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MSC HCA-RLP

Intel® Core™ 13th Generation

The MSC HCA-RLP COM-HPC Client module features the 13th Gen Intel® Core™ processor, giving application designers a great variety of choices of power efficient and performant compute solutions. Offering a great scalability of performance, the module is ideal for compute intense applications in automation, instrumentation, high-end medical equipment, transportation, and video surveillance. The Intel® performance hybrid architecture combines Performance-cores and Efficient-cores with the Intel® Thread Director providing intelligent workload optimization. The architecture scales up to fourteen cores and twenty threads at 45/35W thermal design power (TDP). The board is ideal for applications requiring support for extended temperature range and 24/7 continuous operation.

For highest data throughput the module enables fast DDR5-4800 memory technology with up to sixty-four GB SO-DIMM based memory. Module I/O comprises up to eight PCIe Gen 3 lanes, up to eight PCIe Gen 4 lanes and an optional eight lane PEG port capable of PCIe Gen 4. The two Ethernet interfaces provide up to 2.5GbE bandwidth each based on the Intel i226 network controller. Further high-speed I/O can utilize USB ports featuring USB4 and USB 3.2.

System investments are well protected through long-term availability of the module, designed, and manufactured by Avnet Embedded. In addition, the COM-HPC standard enables performance scaling and migrating applications to future technology upgrades when they become available.

Highlights

  • COM-HPC Client module, Size A
  • 13th Gen Intel® Core™ processors
  • Scalable CPU performance
  • Up to fourteen cores, twenty threads
  • Industrial grading options (Intel® TCC, TSN, IBECC, ext. Temp., 24/7)
  • Up to 64GB DDR5-4800 SDRAM, dual channel
  • Intel® Iris® Xe architecture Graphics, up to 96 EUs
  • Three DisplayPort/HDMI interfaces
  • Embedded DisplayPort interface
  • Up to four independent displays
  • PCI Express® Gen 3, up to 8 lanes, PCI Express® Gen 4, up to 2×4
  • PEG 1×8, PCIe Gen 4/5 (optional)
  • Two USB4, two USB 3.2 Gen2, eight USB 2.0 ports
  • Two UARTs
  • Optional on-board NVMe SSD, up to 1TB
  • Optional two SATA 6Gb/s mass storage interfaces
  • Two 1 / 2.5 Gb Ethernet ports (Intel® i226)
  • Trusted Platform Module TPM 2.0
  • Long-term product availability

Specs

Technology x86
Formfactor COM-HPC Size A
CPU 13th Gen Intel® Core™ processors
H-series
Intel® Core™ i7-13800HE 6P+8E/20T, 2.5GHz, 96 EUs, 24MB L3, 45/35W cTDP
Intel® Core™ i7-13800HRE 6P+8E/20T, 2.5GHz, 96 EUs, 24MB L3, 45/35W cTDP,
TCC/TSN, IBECC, ET
Intel® Core™ i5-13600HE 4P+8E/16T, 2.7GHz, 80 EUs, 18MB L3, 45/35W cTDP
Intel® Core™ i5-13600HRE 4P+8E/16T, 2.7GHz, 80 EUs, 18MB L3, 45/35W cTDP,
TCC/TSN, IBECC, ET
Intel® Core™ i3-13300HE 4P+4E/12T, 2.1GHz, 48 EUs, 12MB L3, 45/35W cTDP
Intel® Core™ i3-13300HRE 4P+4E/12T, 2.1GHz, 48 EUs, 12MB L3, 45/35W cTDP,
TCC/TSN, IBECC, ET

