MSC SM2S-QCS5430

Qualcomm® QCS5430
Arm® Cortex®-A78/A55

The MSC SM2S-QCS5430 SMARC 2.1.1 module family is powered by the Qualcomm® QCS5430 processor, a 6nm processor with high performance and best in class power to performance ratio. QCS5430 integrates Qualcomm® Kryo™ 670 CPU which contains up to six cores: two Arm® Cortex®-A78 cores, four Arm® Cortex®-A55 cores, Qualcomm® Adreno™ 642L GPU, Qualcomm® Adreno™ 633 VPU and the latest re-engineered Qualcomm® Hexagon™ processor. The GPU supports video encode/ decode at up to 4K30/4K30 and many different display connictities (LVDS, MIPI-DSI, eDP/DP). It delivers powerful edge AI for high-performance with upto 3.5 TOPS at low power and massive camera support with 4 MIPI-CSI inputs.

This solution delivers powerful performance and is purpose-built for industrial and commercial IoT applications such as ruggedized handhelds and tablets, kiosks, industrial scanners, dash cameras, point-of-sale systems and human machine interface systems.

The module is compliant with the latest SMARC 2.1.1 standard, allowing easy integration with SMARC baseboards. For evaluation and design-in of the SM2S-QCS5430 module, Avnet Embedded provides a development platform and a starter kit. Support for Linux is available (Android support available on request).

Highlights

Dual core Arm Cortex-A78 up to 2.1GHz
And Quad core Arm Cortex-A55 @ 1,8GHz
Adreno 642L GPU @ 315MHz
AI DSP/NSP Dual HVX, 4K HMX up to 3.5 TOPs
Up to 16GB LPDDR5 SDRAM 6400MT/s
Up to 1TB UFS Flash
Display up to FHD+120Hz
Video up to 4k30(E)/4K30(D)
5xUSB 2.0, 2x USB 3.1
2x PCIe Gen3 x1, 1x PCIe Gen3 x2
1x MIPI-DSI or LVDS

1x DP 1.4 (2 lane)
1x eDP/DP
4x MIPI-CSI Camera Interface
WLAN/BT Wireless Module (option)
2x Gigabit Ethernet
2x I2S Audio Interface
4x UART, 2x SPI, 2x CAN2.0-FD
5x I²C
HW Key manager and ECC, Secure boot, Crypto engines, etc.
Windows 11 IOT, Yocto Linux
Ubuntu or Android (on request)

Specs

Technology	Arm
Formfactor	SMARC™ 2.1.1 Short Size
CPU	QCS5430: 2x A78@2.1GHz, 4xA55@1.8GHz 2xHVX,4K-HMX 1.45GHz (3.5 INT8 TOPS)
Chipset	SOC
RAM	Up to 16GB LPDDR5 SDRAM, up to 6400MT/s, soldered
Flash	Up to 1TB UFS, soldered (optional)
Storage Interfaces	UFS (onboard) NVME (carrier) SD-Card (carrier)
USB	2x USB 3.1 Host interfaces 5x USB 2.0 Host interfaces
Serial Interfaces	4x UART (two with handshake)
Bus Interfaces	Up to 4x PCI-Express x1 Gen. 3 lanes 5x I²C (1x general, 2x CAM, 1x LCD, 1x PM) 2x SPI Bus 1x SDIO 2x CAN2.0-FD
Display Controller	Adreno 642L GPU @ up to 315MHz
Display Interfaces	MIPI-DSI 4 - lane FHD+ @120Hz LVDS (optional instead of MIPI-DSI) 1920x1200 WUXGA 60Hz DP 1.4 (2 lane) 4K30 (4K60 compression to 16bpp) eDP/DP (4 lane) 4k60 (4K120 compression to 16bpp)
Network Interface	2x 10/100/1000Base-T
Audio Interface	2x I2S Audio
Security Device	Infineon Trusted Platform Module 2.0 HW Key manager and ECC, Secure boot, Crypto engines, Key provisioning security, Qualcomm® Trusted Execution Environment (TEE), Qualcomm Content Protection (Widevine), Secure camera/UI
Miscellaneous	MIPI CSI-2 camera interface on SMARC interface: 1x 2 lane, 1x 4 lane MIPI CSI-2 camera interface on CSI Connector: 1x 2 lane, 1x 4 lane Watchdog Timer: Initiates system reset, (programmable, 1s … 255h) Fan Supply: PWM Speed Control for system fan on carrier board RTC battery: external System Monitoring: Voltage, Temperature, CPU Fan, System Fan EEPROM: 64kbit ID EEPROM on I2C bus GPIO: 14x GPIO, configurable as input or output, 13x interrupt capable
Feature Highlights	SMARC™ 2.1.1 compliant
Firmware	UEFI boot
OS Support	Windows 11 IoT Yocto Linux Ubuntu Linux (on request) Android (on request)
Power Requirement	Power Supply +5V +/-5%, 5V Standby Power Consumption 5W typ. (tbd: depending on CPU, CPU load and onboard features)
Environment	Temperature Range: Commercial: 0° … 70°C (operating) -20° … 85°C (storage) Extended: -25° … 85°C (operating) -40° … 85°C (storage) Industrial: -40° … 85°C (operating) -40° … 85°C (storage) Humidity: 5 … 95% (operating, non-condensing) 5 … 95% (storage, non-condensing)
Dimensions	82 x 50 mm
Certificates	UL / CE
Cooling	Heatspreader
Carrier	MSC SM2-MB-EP1 MSC SM2-MB-EP5

Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

Order Info

Order No.	Description	Reference	Status
111994	SMARC 2.1.1 module with Qualcomm QCS5430 2x A78 @2.1GHz + 4x A55 @1,8GHz 3W CPU TDP, Graphics: Adreno A642L@315Mhz, NPU: 3.5 TOPs, 4GB LPDDR5 SDRAM 6400MT/s, DP 1.4 (2 lane), eDP/DP and LVDS interfaces, 2x MIPI CSI on SMARC and 2x onboard, Ethernet: 2x 1Gbit, 32GB UFS memory, PCIe: 2x PCIe Gen3 x1 + 1x PCIe Gen3 x2, TPM 2.0, USB: 5x USB 2.0 + 2x USB 3.1, WLAN/BT, TPM 2.0, 2x CAN FD (Engineering Sample - get in touch with your sales)	MSC SM2S-QCS5430-FP15-25N02F1C ES1 PCBES	PV
111987	SMARC 2.1.1 module with Qualcomm QCS6490 4x A78 @2.4/2.7GHz + 4x A55 @1,9GHz 5W CPU TDP, Graphics: Adreno A643@812MHz, NPU: 12 TOPs, 8GB LPDDR5 SDRAM 6400MT/s, DP 1.4 (2 lane), eDP/DP and MIPI DSI interfaces, 2x MIPI CSI on SMARC and 2x onboard, Ethernet: 2x 1Gbit, 64GB UFS memory, PCIe: 2x PCIe Gen3 x1 + 1x PCIe Gen3 x2, TPM 2.0, USB: 5x USB 2.0 + 2x USB 3.1, WLAN/BT, TPM 2.0, 2x CAN FD (Engineering Sample - get in touch with your sales)	MSC SM2S-QCS6490-FPF-36N08F1C ES1 PCBES	PV

PV = Preferred variant; OR = on Request (in OEM quantities only)

Accessories

Cooling Options

Order No.	Description	Reference
TBD1	Heatspreader for SM2S-QCS6490 module, consisting of a single-piece aluminum plane and thermal pad for contact to the processor, with 2.7mm through-hole standoffs
TBD2	Passive Heatsink for SM2S-QCS6490 module, consisting of a single-piece aluminum pin cooler and thermal pad for contact to the processor, with 2.7mm through-hole standoffs

Carrier Options

Order No.	Description	Reference
68488	SMARC 2.0 Embedded Platform with PCI Express x4 slot, GbE, SATA, USB 3.0, USB 2.0, USB 2.0 OTG, RS232, CAN, SPI, eSPI, SMBus, I2C and GPIO interface, LVDS/eDP, DisplayPort and HDMI display interface, regulated backlight supply, HD/I2S audio interface, MIPI CSI-2 camera interface, mini PCI Express card slot, SD card slot, fan connector, CMOS battery, Mini-ITX form factor (170 x 170 mm), ATX power connector and single 12V/24V power jack, commercial temperature range 0..+70°C	MSC SM2-MB-EP1-001 PCBFTX
83977	SMARC 2.x compatible embedded platform (146 x 80mm), 10-36V input voltage, 3x RS232, 2x CAN, dual RJ45 LAN with LED (1 x LAN i210) , 1x M.2 2280 Key M slot, mPCIe slot, 1x USB 3.0 Type A, 1x USB 2.0 Type A, 1x USB 2.0 internal, 1x USB 2.0 Host/Device, 2x SPI, I²C, 8 GPIO on FC, 1x HDMI, LVDS/eDP/DSI on JILI30 connector, SD Card Slot, regulated backlight supply, I2S Audio, 1W Mono, camera connector, RTC battery. Industrial temperature range -40..+85°C, ARM full version	MSC SM2S-MB-EP5-002 PCBFTX

