MSC SM2S-QCS6490

Qualcomm® QCS6490
Arm® Cortex®-A78/A55

The MSC SM2S-QCS6490 SMARC 2.1.1 module family is powered by the Qualcomm® QCS6490 processor, a 6nm processor with high performance and best in class power to performance ratio. QCS6490 integrates Qualcomm® Kryo™ 670 CPU which contains up to eight cores: four Arm® Cortex®-A78 cores, four Arm® Cortex®-A55 cores, Qualcomm® Adreno™ 643 GPU, Qualcomm® Adreno™ 633 VPU and the latest re-engineered Qualcomm® Hexagon™ processor. The GPU supports video encode/ decode at up to 4K30/4K60 and many different display connictities (LVDS, MIPI-DSI, eDP/DP). It delivers powerful edge AI for high-performance with upto 12 TOPS at low power and massive camera support with 4 MIPI-CSI inputs.

This solution delivers powerful performance and is purpose-built for industrial and commercial IoT applications such as ruggedized handhelds and tablets, kiosks, industrial scanners, dash cameras, point-of-sale systems and human machine interface systems.

The module is compliant with the latest SMARC 2.1.1 standard, allowing easy integration with SMARC baseboards. For evaluation and design-in of the SM2S-QCS6490 module, Avnet Embedded provides a development platform and a starter kit. Support for Linux is available (Android support available on request).

Highlights

Quad core Arm Cortex-A78 up to 2.7GHz
And Quad core Arm Cortex-A55 @ 1.95GHz
Adreno 643 GPU @ 812MHz
AI DSP/NSP Dual HVX, 4K HMX up to 12(15) TOPs
Up to 16GB LPDDR5 SDRAM 6400MT/s
Up to 1TB UFS Flash
Display up to FHD+144Hz
Video up to 4k30(E)/4K60(D)
5xUSB 2.0, 2x USB 3.1
2x PCIe Gen3 x1, 1x PCIe Gen3 x2
1x MIPI-DSI or LVDS
1x DP 1.4 (2 lane)

1x eDP/DP
4x MIPI-CSI Camera Interface
WLAN/BT Wireless Module (option)
2x Gigabit Ethernet
2x I2S Audio Interface
4x UART, 2x SPI, 2x CAN2.0-FD
5x I²C
HW Key manager and ECC, Secure boot, Crypto engines, etc.
Windows 11 IOT, Yocto Linux and Android (Ubuntu Linux on request)

Specs

Technology	Arm
Formfactor	SMARC™ 2.2 Short Size
CPU	QCS6490: 1x A78@2.7GHz, 3x A78@2.4GHz, 4xA55@1.95GHz 2xHVX,4K-HMX 1.45GHz (12.15 INT8 TOPS)
Chipset	SOC
RAM	Up to 16GB LPDDR5 SDRAM, up to 6400MT/s, soldered
Flash	Up to 1TB UFS, soldered (optional)
Storage Interfaces	UFS (onboard) NVME (carrier) SD-Card (carrier)
USB	2x USB 3.1 Host interfaces 5x USB 2.0 Host interfaces
Serial Interfaces	4x UART (two with handshake)
Bus Interfaces	Up to 4x PCI-Express x1 Gen. 3 lanes 5x I²C (1x general, 2x CAM, 1x LCD, 1x PM) 2x SPI Bus 1x SDIO 2x CAN2.0-FD
Display Controller	Adreno 643 GPU @ up to 812MHz
Display Interfaces	MIPI-DSI 4 - lane FHD+ @144Hz LVDS (optional instead of MIPI-DSI) 1920x1200 WUXGA 60Hz DP 1.4 (2 lane) 4K30 (4K60 compression to 16bpp) eDP/DP (4 lane) 1920x1080p60
Network Interface	2x 10/100/1000Base-T
Audio Interface	2x I2S Audio
Security Device	Infineon Trusted Platform Module 2.0 HW Key manager and ECC, Secure boot, Crypto engines, Key provisioning security, Qualcomm® Trusted Execution Environment (TEE), Qualcomm Content Protection (Widevine), Secure camera/UI
Miscellaneous	MIPI CSI-2 camera interface on SMARC interface: 1x 2 lane, 1x 4 lane MIPI CSI-2 camera interface on CSI Connector: 2x 4 lane Watchdog Timer: Initiates system reset, (programmable, 1s … 255h) Fan Supply: PWM Speed Control for system fan on carrier board RTC battery: external System Monitoring: Voltage, Temperature, CPU Fan, System Fan EEPROM: 64kbit ID EEPROM on I2C bus GPIO: 14x GPIO, configurable as input or output, 13x interrupt capable
Feature Highlights	SMARC™ 2.2 compliant
Firmware	UEFI boot
OS Support	Windows 11 IoT Yocto Linux Android Ubuntu Linux (on request)
Power Requirement	Power Supply +5V +/-5%, 5V Standby Power Consumption 7W typ. (tbd: depending on CPU, CPU load and onboard features)
Environment	Temperature Range: Commercial: 0° … 70°C (operating) -20° … 85°C (storage) Extended: -30° … 85°C (operating) -40° … 85°C (storage) Humidity: 5 … 95% (operating, non-condensing) 5 … 95% (storage, non-condensing)
Dimensions	82 x 50 mm
Certificates	UL / CE
Cooling	Heatspreader
Carrier	MSC SM2-MB-EP1 MSC SM2-MB-EP5-012

Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

Order Info

Order No.	Description	Reference	Status
115898	SMARC 2.2 module with Qualcomm QCS6490 4x A78 @2.4/2.7GHz + 4x A55 @1,9GHz, 5W CPU TDP, Graphics: Adreno A643@812MHz, NPU: 12 TOPs, 8GB LPDDR5 SDRAM 6400MT/s, DP 1.4 (2 lane), eDP/DP and MIPI DSI interfaces, 2x MIPI CSI on SMARC and 2x onboard, Ethernet: 2x 1Gbit, 64GB UFS memory, PCIe: 2x PCIe Gen3 x1 + 1x PCIe Gen3 x2, USB: 5x USB 2.0 + 2x USB 3.1, WLAN/BT, TPM 2.0, 2x CAN FD, Extended Termperature -25°... +85°C(Engineering Sample - get in touch with your sales)	MSC SM2S-QCS6490- FPF-36N08F1E ES2 PCBES	PV
115895	SMARC 2.2 module with Qualcomm QCS5430 2x A78 @2.1GHz + 4x A55 @1,8GHz, 3W CPU TDP, Graphics: Adreno A642L@315Mhz, NPU: 3.5 TOPs, 4GB LPDDR5 SDRAM 6400MT/s, DP 1.4 (2 lane), eDP/DP and LVDS interfaces, 2x MIPI CSI on SMARC and 2x onboard, Ethernet: 2x 1Gbit, 32GB UFS memory, PCIe: 2x PCIe Gen3 x1 + 1x PCIe Gen3 x2, USB: 5x USB 2.0 + 2x USB 3.1, WLAN/BT, TPM 2.0, 2x CAN FD, Extended Termperature -25°... +85°C(Engineering Sample - get in touch with your sales)	MSC SM2S-QCS5430- FP1-25N02F1E ES2 PCBES	PV
115897	SMARC 2.2 module with Qualcomm QCS6490 4x A78 @2.4/2.7GHz + 4x A55 @1,9GHz, 5W CPU TDP, Graphics: Adreno A643@812MHz, NPU: 12 TOPs, 8GB LPDDR5 SDRAM 6400MT/s, DP 1.4 (2 lane), eDP/DP and LVDS interfaces, 2x MIPI CSI on SMARC and 2x onboard, Ethernet: 2x 1Gbit, 64GB UFS memory, PCIe: 2x PCIe Gen3 x1 + 1x PCIe Gen3 x2, USB: 5x USB 2.0 + 2x USB 3.1, WLAN/BT, TPM 2.0, 2x CAN FD, Extended Termperature -25°... +85°C(Engineering Sample - get in touch with your sales)	MSC SM2S-QCS6490- FPF-36N02F1E ES2 PCBES	PV
115896	SMARC 2.2 module with Qualcomm QCS6490 4x A78 @2.4/2.7GHz + 4x A55 @1,9GHz, 5W CPU TDP, Graphics: Adreno A643@812MHz, NPU: 12 TOPs, 4GB LPDDR5 SDRAM 6400MT/s, DP 1.4 (2 lane), eDP/DP and LVDS interfaces, 2x MIPI CSI on SMARC and 2x onboard, Ethernet: 2x 1Gbit, 64GB UFS memory, PCIe: 2x PCIe Gen3 x1 + 1x PCIe Gen3 x2, USB: 5x USB 2.0 + 2x USB 3.1, no WLAN/BT, TPM 2.0, 2x CAN FD, Extended Termperature -25°... +85°C(Engineering Sample - get in touch with your sales)	MSC SM2S-QCS6490- FPF-26N0271E ES2 PCBES	PV
115894	SMARC 2.2 module with Qualcomm QCS5430 2x A78 @2.1GHz + 4x A55 @1,8GHz, 3W CPU TDP, Graphics: Adreno A642L@315Mhz, NPU: 3.5 TOPs, 4GB LPDDR5 SDRAM 6400MT/s, DP 1.4 (2 lane), eDP/DP and LVDS interfaces, 2x MIPI CSI on SMARC and 2x onboard, Ethernet: 2x 1Gbit, 32GB UFS memory, PCIe: 2x PCIe Gen3 x1 + 1x PCIe Gen3 x2, USB: 5x USB 2.0 + 2x USB 3.1, no WLAN/BT, TPM 2.0, 2x CAN FD, Extended Termperature -25°... +85°C(Engineering Sample - get in touch with your sales)	MSC SM2S-QCS5430- FP1-25N0271E ES2 PCBES	PV
115899	SMARC 2.2 module with Qualcomm QCS6490 4x A78 @2.4/2.7GHz + 4x A55 @1,9GHz, 5W CPU TDP, Graphics: Adreno A643@812MHz, NPU: 12 TOPs, 16GB LPDDR5 SDRAM 6400MT/s, DP 1.4 (2 lane), eDP/DP and MIPI DSI interfaces, 2x MIPI CSI on SMARC and 2x onboard, Ethernet: 2x 1Gbit, 128GB UFS memory, PCIe: 2x PCIe Gen3 x1 + 1x PCIe Gen3 x2, USB: 5x USB 2.0 + 2x USB 3.1, no WLAN/BT, TPM 2.0, 2x CAN FD, Extended Termperature -25°... +85°C(Engineering Sample - get in touch with your sales)	MSC SM2S-QCS6490- FPF-47N0871E ES2 PCBES	PV
TBD7	SMARC 2.2 module with Qualcomm QCS5430 2x A78 @2.1GHz + 4x A55 @1,8GHz, 3W CPU TDP, Graphics: Adreno A642L@315Mhz, NPU: 3.5 TOPs, 2GB LPDDR5 SDRAM 6400MT/s, DP 1.4 (2 lane), eDP/DP and MIPI DSI interfaces, 2x MIPI CSI on SMARC and 0x onboard, Ethernet: 0x 1Gbit, 32GB UFS memory, PCIe: 1x PCIe Gen3 x1 + 0x PCIe Gen3 x2, USB: 2x USB 2.0 + 1x USB 3.1, no WLAN/BT, TPM 2.0, 0x CAN FD, Extended Termperature -25°... +85°C(Engineering Sample - get in touch with your sales)	MSC SM2S-QCS5430- FP1-15N0871E ES2 PCBES	OR
TBD8	SMARC 2.2 module with Qualcomm QCS6490 4x A78 @2.4/2.7GHz + 4x A55 @1,9GHz, 5W CPU TDP, Graphics: Adreno A643@812MHz, NPU: 12 TOPs, 4GB LPDDR5 SDRAM 6400MT/s, DP 1.4 (2 lane), eDP/DP and MIPI DSI interfaces, 2x MIPI CSI on SMARC and 0x onboard, Ethernet: 0x 1Gbit, 32GB UFS memory, PCIe: 1x PCIe Gen3 x1 + 0x PCIe Gen3 x2, USB: 2x USB 2.0 + 1x USB 3.1, no WLAN/BT, TPM 2.0, 0x CAN FD, Extended Termperature -25°... +85°C(Engineering Sample - get in touch with your sales)	MSC SM2S-QCS6490- FPF-25N0871E ES2 PCBES	OR