P-series
Intel® Core™ i7-1370PE 6P+8E/20T, 1.9GHz, 96 EUs, 24MB L3, 28/20W cTDP
Intel® Core™ i7-1370PRE 6P+8E/20T, 1.9GHz, 96 EUs, 24MB L3, 28/20W cTDP,
TCC/TSN, IBECC, ET
Intel® Core™ i5-1350PE 4P+8E/16T, 1.8GHz, 80 EUs, 12MB L3, 28/20W cTDP
Intel® Core™ i5-1350PRE 4P+8E/16T, 1.8GHz, 80 EUs, 12MB L3, 28/20W cTDP,
TCC/TSN, IBECC, ET
Intel® Core™ i5-1340PE 4P+8E/16T, 1.8GHz, 80 EUs, 12MB L3, 28/20W cTDP
Intel® Core™ i3-1320PE 4P+4E/12T, 1.7GHz, 48 EUs, 12MB L3, 28/20W cTDP
Intel® Core™ i3-1320PRE 4P+4E/12T, 1.7GHz, 48 EUs, 12MB L3, 28/20W cTDP,
TCC/TSN, IBECC, ET, TCC/TSN, IBECC, ET

U-series
Intel® Core™ i7-1365UE 2P+8E/12T, 1.7GHz, 96 EUs, 12MB L3, 15/12W cTDP
Intel® Core™ i7-1365URE 2P+8E/12T, 1.7GHz, 96 EUs, 12MB L3, 15/12W cTDP,
TCC/TSN, IBECC, ET
Intel® Core™ i5-1345UE 2P+8E/12T, 1.4GHz, 80 EUs, 12MB L3, 15/12W cTDP
Intel® Core™ i5-1345URE 2P+8E/12T, 1.4GHz, 80 EUs, 12MB L3, 15/12W cTDP,
TCC/TSN, IBECC, ET
Intel® Core™ i5-1335UE 2P+8E/12T, 1.3GHz, 80 EUs, 12MB L3, 15/12W cTDP
Intel® Core™ i3-1315UE 2P+4E/8T, 1.2GHz, 64 EUs, 10MB L3, 15/12W cTDP
Intel® Core™ i3-1315URE 2P+4E/8T, 1.2GHz, 64 EUs, 10MB L3, 15/12W cTDP,
TCC/TSN, IBECC, ET
Intel® Processor U300E 1P+4E/6T, 1.1GHz, 48 EUs, 8MB L3, 15/12W cTDP

Note: P core base frequency at nominal TDP shown, other clock frequencies supported
Chipset Integrated into SoC
RAM 2x 262-pin SO-DIMM socket for up to 2x 32GB DDR5 SDRAM (DDR5-4800); dual channel operation; minimum capacity 1x 8GB single channel operation
Storage Interfaces 2x SATA channels (up to 6Gb/s), optional
optional on-board NVMe, 64GB to 1TB
USB 2x USB4 on COM-HPC USB[0:1]_SSTX/RX
2x USB 3.2 (Gen 1 & 2) on COM-HPC USB[2:3]_SSTX/RX
8x USB 2.0 on COM-HPC USB[0:7]
Serial Interfaces 2x high-speed serial ports
Bus Interfaces PCI Express® Graphics (PEG) 1x8, PCIe Gen 4/5 on COM-HPC PCIe[16:23]¹
PCI Express® Gen 4, up to 2x4 on COM-HPC PCIe[8:15]
PCI Express® Gen 3, up to 8 lanes, flexible bifurcation options on COM-HPC PCIe[0:7]
¹ Available on H-series processors
Display Controller Intel® Iris® Xe architecture Graphics, Up to 96 execution units (EU)
H.264/AVC, H.265/HEVC, AV1, MJPEG encode/decode/transcode.
Display Interfaces Four independent display streams
3x Digital Display Interface (DP 1.4a, HDMI 2.0b)
1x Embedded DisplayPort 1.4b
Network Interface Two 10/100/1000Base-TX, 2.5G² based on Intel i226, TSN support
² Available bandwidths depending on carrier design
I-Temp variants: Intel® i226-IT
C-Temp variants: Intel® i226-LM
Audio Interface High Definition Audio
Security Device TPM 2.0
Miscellaneous Watchdog Timer:
Initiates system reset, programmable

Fan Supply:
4-pin header for CPU fan, PWM speed controlled
and PWM speed control for system fan supported

