MSC SM2S-EL

Intel® Atom™ x6000 / Pentium® / Celeron® N and J Series SOC

The new MSC SM2S-EL module features Intel’s next-generation low-power, multi-core system-on-chip (SOC) Atom generation (codenamed “Elkhart Lake”). Built on 10nm process technology the SoC integrates the next generation Intel Atom processor core architecture and graphics accelerators, memory controller and rich I/O functionality into a single package. The module is designed for extended temperature range and 24/7 operation making it an ideal platform for mission critical tasks that require a reliable and performant compute base. It provides significant performance gains over previous Atom generations allowing for technology upgrades within existing power and cooling requirements defined by the system design.
The new MSC SM2S-EL offers triple independent display support with a maximum of 4k resolution, DirectX 12, fast LPDDR4x memory with up to 16GB and optional IBECC capabilities, eMMC 5.1, USB 3.1 and PCIe Gen3 on a power saving and cost-efficient SMARC 2.1.1 Short Size module.
Different SOCs with dual- and quad-core processors are supported by this design. In addition to an extensive set of interfaces and features, the MSC SM2S-EL offers 2 Gigabit Ethernet with Time-Sensitive Networking (TSN) and 2 CAN-FD interfaces.
For evaluation and design-in of the MSC SM2S-EL module, Avnet Embedded provides a suitable SMARC 2.1.1 development platform. A complete, ready-to-run Starterkit is also available.

Highlights

  • Intel Atom x6xxxRE, Real-time Embedded SKU´s, dual/quad-core (6W-12W)
  • Intel Atom x6xxxE, Embeddded SKU´s, dual/quad-core (6W-12W)
  • Intel Pentium/Celeron J64xx, PC Client SKU´s,quad-core (6W-12W)
  • Intel Pentium/Celeron N6xxx, PC Client SKU´s, dual/quad-core (6W-12W)
  • Integrated Intel UHD Graphics (Gen11)
  • Up to 16GB LPDDR4x SDRAM with IBECC (only Atom SKU´s)
  • Up to 256GB eMMC 5.1, Flash (optional)
  • SATA-III interface (6Gbps)
  • 1x DisplayPort 1.4 / HDMI™ 2.0b
  • 1x DisplayPort 1.4
  • LVDS / Embedded DisplayPort and MIPI-DSI
  • Triple Independent Display support
  • DirectX, OpenGL 4.5, OpenCL 1.2, Vulkan v1.1
  • Up to 4x PCI Express x1/x2/x4 Gen. 3
  • 2x USB 3.1 Host interfaces (1x Host/Device)
  • 6x USB 2.0 Host interfaces (1x Host/Device)
  • 2x Gigabit Ethernet with TSN/TCC
  • 1x SGMII Interface on PCIE-D (optional)
  • UART, SPI, I2C, SMBus
  • 2x CAN-FD
  • HD/I2S Audio, SD Card interface
  • Trusted Platform Module (optional)
  • SMARC 2.1 compliant
  • UEFI Firmware

