MSC SM2S-IMX8ULP

NXP™ i.MX 8ULP ARM® Cortex™-A35 / M33

The flexible MSC SM2S-IMX8ULP SMARC 2.1.2 module family is highly scalable and equipped with i.MX 8ULP Crossover Applications Processor that brings ultra-low power processing and advanced integrated security with EdgeLock® secure enclave to the intelligent edge. The i.MX 8ULP family features up to two ARM Cortex-A35 running at 1 GHz, an ARM Cortex-M33 core, 3D/2D Graphics Processing Units (GPUs) and a Tensilica® Hifi 4 DSP and Fusion DSP for low-power audio/voice and edge AI/ML processing.

The MSC SM2S-IMX8ULP module integrates the processor and low-power LPDDR4 memory technology, combined with up to 256GB eMMC Flash memory. Various interfaces for embedded applications such as Ethernet, USB 2.0, CAN-FD, dual-channel LVDS or MIPI DSI and MIPI CSI for connecting a camera are available. The thermal design power (TDP) of the module ranges from 1 to 3 W depending on used power mode.

The module is compliant with the new SMARC 2.1.1 standard, allowing easy integration with SMARC baseboards. For evaluation and design-in of the SM2S-IMX8ULP module, MSC provides a development platform and a starter kit. Support for Linux is available (Microsoft Azure Sphere and Android support available on request).

Highlights

  • Single or Dual core ARM Cortex-A35 Applications
    Processor up to 1.0GHz
  • ARM Cortex-M33 Real Time Processor up to 216MHz
  • Tensilica Hifi 4 DSP at 600MHz
  • Tensilica Fusion DSP at 200MHz
  • Vivante multimedia 2D/3D Graphics Processor
  • Up to 2GB LPDDR4x SDRAM at 2400 MT/s
  • Up to 256GB eMMC Flash
  • Dual-channel LVDS / MIPI-DSI x4 (optional)
  • MIPI CSI-2 Camera Interface
  • Up to 4x USB 2.0 Host interface
  • 1x USB 2.0 Host/Device interface
  • 1x 10/100 Mbit Ethernet
  • Wireless Module (optional)
  • 1x MMC/SD/SDIO interface
  • 1x CAN-FD Interface
  • 2x I2S Audio Interface
  • 14x GPIO
  • UART, SPI, I2C
  • SMARC 2.1.1 Compliant
  • Optimized design for Ultra Low Power applications and high volume at low cost

Specs

Technology ARM
Formfactor SMARC Short Size
CPU NXP i.MX 8M Mini ARM Cortex-A35 Applications Processor
- i.MX 8ULP Dual, dual-core, 800MHz - 1.0GHz
- i.MX 8ULP Solo, single-core, 800MHz - 1.0GHz
- i.MX 8ULP SoloLite, single-core, 800MHz - 1.0GHz

ARM Cortex-M33F Real Time Processor at 216MHz

Heterogeneous domain computing architecture (independent applications processor and real-time domains with a separate low-power multimedia domain)
Chipset SOC
RAM Up to 2GB 2400MT/s LPDDR4x SDRAM, soldered, no ECC
Flash Up to 256GB eMMC Flash
QSPI NAND Flash APD (optional)
QSPI NOR Flash RTD (optional)
Storage Interfaces 1x MMC/SD/SDIO
USB 1x USB 2.0 Host/Client, 4x USB 2.0 Host or
1x USB 2.0 Host/Client, 1x USB 2.0 Host (optional)
Serial Interfaces 2x UART with 2-wire hand shake
2x UART w/o hand shake
Bus Interfaces 4x I2C up to 400 Kbit/s
1x CAN-FD / CAN 2.0B
2x SPI (with two chip selects)
Display Controller Vivante GC NanoUlta 3D Graphics Processing Unit (GPU)
3D Graphics Acceleration, 1 shader, 6.4 GFLOPS
OpenGL ES 1.0, 2.0, 3.1, Vulkan, OpenCL 1.2

Video Processing Unit not available
Display Interfaces Dual-channel LVDS interface, 18 or 24 bit (up to 1920x1080);
also usable as one single-channel LVDS interface (up to 1366x768) or

MIPI-DSI Display Interface, 4 lanes, up to 1920x1080 @ 60fps (optional)
Network Interface 10/100BASE-T Ethernet
Wireless Module with 802.11b/g/n and Bluetooth 5.0, single band 2.4GHz, soldered (optional)
Audio Interface 2x I2S Audio
Tensilica Fusion DSP at 200MHz
Tensilica Hifi 4 DSP at 600MHz (only available on Solo/Dual)
Security Device Advanced Security, Safety, and Reliability integrated in the SOC

Integrated EdgeLock secure enclave enables autonomous management of security
functions, including runtime attestation, silicon root of trust, reusable
certifications, trust provisioning, and fine-grain key management augmented by
extensive crypto services for advanced attack resistance

Trusted Platform Module (TPM) 2.0 (optional)
Miscellaneous Watchdog Timer for system reset (programmable, 1s … 600s)