RTC battery:
external

System Monitoring:
voltage, temperature, CPU fan, system fan
Feature Highlights COM-HPC Client, Size A
Firmware UEFI Firmware:
AMI Aptio® V

Security:
TPM 2.0 support, TCG compliant

Power Management:
ACPI
Active fan control

USB:
USB legacy support (keyboard, mouse, storage)

Monitoring:
System Monitoring
Health Monitoring

MSC Adv. Boot Device Selection: Boot device priority setting based on physical interfaces
OS Support Windows 10 IoT Enterprise 2021 LTSC
BSP for Linux (Yocto)
Power Requirement Voltage:
+8V to +20V, +5V Stby optional, +3V RTC voltage

Power Consumption:
tbd W to tbd W (typ.)
Environment Ambient Temperature:
0° … 60°C (operating)
-25° … 85°C (storage)
Extended temp. variants: -40 ... +85°C (operating)

Humidity:
5 … 95% (operating, non-condensing),
5 … 95% (storage, non-condensing)
Dimensions 120 x 95
Certificates UL / CE

Order Info

Order No. Description Reference Status
tbd COM-HPC Client Size A module (120mm x 95mm); CPU: Intel i7-13800HE 14C/20T, vPro, 2.1GHz, 45/35W cTDP; Graphics: Intel® Iris® Xe 96 EUs; 3x DP/HDMI; 1x eDP; HD Audio; Ethernet: 2x Intel i226-LM Gbit, TSN; TPM 2.0; 2x USB4, 2x USB3, 8x USB2, PEG x8 Gen 4, PCIe Gen 4 2x4, PCIe Gen 3 8x; 2x socket for DDR5; 0...+60°C. MSC HCA-RLP-13800HE-NN0131C PCBFTX OR
tbd COM-HPC Client Size A module (120mm x 95mm); CPU: Intel i5-13600HE 12C/16T, vPro, 2.1GHz, 45/35W cTDP; Graphics: Intel® Iris® Xe 80 EUs; 3x DP/HDMI; 1x eDP; HD Audio; Ethernet: 2x Intel i226-LM Gbit, TSN; TPM 2.0; 2x USB4, 2x USB3, 8x USB2, PEG x8 Gen 4, PCIe Gen 4 2x4, PCIe Gen 3 8x; 2x socket for DDR5; 0...+60°C. MSC HCA-RLP-13600HE-NN0131C PCBFTX OR
tbd COM-HPC Client Size A module (120mm x 95mm); CPU: Intel i3-13300HE 8C/12T, 2.1GHz, 45/35W cTDP; Graphics: Intel® UHD Graphics 48 EUs; 3x DP/HDMI; 1x eDP; HD Audio; Ethernet: 2x Intel i226-LM Gbit, TSN; TPM 2.0; 2x USB4, 2x USB3, 8x USB2, PEG x8 Gen 4, PCIe Gen 4 2x4, PCIe Gen 3 8x; 2x socket for DDR5; 0...+60°C. MSC HCA-RLP-13300HE-NN0131C PCBFTX OR
tbd COM-HPC Client Size A module (120mm x 95mm); CPU: Intel i7-1370PE 14C/20T, vPro, 1.9GHz, 28/20W cTDP; Graphics: Intel® Iris® Xe 96 EUs; 3x DP/HDMI; 1x eDP; HD Audio; Ethernet: 2x Intel i226-LM Gbit, TSN; TPM 2.0; 2x USB4, 2x USB3, 8x USB2, PCIe Gen 4 2x4, PCIe Gen 3 8x; 2x socket for DDR5; 0...+60°C. MSC HCA-RLP-1370PE-NN0131C PCBFTX OR
tbd COM-HPC Client Size A module (120mm x 95mm); CPU: Intel i5-1350PE 12C/16T, vPro, 1.8GHz, 28/20W cTDP; Graphics: Intel® Iris® Xe 80 EUs; 3x DP/HDMI; 1x eDP; HD Audio; Ethernet: 2x Intel i226-LM Gbit, TSN; TPM 2.0; 2x USB4, 2x USB3, 8x USB2, PCIe Gen 4 2x4, PCIe Gen 3 8x; 2x socket for DDR5; 0...+60°C. MSC HCA-RLP-1350PE-NN0131C PCBFTX OR
