Avnet Embedded integrates 12th Gen Intel® Core™ processors into high-performance COM Express™ Compact module family

Stutensee, Germany – June, 2022 – At embedded world 2022 in hall 3A, booth 135, Avnet Embedded presents the powerful MSC C6C-ALP COM Express™ Type 6 module family integrating the 12th Gen Intel® Core™ P-series and U-series processors into the small COM Express™ Compact form factor (95 x 95mm). The scalable MSC C6C-ALP product family offers a wide selection of CPU variants with scalable computing performance and energy efficiency.

The modular MSC C6C-ALP COM Express™ module family is specified for the commercial ambient temperature range from 0 to 60°C and is ideal for different industrial applications, which require outstanding performance on a small form factor. Typical examples are applications in medical equipment, process control, HMI terminals, transportation, and intelligent kiosk equipment.

For the rapid development of innovative embedded products, Avnet Embedded offers an entire ecosystem of suitable starter kit, board support package and design-in support for its MSC C6C-ALP module family. The long-term availability for its boards protects customers’ system investments. In addition, the COM Express™ standard enables performance scaling and migrating to future technology upgrades.

With the MSC C6C-ALP module family, Avnet Embedded expands its broad COM Express™ product portfolio at the higher end of the performance range. In January 2022, the computer-on-module specialist has introduced the MSC C6B-ALP COM Express™ module family based on 12th Gen Intel® Core™ processor technology in the COM Express™ Basic form factor (125 x 95mm).

Technical specifications:
The powerful MSC C6C-ALP COM Express™ Type 6 module family is equipped with 12th Gen Intel® Core™ P-series and U-series processors (codenamed „Alder Lake P-series and U-series“). The new Intel® performance hybrid architecture features Performance-cores and Efficient-cores with the Intel® Thread Director providing intelligent workload optimization. The architecture scales up to twelve cores and sixteen threads at 28W thermal design power (TDP). For applications with need for lower power dissipation, selected processor variants can be operated down to 12W TDP. The integrated Intel® Iris® Xe Architecture Graphics with up to 96 execution units (EUs) ensures high graphics performance.

For highest data throughput the module enables fast LPDDR5-5200 memory technology. Carried out as memory-down, the MSC C6B-ALP COM Express™ modules can be assembled with up to 32GB main memory.

The MSC C6C-ALP modules can be connected to the COM Express™ carrier board via up to eight PCIe Gen 3 lanes and four lanes PCIe Gen 4. The Ethernet interface provides up to 2.5GbE bandwidth based on the Intel i226 network controller. Additionally, four USB 3.2 Gen 1/2 and eight USB 2.0 ports, and two UARTs are available. The powerful boards can drive up to four independent displays and features three DisplayPort/HDMI interfaces, one LVDS and Embedded DisplayPort interface, and optional VGA. Mass storage devices can be connected via two SATA 6Gb/s channels. Optionally, the computer-on-modules are equipped with up to 1 TB NVMe SSD.

Avnet Embedded develops all module families in its own design centers and manufactures the boards in highly automated production facilities.

For more information, please visit: https://embedded.avnet.com/product/msc-c6c-alp/

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