAN, 2x USB 3.1, 6x USB 2.0, TPM 2.0, LVDS, PUC (PC Client use conditions), commercial temperature 0°C...+60°C MSC SM2S-ALN-N97-1 ES1 PCBES OR
tbd SMARC 2.1.1 module with Intel® Processor N50, Dual-Core (1.0 GHz), 12W, 8GB LPDDR5 (4800 MT/s), 16EU, 16GB eMMC, 2x GbE LAN, 2x USB 3.1, 6x USB 2.0, TPM 2.0, eDP, SGMII, PUC (PC Client use conditions), commercial temperature 0°C...+60°C MSC SM2S-ALN-N50-2 ES1 PCBES OR
tbd SMARC 2.1.1 module with Intel Atom® x7425E, Quad-Core (1.5 GHz), 12W, 16GB LPDDR5 (4800 MT/s), 24EU, TCC, 32GB eMMC, 2x GbE LAN, 2x USB 3.1, 6x USB 2.0, TPM 2.0, LVDS, EUC (Embedded use conditions), commercial temperature 0°C...+60°C MSC SM2S-ALN-x7425E-1 ES1 PCBES OR
tbd SMARC 2.1.1 module with Intel Atom® x7213E, Dual-Core (1.7 GHz), 10W, 4GB LPDDR5 (4800 MT/s), 16EU, TCC, 16GB eMMC, 2x GbE LAN, 2x USB 3.1, 6x USB 2.0, TPM 2.0, LVDS, EUC (Embedded use conditions), commercial temperature 0°C...+60°C MSC SM2S-ALN-x7211E-1 ES1 PCBES OR

PV = Preferred variant; OR = on Request (in OEM quantities only)

Support


Copyright ©2024 Avnet, Inc. All rights reserved.