tbd COM-HPC Client Size A module (120mm x 95mm); CPU: Intel i3-1320PE 8C/12T, 1.7GHz, 28/20W cTDP; Graphics: Intel® UHD Graphics 48 EUs; 3x DP/HDMI; 1x eDP; HD Audio; Ethernet: 2x Intel i226-LM Gbit, TSN; TPM 2.0; 2x USB4, 2x USB3, 8x USB2, PCIe Gen 4 2x4, PCIe Gen 3 8x; 2x socket for DDR5; 0...+60°C. MSC HCA-RLP-1320PE-NN0131C PCBFTX OR
tbd COM-HPC Client Size A module (120mm x 95mm); CPU: Intel i7-1365UE 10C/12T, vPro, 1.7GHz, 15/12W cTDP; Graphics: Intel® Iris® Xe 96 EUs; 3x DP/HDMI; 1x eDP; HD Audio; Ethernet: 2x Intel i226-LM Gbit, TSN; TPM 2.0; 2x USB4, 2x USB3, 8x USB2, PCIe Gen 4 2x4, PCIe Gen 3 8x; 2x socket for DDR5; 0...+60°C. MSC HCA-RLP-1365UE-NN0131C PCBFTX OR
tbd COM-HPC Client Size A module (120mm x 95mm); CPU: Intel i5-1345UE 10C/12T, vPro, 1.4GHz, 15/12W cTDP; Graphics: Intel® Iris® Xe 80 EUs; 3x DP/HDMI; 1x eDP; HD Audio; Ethernet: 2x Intel i226-LM Gbit, TSN; TPM 2.0; 2x USB4, 2x USB3, 8x USB2, PCIe Gen 4 2x4, PCIe Gen 3 8x; 2x socket for DDR5; 0...+60°C. MSC HCA-RLP-1345UE-NN0131C PCBFTX OR
tbd COM-HPC Client Size A module (120mm x 95mm); CPU: Intel i3-1315UE 6C/8T, 1.2GHz, 15/12W cTDP; Graphics: Intel® UHD Graphics 64 EUs; 3x DP/HDMI; 1x eDP; HD Audio; Ethernet: 2x Intel i226-LM Gbit, TSN; TPM 2.0; 2x USB4, 2x USB3, 8x USB2, PCIe Gen 4 2x4, PCIe Gen 3 8x; 2x socket for DDR5; 0...+60°C. MSC HCA-RLP-1315UE-NN0131C PCBFTX OR
tbd COM-HPC Client Size A module (120mm x 95mm); CPU: Intel Processor U300E 5C/6T, 1.1GHz, 15/12W cTDP; Graphics: Intel® UHD Graphics 48 EUs; 3x DP/HDMI; 1x eDP; HD Audio; Ethernet: 2x Intel i226-LM Gbit, TSN; TPM 2.0; 2x USB4, 2x USB3, 8x USB2, 2x SATA, PCIe Gen 4 2x4, PCIe Gen 3 6x; 2x socket for DDR5; 0...+60°C. MSC HCA-RLP-U300E-NN0121C PCBFTX OR
tbd COM-HPC Client Size A module (120mm x 95mm); CPU: Intel i7-13800HRE 14C/20T, vPro, 1.8GHz, 45/35W cTDP; Graphics: Intel® Iris® Xe 96 EUs; 3x DP/HDMI; 1x eDP; HD Audio; Ethernet: 2x Intel i226-IT Gbit, TSN; TPM 2.0; 1TB NVMe; 2x USB4, 2x USB3, 8x USB2, PEG x8 Gen 4, PCIe Gen 4 2x4, PCIe Gen 3 8x; 2x socket for DDR5, in-band ECC; -40...+85°C, recommended for 24/7 operation. MSC HCA-RLP-13800HRE-NA0131I PCBFTX OR
tbd COM-HPC Client Size A module (120mm x 95mm); CPU: Intel i5-13600HRE 12C/16T, vPro, 1.9GHz, 45/35W cTDP; Graphics: Intel® Iris® Xe 80 EUs; 3x DP/HDMI; 1x eDP; HD Audio; Ethernet: 2x Intel i226-IT Gbit, TSN; TPM 2.0; 2x USB4, 2x USB3, 8x USB2, PEG x8 Gen 4, PCIe Gen 4 2x4, PCIe Gen 3 8x; 2x socket for DDR5, in-band ECC; -40...+85°C, recommended for 24/7 operation. MSC HCA-RLP-13600HRE-NN0131I PCBFTX OR
