Avnet Embedded is becoming Tria! Visit our new website here.

TRIA C6C-QCSX

Qualcomm Snapdragon® X Elite

The TRIA C6C-QCSX COM Express module features the Qualcomm Snapdragon® X Elite processor family. This highly energy-efficient processor offers best-in-class performance per watt, making it an ideal platform for applications that require outstanding performance with low power consumption and minimal cooling measures. It combines the Qualcomm Oryon™ CPU with up to twelve cores, the Adreno™ GPU driving excellent graphics throughput, and the Hexagon™ NPU accelerating AI applications with up to 45 TOPS.

With its compact board size and rich IO interfaces, the module finds its place in automation, robotics, autonomous vehicles, medical appliances and other system installations that call for a space saving solution with compelling capabilities. Up to sixty-four GB main memory based on fast LPDDR5X technology, sixteen PCI Express lanes, multiple graphics outputs, USB ports and one network interface give system architects a lot of design flexibility.

System investments are well protected through long-term availability of the module, designed and manufactured by Tria Technologies. In addition, the COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.

Highlights

  • Qualcomm Snapdragon® X Elite processor
  • Scalable CPU performance, up to twelve cores
  • Powerful Qualcomm® Adreno™ GPU
  • Qualcomm® Hexagon™ NPU with 45 TOPS of AI performance
  • LPDDR5X main memory, memory-down, up to 64GB
  • Three DisplayPort interfaces
  • LVDS / Embedded DisplayPort interface
  • PCI Express® Gen 4, up to 1×8 + 1×4/2×2
  • PCI Express® Gen 3, 2×1 + 1×2/1×1
  • Up to two USB4, four USB 3.2 Gen1/2 and eight USB 2.0 ports
  • Two UARTs
  • Up to 1TB on-board UFS Flash
  • 1 / 2.5 Gb Ethernet port, TSN support
  • Trusted Platform Module TPM 2.0
  • COM Express Type 6, Compact
  • Long-term product availability

Specs

Technology Arm
Formfactor / Interface COM Express Compact Type 6
CPU Qualcomm Snapdragon® X Elite
X1E-84-100, 12C, 4.2GHz
X1E-80-100, 12C, 4.0GHz
X1E-78-100, 12C, 3.4GHz
Qualcomm Snapdragon® X Plus
X1P-66-100, 10C, 4.0GHz
X1P-64-100, 10C, 3.4GHz
X1P-46-100, 8C, 4.0GHz
X1P-42-100, 8C, 3.4GHz
Qualcomm Snapdragon® X
X1-26-100, 8C, 2.7GHz
Chipset Integrated into SoC
RAM LPDDR5X memory, memory-down
Capacity options: 8GB, 16GB, 32GB, 64GBB
Flash Up to 1TB UFS, soldered (optional)
Storage Interfaces UFS (onboard)
NVME at PCI Express (carrier design dependent)
USB Up to 2x USB4 Gen 2, mutually exclusive with DDI 1, 2
4x USB 3.2 (Gen 1 & 2)
8x USB 2.0
Note: capabilities depending on carrier design
Serial Interfaces 2x UART
Bus Interfaces PCI Express® Gen 4, up to 1x8/(1x4) ¹ + 1x4/2x2
PCI Express® Gen 3, 2x1 + 1x2/1x1
¹ SKU dependent
Display Controller Adreno™ GPU, up to 1.5GHz
Display Interfaces Up to 3x Digital Display Interface (DP 1.4b), DDI 1, 2 mutually exclusive with USB4
Up to two USB4/USB-C ports (DP tunneling)
1x Embedded DisplayPort 1.4b, mutually exclusive with LVDS
1x LVDS 24bit, dual-channel, mutually exclusive with eDP
Network Interface 10/100/1000Base-TX, 2.5G² based on Qualcomm QPS615, with TSN support
² Available bandwidths depending on carrier design
Audio Interface SoundWire
Security Device TPM 2.0
Miscellaneous Watchdog Timer:
Initiates system reset, programmable
Fan Supply:
4-pin header for CPU fan, PWM speed controlled
and PWM speed control for system fan supported
RTC battery:
external
System Monitoring:
voltage, temperature, CPU fan, system fan
Firmware UEFI boot
OS Support Windows 11 IoT
Yocto Linux
Ubuntu Linux (on request)
Android (on request)
Power Requirement Voltage:
+8.5V to +18V, +5V Stby optional
Power Consumption:
tbd
Environment Ambient Temperature:
0° … 60°C (operating)
-25° … 85°C (storage)
Humidity:
5 … 95% (operating, non-condensing),
5 … 95% (storage, non-condensing)
Dimensions 95mm x 95mm
Certificates UL / CE

Order Info

Order No. Description Reference Status
tbd Contact Tria for ordering information MSC C6C-QCSX-xxxxx OR

PV = Preferred variant; OR = on Request (in OEM quantities only)

Accessories

Carrier Options

Order No. Description Reference
111650 COM Express Type 6 Evaluation Carrier Board with various PCI Express x1, x4 and x16 slots, USB 3.0/2.0, GbE, M.2, SD card socket, SATA, DisplayPort, LVDS, eDP, VGA, HD audio interfaces; ATX power connector. Dimensions: 305 x 244 mm (ATX form factor) MSC C6-MB-EV4 PCBFTX

Cooling Options

Order No. Description Reference
tbd Contact Tria for ordering information MSC C6C-QCSX-Hxxxx
Order No. Description Reference
79809 Fan kit for Heatsink MSC HCA-ALP/RLP-0x HSI-xxx, MSC C6B-ALP/ RLP-0x HSI-xxx, MSC C6B-TLH-0x HSI-xxx, MSC C6C-ALP/RLP-0x HSI-xxx, MSC C6C-TLU-0x HSI-xxx, MSC C6C-WLU-0x HSI-xxx, MSC C6C-ALN/ASL-0x HSI- xxx, MSC C6C-EL-0x HSI-xxx, MSC C6C-RYZx-0x HSI-xxx, PWM fan 80x80x15mm. MSC C6C-FANKIT-01- HSF-001

Support

Copyright ©2024 Avnet, Inc. All rights reserved.