The MSC HCA-RLP COM-HPC Client module features the 13th Gen Intel® Core™ processor, giving application designers a great variety of choices of power efficient and performant compute solutions. Offering a great scalability of performance, the module is ideal for compute intense applications in automation, instrumentation, high-end medical equipment, transportation, and video surveillance. The Intel® performance hybrid architecture combines Performance-cores and Efficient-cores with the Intel® Thread Director providing intelligent workload optimization. The architecture scales up to fourteen cores and twenty threads at 45/35W thermal design power (TDP). The board is ideal for applications requiring support for extended temperature range and 24/7 continuous operation.
For highest data throughput the module enables fast DDR5-5200 memory technology with up to sixty-four GB SO-DIMM based memory. Module I/O comprises up to eight PCIe Gen 3 lanes, up to eight PCIe Gen 4 lanes and an optional eight lane PEG port capable of PCIe Gen 4. The two Ethernet interfaces provide up to 2.5GbE bandwidth each based on the Intel i226 network controller. Further high-speed I/O can utilize USB ports featuring USB4 and USB 3.2.
System investments are well protected through long-term availability of the module, designed and manufactured by Tria Technologies. In addition, the COM-HPC standard enables performance scaling and migrating applications to future technology upgrades when they become available.