tbd COM-HPC Client Size A module (120mm x 95mm); CPU: Intel i3-13300HRE 8C/12T, 2.1GHz, 45/35W cTDP; Graphics: Intel® UHD Graphics 48 EUs; 3x DP/HDMI; 1x eDP; HD Audio; Ethernet: 2x Intel i226-IT Gbit, TSN; TPM 2.0; 2x USB4, 2x USB3, 8x USB2, PEG x8 Gen 4, PCIe Gen 4 2x4, PCIe Gen 3 8x; 2x socket for DDR5, in-band ECC; -40...+85°C, recommended for 24/7 operation. MSC HCA-RLP-13300HRE-NN0131I PCBFTX OR
tbd COM-HPC Client Size A module (120mm x 95mm); CPU: Intel i7-1370PRE 14C/20T, vPro, 1.9GHz, 28/20W cTDP; Graphics: Intel® Iris® Xe 96 EUs; 3x DP/HDMI; 1x eDP; HD Audio; Ethernet: 2x Intel i226-IT Gbit, TSN; TPM 2.0; 2x USB4, 2x USB3, 8x USB2, PCIe Gen 4 2x4, PCIe Gen 3 8x; 2x socket for DDR5, in-band ECC; -40...+85°C, recommended for 24/7 operation. MSC HCA-RLP-1370PRE-NN0131I PCBFTX OR
tbd COM-HPC Client Size A module (120mm x 95mm); CPU: Intel i5-1350PRE 12C/16T, vPro, 1.8GHz, 28/20W cTDP; Graphics: Intel® Iris® Xe 80 EUs; 3x DP/HDMI; 1x eDP; HD Audio; Ethernet: 2x Intel i226-IT Gbit, TSN; TPM 2.0; 2x USB4, 2x USB3, 8x USB2, PCIe Gen 4 2x4, PCIe Gen 3 8x; 2x socket for DDR5, in-band ECC; -40...+85°C, recommended for 24/7 operation. MSC HCA-RLP-1350PRE-NN0131I PCBFTX OR
tbd COM-HPC Client Size A module (120mm x 95mm); CPU: Intel i3-1320PRE 8C/12T, 1.7GHz, 28/20W cTDP; Graphics: Intel® UHD Graphics 48 EUs; 3x DP/HDMI; 1x eDP; HD Audio; Ethernet: 2x Intel i226-IT Gbit, TSN; TPM 2.0; 2x USB4, 2x USB3, 8x USB2, PCIe Gen 4 2x4, PCIe Gen 3 8x; 2x socket for DDR5, in-band ECC; -40...+85°C, recommended for 24/7 operation. MSC HCA-RLP-1320PRE-NN0131I PCBFTX OR
tbd COM-HPC Client Size A module (120mm x 95mm); CPU: Intel i7-1365URE 10C/12T, vPro, 1.7GHz, 15/12W cTDP; Graphics: Intel® Iris® Xe 96 EUs; 3x DP/HDMI; 1x eDP; HD Audio; Ethernet: 2x Intel i226-IT Gbit, TSN; TPM 2.0; 2x USB4, 2x USB3, 8x USB2, PCIe Gen 4 2x4, PCIe Gen 3 8x; 2x socket for DDR5, in-band ECC; -40...+85°C, recommended for 24/7 operation. MSC HCA-RLP-1365URE-NN0131I PCBFTX OR
tbd COM-HPC Client Size A module (120mm x 95mm); CPU: Intel i5-1345URE 10C/12T, vPro, 1.4GHz, 15/12W cTDP; Graphics: Intel® Iris® Xe 80 EUs; 3x DP/HDMI; 1x eDP; HD Audio; Ethernet: 2x Intel i226-IT Gbit, TSN; TPM 2.0; 2x USB4, 2x USB3, 8x USB2, PCIe Gen 4 2x4, PCIe Gen 3 8x; 2x socket for DDR5, in-band ECC; -40...+85°C, recommended for 24/7 operation. MSC HCA-RLP-1345URE-NN0131I PCBFTX OR
tbd COM-HPC Client Size A module (120mm x 95mm); CPU: Intel i3-1315URE 6C/8T, 2.5GHz, 15/12W cTDP; Graphics: Intel® UHD Graphics 64 EUs; 3x DP/HDMI; 1x eDP; HD Audio; Ethernet: 2x Intel i226-IT Gbit, TSN; TPM 2.0; 2x USB4, 2x USB3, 8x USB2, PCIe Gen 4 2x4, PCIe Gen 3 8x; 2x socket for DDR5, in-band ECC; -40...+85°C, recommended for 24/7 operation. MSC HCA-RLP-1315URE-NN0131I PCBFTX OR