High accuracy RTC

14x GPIO, configurable as input or output, interrupt capable
2x PWM outputs (shared functions)

64kbit ID EEPROM on I2C bus

MIPI CSI-2 camera interface (CSI0, 2 lane) or
MIPI CSI-2 camera interface (CSI1, 2-lane)
Feature Highlights SMARC 2.1.1 compatible
Firmware uboot
OS Support Linux Board Support Package
Microsoft Azure Sphere (on request)
Android Board Support Package (on request)
Power Requirement Power Supply 3V - 5,25V, 5V Standby
Power Consumption 1-3 W typ. (depending on CPU and optional features)
Dedicated μPower management subsystem anchored by an internal NXP-built RISC-V
core (more than 20 different power mode configurations across processing domains to
deliver exceptional energy efficiency)
Environment Temperature Range:
0°C … +70°C operating commercial
-40°C … +85°C operating extended
-40°C … +85°C storage

Humidity:
5 … 95% (operating, non condensing)
5 … 95% (storage, non-condensing)
Dimensions 82 x 50 mm
Certificates UL / CE
Cooling Heatspreader
Carrier MSC SM2-MB-EP1
MSC SM2-MB-EP5

Order Info

Order No. Description Reference Status
tbd SMARC module based on NXP i.MX 8ULP Dual-Core Cortex-A35 processor at 1.0GHz, 2GB LPDDR4, 16GB eMMC Flash, 8MB QSPI NOR Flash, Ethernet (10/100Base-T), 4x USB2.0 Host, 1x USB2.0 Host/Device, 1x CAN, 4x UART, 2xSPI, BT/WLAN, TPM, LVDS, MIPI CSI-2 Camera input (CSI0) MSC SM2S-IMX8ULP-DC- 14N0261I ES1 PCBES OR

PV = Preferred variant; OR = on Request (in OEM quantities only)

Accessories

Carrier Options

Order No. Description Reference
68488 SMARC 2.0 Embedded Platform with PCI Express x4 slot, GbE, SATA, USB 3.0, USB 2.0, USB 2.0 OTG, RS232, CAN, SPI, eSPI, SMBus, I2C and GPIO interface, LVDS/eDP, DisplayPort and HDMI display interface, regulated backlight supply, HD/I2S audio interface, MIPI CSI-2 camera interface, mini PCI Express card slot, SD card slot, fan connector, CMOS battery, Mini-ITX form factor (170 x 170 mm), ATX power connector and single 12V/24V power jack, commercial temperature range 0..+70°C MSC SM2-MB-EP1-001 PCBFTX
83977 SMARC 2.1 compatible embedded platform (146 x 80mm), 10-36V input voltage, 3x RS232, 2x CAN, dual RJ45 LAN with LED (1 x LAN i210) , 1x M.2 2280 Key M slot, mPCIe slot, 1x USB 3.0 Type A, 1x USB 2.0 Type A, 1x USB 2.0 internal, 1x μUSB 2.0 Host/Device, 2x SPI, I²C, 8 GPIO on FC, 1x HDMI, LVDS/eDP/DSI on JILI30 connector, μSD Card Slot, regulated backlight supply, I2S Audio, 1W Mono, camera connector, RTC battery. Industrial temperature range -40..+85°C, ARM full version MSC SM2S-MB-EP5-002 PCBFTX
83981 SMARC 2.1 compatible embedded platform (146 x 80mm), 10-36V input voltage, 2x UART, 1x RS232, 2x CAN, 1x RJ45 LAN with LED, 1x USB 2.0 Type A, 1x USB3.0 Type A, 1x USB 2.0 internal, 1x μUSB 2.0 Host/Device, 2x SPI, 12 GPIO on FC, 1x HDMI , μSD Card Slot, LVDS/eDP/DSI on JILI30 connector, regulated backlight supply, RTC battery. Industrial temperature range -40..+85°C, ARM slim version MSC SM2S-MB-EP5-004 PCBFTX

Other Accessories

Order No. Description Reference
82479 Debug Console (UART) Adapter for i.MX6-based Qseven and nanoRISC modules, with 8-pin FFC cable to connect COM module to 9-pin D-Sub connector MSC Debug Console Adapter
68948 Debug Adapter for i.MX6-based Qseven, SMARC and nanoRISC modules, with 10-pin FFC cable to connect to COM module, adapter provides headers for JTAG connection to Lauterbach and/or Goepel debuggers MSC JTAG Adapter FFC 10-pin

Starter Kits

Order No. Description Reference
74008 Starter Kit for MSC SMARC i.MX 8 Series modules. Includes MSC SM2-MB-EP1 Baseboard, Heatspreader/Heatsink, SD Card with USB Card Reader, Power Supply and suitable cable kit. The StarterKit does not include the MSC SM2S-IMX8 / 8M / 8MINI / 8NANO / 8PLUS module. Please order your choice of module separately. MSC SM2-SK-IMX8-EP1-KIT001 SETPAC
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