The TRIA HMM-RLP module featuring the COM-HPC Mini formfactor is ideal for system designs that require outstanding performance and flexible IO connectivity in smallest possible space. The module is perfect for applications such as automation solutions, drone and robot controllers, rugged HMI platforms, compact medical units, measurement equipment, and in transportation.
Based on the 13th Gen Intel® Core™ processor, system designers can pick from a variety of choices of power efficient and performant module options. The architecture scales up to fourteen cores and twenty threads at 35W thermal design power (TDP). For applications with need for lower power dissipation, selected processor variants can be operated down to 12W TDP. The board is ideal for mission critical applications supporting extended temperature range, 24/7 continuous operation, memory down with in-band ECC protection and optional conformal coating.
System investments are well protected through long-term availability of the module, designed, and manufactured by Tria Technologies. In addition, the COM-HPC standard enables performance scaling and migrating applications to future technology upgrades when they become available.