PV = Preferred variant; OR = on Request (in OEM quantities only)

Accessories

Cooling Options

Order No. Description Reference
79809 Fan kit for Heatsink MSC HCA-ALP/RLP-0x HSI-xxx, MSC C6B-ALP/ RLP-0x HSI-xxx, MSC C6B-TLH-0x HSI-xxx, MSC C6C-ALP/RLP-0x HSI-xxx, MSC C6C-TLU-0x HSI-xxx, MSC C6C-WLU-0x HSI-xxx, MSC C6C-ALN-0x HSI-xxx, MSC C6C-EL-0x HSI-xxx, MSC C6C-RYZ-0x HSI-xxx, PWM fan 80x80x15mm. MSC C6C-FANKIT-01-HSF-001
94875 Passive Heatsink for HCA-ALP/RLP consisting of a singlepiece aluminum profile with fins, standoffs without thread (2.7mm inner diameter), screws and thermopads for the thermal contact to CPU, chipset, NVMe. MSC HCA-ALP-01 HSI-001
94876 Passive Heatsink / heat pipe for HCA-ALP/RLP consisting of a single-piece aluminum profile with fins and embedded heatpipe, standoffs without thread (2.7mm inner diameter), screws and thermopads for the thermal contact to CPU, chipset, NVMe. MSC HCA-ALP-01 HSI-HP-001
94877 Heatspreader for HCA-ALP/RLP. Single-piece aluminum profile, standoffs without thread (2.7mm inner diameter), screws and thermopads for the thermal contact to CPU, chipset, NVMe. MSC HCA-ALP-01 HSP-001
94878 Heatspreader / heat pipe for HCA-ALP/RLP. Single-piece aluminum profile with embedded heat pipe, standoffs without thread (2.7mm inner diameter), screws and thermopad for the thermal contact to CPU, chipset, NVMe. MSC HCA-ALP-01 HSP-HP-001
94879 Heatspreader for HCA-ALP/RLP. Single-piece aluminum profile, standoffs with M2.5 thread, screws and thermopads for the thermal contact to CPU, chipset, NVMe. MSC HCA-ALP-02 HSP-001

Memory Options

Order No. Description Reference
97208 16GB DDR5-4800 SO-DIMM MOD SODIMM DDR5 16GB PC5-38400 CL22 1B
97209 32GB DDR5-4800 SO-DIMM MOD SODIMM DDR5 32GB PC5-38400 CL22 2B
97207 8GB DDR5-4800 SO-DIMM MOD SODIMM DDR5 8GB PC5-38400 CL22 1B

Support

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