Specs

Technology x86
Formfactor SMARC™ Short Size
CPU ntel Atom x6425RE Processor, quad-core, 1.9GHz, 32EU, TCC, IBECC, 12W, IUC
Intel Atom x6414RE Processor, quad-core, 1.5GHz, 16EU, TCC, IBECC, 9W, IUC
Intel Atom x6212RE Processor, dual-core, 1.2GHz, 16EU, TCC, IBECC, 6W, IUC
Intel Atom x6425E Processor, quad-core, 2.0/3.0GHz, 32EU, IBECC, 12W, EUC
Intel Atom x6413E Processor, quad-core, 1.5/3.0GHz, 16EU, IBECC, 9W, EUC
Intel Atom x6211E Processor, dual-core, 1.3/3.0GHz, 16EU, IBECC, 6W, EUC
Intel Pentium J6426 Processor, quad-core,2.0/3.0GHz, 32EU, 10W, PUC
Intel Pentium N6415 Processor, quad-core, 1.2/3.0GHz, 16EU, 6W, PUC
Intel Celeron J6413 Processor, quad-core, 1.8/3.0GHz, 16EU, 10W, PUC
Intel Celeron N6211 Processor, quad-core, 1.2/3.0GHz, 16EU, 6W, PUC
Intel® Technologies:
Enhanced Intel® SpeedStep® Technology
Intel® Virtualization Technology (VTx-2, VT-d)
Intel® Trusted Execution Engine (TXE)
Intel® Time Coordinated Computing (TCC)
Precision Time Measurement (PTM)
Precision Time Measurement (PTP)
IUC - Intel Industrial Use Conditions
EUC - Intel Embedded Use Conditions
PUC - Intel PC Client Use Conditions
Chipset Integrated in SOC
RAM Up to 16GB LPDDR4x SDRAM, up to 4267MT/s, IBECC (only Atom SKU´s), soldered
Flash Up to 256GB UFS 2.0 Flash (optional)
Storage Interfaces 1x SATA-III 6Gbps
1x SD 3.01/SDIO 3.0
USB 2x USB 3.1 Host interfaces (1x Host/Device)
6x USB 2.0 Host interfaces (1x Host/Device)
Serial Interfaces 4x UART (two with handshake)
Bus Interfaces Up to 4x PCI-Express x1 Gen. 3 lanes
1x I2C Bus
1x SPI Bus (Boot)
1x SPI Bus (general purpose)/ eSPI (optional)
1x SMBus
2x CAN-FD (Flexible Data-Rate)
Display Controller Integrated Intel UHD Graphics (Gen11)
Up to 32 execution units (EU)
3D Acceleration: DirectX, OpenGL 4.5, OpenCL 1.2, Vulkan 1.0
Video Decode: MPEG-2, H.265/HEVC (L5.1), H.264, (L5.2), VC-1, WMV9, VP8,
VP9, MVC, JPEG/MJPEG
Display Interfaces Three independent displays supported
2x DP++
Dual-Channel LVDS 24/18 bit up to 1920 x 1200 @ 60Hz or
Embedded DisplayPort 1.3 up to 4096 x 2160 @ 60Hz and
MIPI-DSI x4 Interface up to 2560 x 1600 @ 60Hz (optional)
Network Interface 2x 10/100/1000Base-T
1x SGMII Interface on PCIE-D (optional)
Audio Interface High Definition Audio and I2S Audio
or 2x I2S Audio
Security Device Infineon Trusted Platform Module 2.0 (optional)
Miscellaneous Watchdog Timer:
Initiates system reset, (programmable, 1s … 255h)
Fan Supply:
PWM Speed Control for system fan on carrier board
RTC battery:
external
System Monitoring:
Voltage, Temperature, CPU Fan, System Fan
Feature Highlights SMARC™ 2.1 compliant
Firmware AMI Aptio UEFI
OS Support Windows 10 IoT Enterprise RS5 (64bit)
Windows 10 IoT Core RS5 (64bit)
Linux (Yocto Project)
Power Requirement +5V +/-5%
+5V Standby
Environment Temperature Range:
0° … 60°C (operating)
-25° … 85°C (storage)
-40° … 85°C (operating industrial)
Humidity:
5 … 95% (operating, non-condensing)
5 … 95% (storage, non-condensing)
Dimensions 82 x 50 mm
Certificates UL / CE
Cooling Heatspreader
Heatsink
Carrier MSC SM2-MB-EP1

Order Info

Order No. Description Reference Status
 88129 SMARC 2.1.1 module with Intel Atom x6425RE, Quad-Core (1.9GHz), 12W, 16GB LPDDR4x (3200 MT/s) IBECC, 32EU, TCC, 64GB eMMC, 2x GbE LAN, 2xUSB 3.1 (1x Host/Device), 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, IUC (Industrial use conditions), industrial temperature -40...+85°C MSC SM2S-EL-x6425RE-46N0281I PCBFTX  PV
 87436 SMARC 2.1.1 module with Intel Atom x6425RE, Quad-Core (1.9GHz), 12W, 4GB LPDDR4x (3733 MT/s) IBECC, 32EU, TCC, 4GB eMMC, 2x GbE LAN, SGMII on PCIe_D, 2x USB 3.1 (1x Host/Device), 6x USB 2.0 (1x Host/Device), 2x DP++, TPM 2.0, eDP, IUC (Industrial use conditions), extended temperature -25°C...+85°C MSC SM2S-EL-x6425RE-22N0191E PCBFTX  OR
 88125  SMARC 2.1.1 module with Intel Atom x6414RE, Quad-Core (1.5GHz), 9W, 4GB LPDDR4x (3733 MT/s) IBECC, 16EU, TCC, 32GB eMMC, 2x GbE LAN, SGMII on PCIe_D, 2x USB 3.1 (1x Host/Device), 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, IUC (Industrial use conditions), industrial temperature -40...+85°C MSC SM2S-EL-x6414RE-25N0291I PCBFTX  PV
 88121 SMARC 2.1.1 module with Intel Atom x6212RE, Dual-Core (1.2GHz), 6W, 4GB LPDDR4x (3733 MT/s) IBECC, 16EU, TCC, 16GB eMMC, 2x GbE LAN, 2x USB 3.1 (1x Host/Device), 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, IUC (Industrial use conditions), industrial temperature -40...+85°C MSC SM2S-EL-x6212RE-24N0281I PCBFTX  PV
88127 SMARC 2.1.1 module with Intel Atom x6425E, Quad-Core (2.0GHz/3.0GHz), 12W, 16GB LPDDR4x (3200 MT/s), IBECC, 32EU, 64GB eMMC, 2x GbE LAN, 2x USB 3.1 (1x Host/Device), 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, EUC (Embedded use conditions), extended temperature -25°C...+85°C MSC SM2S-EL-x6425E-46N0281E PCBFTX PV
88123 SMARC 2.1.1 module with Intel Atom x6413E, Quad-Core (1.5GHz/3.0GHz), 9W, 8GB LPDDR4x (3733 MT/s), IBECC, 16EU, 32GB eMMC, 2x GbE LAN, SGMII on PCIe_D, 2x USB 3.1 (1x Host/Device), 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, EUC (Embedded use conditions), extended temperature -25°C...+85°C MSC SM2S-EL-x6413E-35N0291E PCBFTX  PV
88119 SMARC 2.1.1 module with Intel Atom x6211E, Dual-Core (1.3GHz/3.0GHz), 6W, 4GB LPDDR4x (3733 MT/s), IBECC, 16EU, 16GB eMMC, 2x GbE LAN, 2x USB 3.1 (1x Host/Device), 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, EUC (Embedded use conditions), extended temperature -25°C...+85°C MSC SM2S-EL-x6211E-24N0281E PCBFTX PV
88116 SMARC 2.1.1 module with Intel Pentium J6426, Quad-Core (2.0GHz/ 3.0GHz), 10W, 16GB LPDDR4x (3200 MT/s), 32EU, 64GB eMMC, 2x GbE LAN, 2x USB 3.1 (1x Host/Device), 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, PUC (PC Client use conditions), standard temperature 0...+60°C MSC SM2S-EL-J6426-46N0281C PCBFTX PV
88114 SMARC 2.1.1 module with Intel Celeron J6413, Quad-Core (1.8GHz/ 3.0GHz), 10W, 8GB LPDDR4x (3733 MT/s), 16EU, 16GB eMMC, 2x GbE LAN, 2x USB 3.1 (1x Host/Device), 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, PUC (PC Client use conditions), standard temperature 0...+60°C MSC SM2S-EL-J6413-34N0281C PCBFTX PV