PV = Preferred variant; OR = on Request (in OEM quantities only)

Accessories

Cooling Options

Order No.	Description	Reference
115753	Passive Heatsink for all SM2S-QCS6490 and SM2S-QCS5430 DV2 modules, consisting of a single-piece aluminum pin cooler and thermal pad for contact to the processor, with 2.7mm through-hole standoffs	MSC SM2S-QCS-01 HSI-002 ES
115754	Heatspreader for all SM2S-QCS6490 and SM2S-QCS5430 DV2 modules, consisting of a single-piece aluminum plane and thermal pad for contact to the processor, with 2.7mm through-hole standoffs	MSC SM2S-QCS-01 HSP-002 ES

Carrier Options

Order No.	Description	Reference
68488	SMARC 2.0 Embedded Platform with PCI Express x4 slot, GbE, SATA, USB 3.0, USB 2.0, USB 2.0 OTG, RS232, CAN, SPI, eSPI, SMBus, I2C and GPIO interface, LVDS/eDP, DisplayPort and HDMI display interface, regulated backlight supply, HD/I2S audio interface, MIPI CSI-2 camera interface, mini PCI Express card slot, SD card slot, fan connector, CMOS battery, Mini-ITX form factor (170 x 170 mm), ATX power connector and single 12V/24V power jack, commercial temperature range 0..+70°C	MSC SM2-MB-EP1-001 PCBFTX
115138	SMARC 2.1 compatible embedded platform (146 x 80mm), 10-36V input voltage, 3x RS232, 2x CAN, dual RJ45 LAN with LED (from module), 1x M.2 2280 Key M slot, mPCIe slot, 1x USB 3.0 Type A, 1x USB 3.0/DisplayPort Type C , 1x USB 2.0 Type A, 1x USB 2.0 internal, 1x µUSB 2.0 Host/Device, 2x SPI, I²C, 12 GPIO on FC, 1x DisplayPort++ , LVDS/eDP/DSI on JILI30 connector, µSD Card Slot, regulated backlight supply, I2S Audio with amplifier, system fan connector, camera connector, RTC battery. Industrial temperature range -40..+85°C	MSC SM2S-MB-EP5-012 PCBFTX