Support

Application Notes

App_Note_002_EDID_File_generation

Last update: 29/12/2022 292.49 KB

App_Note_017_OS_Boot_support_for_different_media

Last update: 29/12/2022 147.99 KB

App_Note_019_Activate_screen_after_WoL_from_sleep

Last update: 29/12/2022 243.99 KB

App_Note_021_Install_Win7_on_Recent_Intel_Architectures

Last update: 29/12/2022 635.75 KB

App_Note_022_MSC_BIOS_Configurator_Tool

Last update: 29/12/2022 513.83 KB

App_Note_028_MSC_AutoFLASH

Last update: 22/03/2023 357 KB

App_Note_030_Building_from_MSC_Git_V1_9

Last update: 05/10/2023 482.45 KB

App_Note_030_Addendum_Building_from_MSC_Git_2024-04-25

Last update: 25/04/2024 396.56 KB

App_Note_032_Secure_Boot

Last update: 29/12/2022 332.92 KB

App_Note_038_SMARC_2-1-1_Carrier-Board_Recommendations

Last update: 11/05/2023 440.94 KB

App_Note_043_Converting_eMMC_from_MLC_to_pSLC.pdf

Last update: 03/01/2023 266.21 KB

Compliance documents

China-ROHS-Statement_MSC_SMARC_2023-11

Last update: 13/11/2023 133.62 KB

REACH-ROHS-Statement_MSC_SMARC_2023-11

Last update: 13/11/2023 111.13 KB

Mechanical data

MSC_Mechanical_3D_information-AVE

Last update: 11/12/2023 213 KB

MSC_SM2S-RYZ-01_HSI-001_3D

Last update: 29/12/2022 20 MB

MSC_SM2S-RYZ-01_HSP-001_3D

Last update: 29/12/2022 20 MB

MSC_SM2S-RYZ_3D

Last update: 08/03/2024 21.35 MB

BIOS

Download

MSC_BIOS-Configurator-Tool

Last update: 22/03/2023 205.83 KB

BIOS_Update_SM2S-RYZ_BIOS_V111_01

Last update: 31/01/2023 5.47 MB

BIOS_Update_SM2S-RYZ_BIOS_V110_01

Last update: 30/08/2022 5.48 MB

Demo images

msc-image-lxqt-v1000_dunfell-ryzen_20072023

Last update: 31/07/2023 1,760.48 MB

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MSC SM2S-QCS5430

Highlights

Specs

Order Info

Accessories

Cooling Options

Carrier Options

Support

App_Note_002_EDID_File_generation

App_Note_017_OS_Boot_support_for_different_media

App_Note_019_Activate_screen_after_WoL_from_sleep

App_Note_021_Install_Win7_on_Recent_Intel_Architectures

App_Note_022_MSC_BIOS_Configurator_Tool

App_Note_028_MSC_AutoFLASH

App_Note_030_Building_from_MSC_Git_V1_9

App_Note_030_Addendum_Building_from_MSC_Git_2024-04-25

App_Note_032_Secure_Boot

App_Note_038_SMARC_2-1-1_Carrier-Board_Recommendations

App_Note_043_Converting_eMMC_from_MLC_to_pSLC.pdf

China-ROHS-Statement_MSC_SMARC_2023-11

REACH-ROHS-Statement_MSC_SMARC_2023-11

MSC_Mechanical_3D_information-AVE

MSC_SM2S-RYZ-01_HSI-001_3D

MSC_SM2S-RYZ-01_HSP-001_3D

MSC_SM2S-RYZ_3D

MSC_BIOS-Configurator-Tool

BIOS_Update_SM2S-RYZ_BIOS_V111_01

BIOS_Update_SM2S-RYZ_BIOS_V110_01

msc-image-lxqt-v1000_dunfell-ryzen_20072023

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Talk to the experts!