PV = Preferred variant; OR = on Request (in OEM quantities only)

Accessories

Carrier Options

Order No. Description Reference
68488 SMARC 2.0 Embedded Platform with PCI Express x4 slot, GbE, SATA, USB 3.0, USB 2.0, USB 2.0 OTG, RS232, CAN, SPI, eSPI, SMBus, I2C and GPIO interface, LVDS/eDP, DisplayPort and HDMI display interface, regulated backlight supply, HD/I2S audio interface, MIPI CSI-2 camera interface, mini PCI Express card slot, SD card slot, fan connector, CMOS battery, Mini-ITX form factor (170 x 170 mm), ATX power connector and single 12V/24V power jack, commercial temperature range 0..+70°C MSC SM2-MB-EP1-001 PCBFTX
85087 SMARC 2.x compatible embedded platform (146 x 80mm), 10-36V input voltage, 3x RS232, 1x RS485, dual RJ45 LAN with LED (1 x LAN i210), 1x M.2 2280 Key M slot, mPCIe slot, 1x USB 3.0 Type A, 1x USB 3.0/ DisplayPort Type C , 1x USB 2.0 Type A, 1x USB 2.0 internal, 1x μUSB 2.0 Host/Device, 2x SPI, I²C, 12 GPIO on FC, 1x DisplayPort++ , LVDS/ eDP/DSI on JILI30 connector, μSD Card Slot, regulated backlight supply, HD Audio with amplifier, system fan connector, camera connector, RTC battery. Industrial temperature range -40..+85°C, x86 full version MSC SM2S-MB-EP5-001 PCBFTX
83979 SMARC 2.x compatible embedded platform (146 x 80mm), 12V input voltage, 3x RS232, 1x RS485, dual RJ45 LAN with LED, 1x M.2 2280 Key M slot , 1x USB 2.0 Type A, 1x USB3.0 Type A, 1x USB 2.0 internal, 1x μUSB 2.0 Host/Device, 2x SPI, 12 GPIO on FC, 1x DisplayPort++ , LVDS/eDP/DSI on JILI30 connector, regulated backlight supply, RTC battery, Industrial temperature range -40..+85°C, x86 slim version MSC SM2S-MB-EP5-003 PCBFTX

Cooling Options

Order No. Description Reference
82414 Passive Heatsink for SM2S-EL variants with Atom processor, consisting of a single-piece aluminium pin cooler and thermal pad for contact to the processor, with 2.7mm through-hole standoffs MSC SM2S-EL-01 HSI-001
85122 Heatspreader for SM2S-EL variants with Atom processor, consisting of a single-piece aluminium plane and thermal pad for contact to the processor, with 2.7mm through-hole standoffs MSC SM2S-EL-01 HSP-001
88512 Passive Heatsink for SM2S-EL variants with Pentium/Celeron processor, consisting of a single-piece aluminium pin cooler and thermal pad for contact to the processor, with 2.7mm through-hole standoffs MSC SM2S-EL-02 HSI-001
88511 Heatspreader for SM2S-EL variants with Pentium/Celeron processor, consisting of a single-piece aluminium plane and thermal pad for contact to the processor, with 2.7mm through-hole standoffs MSC SM2S-EL-02 HSP-001

Support




Win 10-64bit







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